Photoelectric conversion element and solar cell module provided with same

US10134928B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10134928-B2
Application numberUS-201515116926-A
CountryUS
Kind codeB2
Filing dateJan 20, 2015
Priority dateFeb 10, 2014
Publication dateNov 20, 2018
Grant dateNov 20, 2018

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  5. First independent claim

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Abstract

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There is provided a photoelectric conversion element which includes an n-type single crystal silicon substrate ( 1 ). The n-type single crystal silicon substrate ( 1 ) includes a central region ( 11 ) and an end-portion region ( 12 ). The central region ( 11 ) is a region which has the same central point as the central point of the n-type single crystal silicon substrate ( 1 ) and is surrounded by a circle. The diameter of the circle is set to be a length which is 40% of a length of the shortest side among four sides of the n-type single crystal silicon substrate ( 1 ). The central region ( 11 ) has a thickness t 1 . The end-portion region ( 12 ) is a region of being within 5 mm from an edge of the n-type single crystal silicon substrate ( 1 ). The end-portion region ( 12 ) is disposed on an outside of the central region ( 11 ) in an in-plane direction of the n-type single crystal silicon substrate ( 1 ), and has a thickness t 2 which is thinner than the thickness t 1 . The end-portion region ( 12 ) has average surface roughness which is smaller than average surface roughness of the central region ( 11 ).

First claim

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The invention claimed is: 1. A photoelectric conversion element comprising: a silicon substrate, the silicon substrate having four sides; wherein the silicon substrate includes a central region, and an end-portion region which is disposed on an outside of the central region of the silicon substrate in an in-plane direction, the central region is a circular region concentric to the silicon substrate, a diameter of the central region is 40% of a length of a shortest side among the four sides of the silicon substrate, the end-portion region is a region within 5 mm from an edge of the silicon substrate, a thickness of the end-portion region is thinner than a thickness of the central region, and average surface roughness of the end-portion region is smaller than average surface roughness of the central region. 2. The photoelectric conversion element according to claim 1 , further comprising: a first amorphous semiconductor layer which is disposed so as to be in contact with one surface of the silicon substrate and has substantially an i-conductive type; a second amorphous semiconductor layer which is disposed so as to be in contact with the first amorphous semiconductor layer and has a first conductive type; a third amorphous semiconductor layer which is disposed so as to be in contact with a surface on an opposite side of the one surface of the silicon substrate, and has substantially an i-conductive type; and a fourth amorphous semiconductor layer which is disposed so as to be in contact with the third amorphous semiconductor layer, and has a second conductive type which is opposite to the first conductive type. 3. The photoelectric conversion element according to claim 1 , further comprising: a first amorphous semiconductor layer which is disposed so as to be in contact with a light-receiving surface of the silicon substrate; a second amorphous semiconductor layer which is disposed so as to be in contact with a surface of the silicon substrate on an opposite side of the light-receiving surface, and has substantially an i-conductive type; a third amorphous semiconductor layer which is disposed so as to be in contact with the surface of the silicon substrate on the opposite side of the light-receiving surface and to be adjacent to the second amorphous semiconductor layer in the in-plane direction of the silicon substrate, and has substantially an i-conductive type; a fourth amorphous semiconductor layer which is disposed so as to be in contact with the second amorphous semiconductor layer and has a conductive type which is opposite to a conductive type of the silicon substrate; and a fifth amorphous semiconductor layer which is disposed so as to be in contact with the third amorphous semiconductor layer and has the same conductive type as the conductive type of the silicon substrate. 4. The photoelectric conversion element according to claim 1 , further comprising: an antireflection coat which is disposed so as to be in contact with a light-receiving surface of the silicon substrate, wherein the silicon substrate includes a first diffusion layer which is disposed so as to be in contact with a surface on an opposite side of the light-receiving surface, and has a conductive type which is opposite to a conductive type of the silicon substrate, and a second diffusion layer which is disposed so as to be in contact with the surface on the opposite side of the light-receiving surface and to be adjacent to the first diffusion layer in the in-plane direction of the silicon substrate, and has the same conductive type as the conductive type of the silicon substrate. 5. The photoelectric conversion element according to claim 1 , further comprising: an antireflection coat which is disposed so as to be in contact with a light-receiving surface of the silicon substrate, wherein the silicon substrate includes a first diffusion layer which is disposed so as to be in contact with the light-receiving surface of the silicon substrate, and has the same conductive type as the conductive type of the silicon substrate, and a second diffusion layer which is disposed so as to be in contact with a surface of the silicon substrate on an opposite side of the light-receiving surface, and has a conductive type which is opposite to the conductive type of the silicon substrate. 6. A photoelectric conversion module comprising: the photoelectric conversion element according to claim 1 . 7. A photovoltaic power generation system comprising: the photoelectric conversion module according to claim 6 .

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What does patent US10134928B2 cover?
There is provided a photoelectric conversion element which includes an n-type single crystal silicon substrate ( 1 ). The n-type single crystal silicon substrate ( 1 ) includes a central region ( 11 ) and an end-portion region ( 12 ). The central region ( 11 ) is a region which has the same central point as the central point of the n-type single crystal silicon substrate ( 1 ) and is surrounded…
Who is the assignee on this patent?
Sharp Kk
What technology area does this patent fall under?
Primary CPC classification H01L31/02363. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 20 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).