Surface acoustic wave device

Patent metadata

Field	Value
Publication number	US-10135419-B2
Application number	US-201615375360-A
Country	US
Kind code	B2
Filing date	Dec 12, 2016
Priority date	Dec 24, 2015
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

A surface acoustic wave device includes a piezoelectric substrate, an IDT electrode, support layers, and a cover layer. A distance from a first end of a first partition-support layer to one of the outer-periphery-frame support layers closest to the first end is smaller than a distance from a second end of the first partition-support layer to one of the outer-periphery-frame support layers closest to the second end, and a distance from a first end of a second partition-support layer to one of the outer-periphery-frame support layers closest to the first end is larger than a distance from a second end of the second partition-support layer to one of the outer-periphery-frame support layers closest to the second end.

First claim

What is claimed is:

1. A surface acoustic wave device comprising:
a piezoelectric substrate;
an interdigital transducer electrode that is disposed on a main surface of the piezoelectric substrate and that excites a surface acoustic wave;
support layers each of which is vertically arranged in a region of the main surface of the piezoelectric substrate other than a region in which the interdigital transducer electrode is disposed, and each of the support layers has a height larger than a height of the interdigital transducer electrode; and
a cover layer that is disposed on the support layers and that covers the interdigital transducer electrode with a hollow space interposed between the cover layer and the interdigital transducer electrode; wherein
the support layers include:
a plurality of outer-periphery-frame support layers that are vertically arranged on the main surface of the piezoelectric substrate around a periphery of the region in which the interdigital transducer electrode is disposed; and
a plurality of partition-support layers each of which is vertically arranged in a region of the main surface, the region being surrounded by the outer-periphery-frame support layers, the plurality of partition-support layers extending, when the piezoelectric substrate is viewed in plan, straight or substantially straight in a first direction, which is parallel or substantially parallel to the main surface, and being arranged in a second direction parallel or substantially parallel to the main surface and perpendicular or substantially perpendicular to the first direction; and

the plurality of partition-support layers include a first partition-support layer and a second partition-support layer that are adjacent to each other in an arrangement of the plurality of partition-support layers and that have a characteristic described below:
when the piezoelectric substrate is viewed in plan, where an end of the first partition-support layer and an end of the second partition-support layer that are oriented in the first direction are referred to as first ends, and another end of the first partition-support layer and another end of the second partition-support layer that are oriented in a direction opposite to the first direction are referred to as second ends, a distance from the first end of the first partition-support layer to one of the outer-periphery-frame support layers that is closest to the first end of the first partition-support layer is smaller than a distance from the second end of the first partition-support layer to one of the outer-periphery-frame support layers that is closest to the second end of the first partition-support layer, and a distance from the first end of the second partition-support layer to one of the outer-periphery-frame support layers that is closest to the first end of the second partition-support layer is larger than a distance from the second end of the second partition-support layer to one of the outer-periphery-frame support layers that is closest to the second end of the second partition-support layer.

2. The surface acoustic wave device according to claim 1 , wherein a portion of the first partition-support layer and a portion of the second partition-support layer are superposed with each other when viewed from the second direction.

3. The surface acoustic wave device according to claim 2 , wherein a region in which the portion of the first partition-support layer and the portion of the second partition-support layer are superposed with each other has a length of about 30 μm or smaller in the first direction.

4. The surface acoustic wave device according to claim 1 , wherein the first partition-support layer and the second partition-support layer are separated from each other by a predetermined distance in the first direction when viewed from the second direction.

5. The surface acoustic wave device according to claim 4 , wherein the predetermined distance is about 30 μm or smaller.

6. The surface acoustic wave device according to claim 1 , further comprising solder bumps exposed at an outer surface of the cover layer.

7. The surface acoustic wave device according to claim 1 , wherein the interdigital electrode defines a transmission filter.

8. The surface acoustic wave device according to claim 1 , wherein the interdigital electrode defines a reception filter.

9. The surface acoustic wave device according to claim 1 , wherein the interdigital electrode defines a duplexer.

10. The surface acoustic wave device according to claim 1 , wherein the piezoelectric substrate is made of a piezoelectric single crystal.

11. The surface acoustic wave device according to claim 10 , wherein the piezoelectric single crystal is one of lithium tantalate, lithium niobate, and quartz crystal.

12. The surface acoustic wave device according to claim 1 , wherein the interdigital electrode is made of Ti, Al, Cu, Au, Pt, Ag, Pd, or Ni, or an alloy thereof.

13. The surface acoustic wave device according to claim 1 , wherein the interdigital electrode is covered by a protective film made of a dielectric material.

14. The surface acoustic wave device according to claim 1 , wherein the support layers are made of a material including at least one of a polyimide, an epoxy resin, benzocyclobutene, polybenzoxazole, a metal, and silicon oxide.

15. The surface acoustic wave device according to claim 1 , wherein the plurality of partition-support layers do not extend to any of the outer-periphery-frame support layers.

16. The surface acoustic wave device according to claim 1 , wherein the cover layer has a multilayer structure including a lower layer that is made of a material including at least one of an epoxy resin, urethane, phenol, a polyester, benzocyclobutene, and polybenzoxazole and an upper layer that is made of a material including at least one of a polyimide, an epoxy resin, benzocyclobutene, polybenzoxazole, silicon, a silicon oxide, lithium tantalate, and lithium niobate.

17. The surface acoustic wave device according to claim 1 , further comprising:
a reception filter;
a transmission filter;
an intermediate region disposed between the reception filter and the transmission filter; wherein
the reception filter and the transmission filter are defined by the interdigital transducer electrode.

18. The surface acoustic wave device according to claim 17 , wherein the first partition-support layer and the second partition-support layer are disposed in the intermediate region.

Assignees

• Murata Manufacturing Co

Inventors

• Hirano Yasuhiko
• Sekiya Daisuke

Classifications

• H03H9/1092

  the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's · CPC title

• H03H9/0576 Primary

  including surface acoustic wave [SAW] devices · CPC title

• H03H9/1064

  for surface acoustic wave [SAW] devices · CPC title

• H03H9/02897

  of strain or mechanical damage, e.g. strain due to bending influence · CPC title

• H03H9/059

  consisting of mounting pads or bumps · CPC title