Microrelief structural body, decorative sheet, decorative resin molded body, method for producing microrelief structural body, and method for producing decorative resin molded body

US10137661B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10137661-B2
Application numberUS-201414780698-A
CountryUS
Kind codeB2
Filing dateApr 4, 2014
Priority dateApr 5, 2013
Publication dateNov 27, 2018
Grant dateNov 27, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A structural body which comprises a base and a microrelief structure layer having a microrelief structure. The microrelief structure layer is laminated on the base so as to form the surface layer of this structural body, and the microrelief structure layer has at least one physical property selected from the group consisting of (A) and (B) described below. (A) The elastic modulus at 25° C. is 50 MPa or more, and the elastic modulus at 80° C. is 30 MPa or less. (B) The tensile elongation at break at 80° C. is from 20% to 100% (inclusive).

First claim

Opening claim text (preview).

The invention claimed is: 1. A structural body comprising a base material, and a microrelief structural layer having a microrelief structure, the microrelief structural layer being laminated on the base material as a surface layer of the structural body, and the microrelief structural layer having at least one physical property selected from the group consisting of the following (A) and (B): (A) the elastic modulus at 25° C. is 50 MPa or more, and the elastic modulus at 80° C. is 30 MPa or less; and (B) the tensile elongation at break at 80° C. is from 20% to 100%, wherein: the microrelief structural layer contains a cured product obtained by curing a curable composition, the curable composition includes at least one monomer selected from the group consisting of a monomer having one radical-polymerizable double bond (X), a monomer having two radical-polymerizable double bonds (Y), and a monomer having three or more radical-polymerizable double bonds (Z), in an amount of from 70 parts by mass to 100 parts by mass relative to 100 parts by mass of the curable components in the curable composition, the mass average molecular weight of the monomer having two radical-polymerizable double bonds (Y) is from 600 to 8000, and the value obtained by dividing the mass average molecular weight of the monomer having three or more radical-polymerizable double bonds (Z) by the number of groups having polymerizable double bonds is from 300 to 1000. 2. The structural body according to claim 1 , wherein toughness of the microrelief structural layer was determined in a tensile test at 80° C. to range from 1 kJ/m 2 to 20 kJ/m 2 . 3. The structural body according to claim 1 , wherein: the microrelief structural layer contains a cured product of a curable composition including a monomer having one radical-polymerizable double bond (X′) and a monomer having two radical-polymerizable double bonds (Y′), the total amount of the monomer having one radical-polymerizable double bond (X′) and the monomer having two radical-polymerizable double bonds (Y′) is from 50 parts by mass to 100 parts by mass relative to 100 parts by mass of the curable components in the curable composition, and the monomer having two radical-polymerizable double bonds (Y′) is a monomer having a mass average molecular weight of from 300 to 8000, and having at least one bonding selected from the group consisting of hydrogen bonding, π-π interaction, and ion bridging between the molecules of the monomer having two radical-polymerizable double bonds (Y′). 4. The structural body according to claim 1 , wherein: the monomer having two radical-polymerizable double bonds (Y) is one or more acrylates each having two radical-polymerizable double bonds, selected from the group consisting of a urethane (meth)acrylate having two radical-polymerizable double bonds, and a polyether (meth)acrylate having two radical-polymerizable double bonds; the monomer having three or more radical-polymerizable double bonds (Z) is one or more acrylates each having three or more radical-polymerizable double bonds, selected from the group consisting of a urethane (meth)acrylate having three or more radical-polymerizable double bonds, and a polyether (meth)acrylate having three or more radical-polymerizable double bonds; and the total amount of the acrylate having two radical-polymerizable double bonds and the acrylate having three or more radical-polymerizable double bonds is from 30 parts by mass to 80 parts by mass relative to 100 parts by mass of the curable components in the curable composition. 5. A sheet comprising: a resin sheet base material containing at least one resin selected from the group consisting of an acrylic resin, a polyester resin, a polycarbonate resin, an acrylonitrile-butadiene-styrene copolymer resin, a polyvinylidene fluoride resin, a vinyl chloride resin, and composites of these resins; and the structural body according to claim 1 , being laminated on at least one surface of the resin sheet base material. 6. A decorative sheet comprising the sheet according to claim 5 . 7. A molded body comprising a molded base material, and the decorative sheet according to claim 6 , the decorative sheet being brought into contact with the molded base material on the surface of the opposite side of the surface where the microrelief structure of the decorative sheet has been formed. 8. The molded body according to claim 7 , wherein at least one interval selected from the group consisting of the interval between adjacent concavities and the interval between adjacent convexities in the microrelief structure is different in two axial directions that run straight. 9. A method for producing the structural body having a microrelief structure on the surface according to claim 1 , the method including: disposing a curable composition between a base material and a surface of a mold, the mold having a microrelief structure on that surface; polymerizing the curable composition; and after the curable composition is polymerized, detaching the mold. 10. A method for producing a decorative resin molded body having a microrelief structure on the surface, the method comprising a step (A1) of obtaining a decorative resin molded body, the step (A1) including heating the decorative sheet according to claim 6 ; and pressing the heated decorative sheet against a mold by drawing a vacuum or blowing compressed air, and thereby obtaining a decorative resin molded body having a microrelief structure on the surface. 11. A method for producing a decorative resin molded body having a microrelief structure on the surface, the method comprising: a step (B1) of pressing a mold against the decorative sheet according to claim 6 while heating the decorative sheet to thereby transfer the shape of the mold to the decorative sheet, taking out from the mold the decorative sheet as a resultant of transfer of the mold shape, and thereby obtaining a decorative sheet having the mold shape transferred thereto; and a step (B2) of disposing the decorative sheet obtained in the above step (B1) such that the side where a microrelief structure has been formed is brought into contact with the surface of an injection molding die, injecting a resin material in a molten state into the injection molding die, solidifying the resin material, and thereby obtaining a decorative resin molded body having a molded base material formed of a resin material, and a decorative sheet having the surface on the opposite side of the microrelief structure and which is in contact with the molded base material. 12. A method for producing a decorative resin molded body having a microrelief structure on the surface, the method comprising: a step (C1) of disposing the decorative sheet according to claim 6 such that the side where a microrelief structure has been formed is brought into contact with an injection molding die; and a step (C2) of heating the decorative sheet inside the injection molding die, pressing a mold against the decorative sheet so that the decorative sheet conforms to the inner surface of the injection molding die, subsequently clamping the mold, injecting a resin material in a molten state into the die, solidifying the resin material, and thereby obtaining a decorative resin molded body having a molded base material formed of the solidified resin material, and a decorative sheet in which the surface of the opposite side of the side where the microrelief structure has been formed is in contact with the molded base material. 13. A method for producing a decorative resin molded body having a microrelief structure on the surface,

Assignees

Inventors

Classifications

  • the coating being applied in solid sheet form, e.g. as meltable sheet · CPC title

  • as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)} · CPC title

  • Sheets, plates, blanks or films · CPC title

  • Polymers of esters · CPC title

  • comprising acrylic (co)polymers · CPC title

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What does patent US10137661B2 cover?
A structural body which comprises a base and a microrelief structure layer having a microrelief structure. The microrelief structure layer is laminated on the base so as to form the surface layer of this structural body, and the microrelief structure layer has at least one physical property selected from the group consisting of (A) and (B) described below. (A) The elastic modulus at 25° C. is 5…
Who is the assignee on this patent?
Mitsubishi Rayon Co, Mitsubishi Chem Corp
What technology area does this patent fall under?
Primary CPC classification B32B3/30. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).