Method and apparatus for forming and adhering panel and bracket structures

Patent metadata

Field	Value
Publication number	US-10137676-B2
Application number	US-201414506088-A
Country	US
Kind code	B2
Filing date	Oct 3, 2014
Priority date	Oct 4, 2013
Publication date	Nov 27, 2018
Grant date	Nov 27, 2018

Abstract

The present invention includes a method for the attachment of a bracket to a panel structure comprising providing an adhesive for attaching the bracket to the panel structure; placing the bracket in a desired location on the panel structure; heating the adhesive; and hardening the adhesive so the bracket is adhered to the panel structure.

First claim

What is claimed is:

1. A method for the attachment of a bracket to a panel structure comprising:
i. providing a reformable thermoplastic epoxy resin adhesive for attaching the bracket to the panel structure, the thermoplastic epoxy resin adhesive being incapable of forming crosslinks so that the adhesive is adapted to be reformed;
ii. placing the bracket in a desired location on the panel structure;
iii. heating the adhesive to a temperature above the glass transition temperature of the adhesive but below a melt processing temperature of 150° C.; and
iv. hardening without crosslinking the adhesive by cooling to room temperature so the bracket is adhered to the panel structure
v. heating the adhesive to a temperature above the glass transition temperature of the adhesive to remove the bracket during repair.

2. A method according to claim 1 , wherein the adhesive is applied to the bracket prior to the placing step.

3. A method according to claim 1 , wherein the adhesive is applied to the panel structure prior to the placing step.

4. A method according to claim 1 , wherein the hardening step is accomplished by cooling the adhesive with a cooling device.

5. A method according to claim 1 , wherein the adhesive is fully adhered upon cooling to ambient temperature.

6. A method according to claim 1 , wherein the heating step is performed by induction heating with metal wires on the bracket.

7. A method according to claim 1 , wherein the heating step is performed by heating metal within the adhesive or by heating metallic fillers located within the adhesive by induction.

8. A method according to claim 1 , wherein the adhesive is a hot melt adhesive.

9. A method according to claim 8 , wherein the hot melt adhesive is applied to the bracket using a hot melt pressurized gun device.

10. A method according to claim 8 , wherein the hot melt adhesive is applied to the panel using a hot melt pressurized gun device.

11. A method according to claim 1 , wherein the adhesive is formed as a film.

12. A method according to claim 11 , wherein the film is applied directly to the bracket by overmolding.

13. A method according to claim 11 , wherein the film is applied directly to the panel.

14. A method according to claim 1 , wherein the heating step is performed by infrared, ultrasonic energy, high frequency, rotational friction, infrared, heated pulse or a heated plate.

15. A method according to claim 1 , wherein hardening step occurs in less than 20 minutes after the heating step.

16. A method according to claim 1 , wherein hardening step occurs in less than 10 minutes after the heating step.

17. A method according to claim 1 , wherein hardening step occurs in less than 5 minutes after the heating step.

18. A method according to claim 1 , wherein the hardening step is exposing the adhesive to ambient temperature.

19. A method according to claim 1 , wherein the method is free of any thermoset adhesive.

Assignees

• Zephyros Inc

Inventors

• Siboni Patrick
• Blancaneaux John

Classifications

• C09J163/00

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• B32B2037/1215

  Hot-melt adhesive · CPC title

• C09J5/06

  involving heating of the applied adhesive · CPC title

• B32B37/1284 Primary

  Application of adhesive · CPC title

• F16B11/006 Primary

  by gluing (gluing of plastics material B29C65/48) · CPC title