Patient support apparatus with sensor assembly

Patent metadata

Field	Value
Publication number	US-10137044-B2
Application number	US-201615151828-A
Country	US
Kind code	B2
Filing date	May 11, 2016
Priority date	May 14, 2015
Publication date	Nov 27, 2018
Grant date	Nov 27, 2018

Abstract

According to the present disclosure, a patient support system includes a patient support surface having an air fluidizable section and a sensor assembly. The sensor assembly is configured to detect a temperature within the air fluidizable section. The sensor assembly includes a housing with an interior, a processor within the interior of the housing, a thermal conductor, and a thermal insulator.

First claim

The invention claimed is:

1. A patient support system, comprising:
a patient support device including an air fluidizable section, the air fluidizable section including a basin containing fluidization material for creating a two-phase support surface for patient support by distribution of pressurized fluid through the fluidization material, and
a sensor assembly configured to detect a temperature within the air fluidizable section, the sensor assembly comprising:
a housing defining an interior space, the housing being coupled to a wall of the air fluidizable section,
a processor, the processor being positioned within the interior space of the housing,
a thermal conductor, and
a thermal insulator.

2. The patient support system of claim 1 , wherein the processor is located between the thermal conductor and the thermal insulator, within the interior space.

3. The patient support system of claim 2 , wherein the wall includes an aperture through which the housing extends.

4. The patient support system of claim 3 , wherein the processor, while being within the interior space of the housing, is positioned within the air fluidizable section of the patient support device.

5. The patient support system of claim 4 , wherein the thermal insulator contacts the processor and extends at least partially outside of the air fluidizable section.

6. The patient support system of claim 2 , further comprising a heat sink adjacent the thermal conductor.

7. The assembly of claim 1 , wherein the housing includes a first end positioned within the air fluidizable section and a second end positioned outside of the air fluidizable section, and the processor is located within the first end adjacent to each of the thermal conductor and the thermal insulator.

8. The patient support system of claim 1 , wherein the processor comprises at least one solid-state device.

9. A sensor assembly for detecting temperature of a fluid flow within an air fluidizable section for creating a two-phase support surface for patient support of a patient support system, the sensor assembly comprising:
a housing defining an interior space, the housing being coupled to a wall of the air fluidizable section of the patient support system,
a processor, the processor being positioned within the interior space of the housing,
a thermal conductor, and
a thermal insulator.

10. The assembly of claim 9 , wherein the wall is a bottom portion of the air fluidizable section.

11. The assembly of claim 9 , wherein the processor is located between the thermal conductor and the thermal insulator, within the interior space of the housing.

12. The assembly of claim 11 , wherein the wall includes an aperture through which the housing extends.

13. The assembly of claim 12 , wherein the processor, while being within the interior space of the housing, is positioned within the air fluidizable section of the patient support device.

14. The assembly of claim 13 , wherein the thermal insulator contacts the processor and extends at least partially outside of the air fluidizable section.

15. The assembly of claim 11 , further comprising a heat sink adjacent the thermal conductor.

16. The assembly of claim 9 , wherein the housing includes a first end positioned within the air fluidizable section and a second end positioned outside of the air fluidizable section, and the processor is located within the first end adjacent to each of the thermal conductor and the thermal insulator.

17. The assembly of claim 9 , wherein the processor comprises at least one solid-state device.

Assignees

• Hill Rom Services Inc

Inventors

• Fisk Brandon P
• Johannigman Nicole
• Hoffman Brian J
• Sauser Frank E
• Grace Jason B
• Bedel David L
• Kirkish Brian A
• Gilreath Jason M

Classifications

• G01K1/16

  Special arrangements for conducting heat from the object to the sensitive element · CPC title

• A61G7/05746 Primary

  fluidised by air flow · CPC title

• A61G2203/46

  for temperature · CPC title