Method of manufacturing case frame and electronic device having it

Patent metadata

Field	Value
Publication number	US-10133309-B2
Application number	US-201414290194-A
Country	US
Kind code	B2
Filing date	May 29, 2014
Priority date	May 31, 2013
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

A method of manufacturing a case frame is provided. The method includes forming a mold for forming an ultraviolet molding pattern layer, laminating a hard coating layer on a transfer resin film, laminating an ultraviolet molding pattern layer on the hard coating layer, laminating a deposition layer on the ultraviolet molding pattern layer, laminating a printing layer on the deposition layer, and performing transfer IMD on an injection product using a transfer resin film, on which the printing layer, the deposition layer, the ultraviolet molding pattern layer, and the hard coating layer are successively laminated.

First claim

What is claimed is:

1. A method of manufacturing a case frame, the method comprising:
forming a mold for forming an ultraviolet molding pattern layer;
laminating a hard coating layer on a transfer resin film, wherein the hard coating layer has an auxiliary pattern which is formed by a separate mold and is cured by ultraviolet rays, and wherein the separate mold is distinct from the mold;
laminating the ultraviolet molding pattern layer on the hard coating layer;
laminating a deposition layer on the ultraviolet molding pattern layer;
laminating a printing layer on the deposition layer; and
performing a transfer of insert mold decoration (IMD) on an injection product using the transfer resin film, on which the printing layer, the deposition layer, the ultraviolet molding pattern layer, and the hard coating layer are successively laminated,
wherein the hard coating layer is finally disposed on a most external surface of an injection product after the transfer IMD and is configured to protect the ultraviolet molding pattern layer,
wherein the ultraviolet molding pattern layer is formed with a thickness in a range of 8 μm to 12 μm, and
wherein the deposition layer is formed with a thickness of 1 μm or less.

2. The method of claim 1 , further comprising laminating a primary layer between the printing layer and the deposition layer for printing the printing layer.

3. The method of claim 2 , wherein the primary layer is formed of one or more of an olefin series, an acrylic series, and a urethane series.

4. The method of claim 1 , wherein the transfer resin film comprises:
the ultraviolet molding pattern layer which is formed by laminating a pattern formed by an ultraviolet pattern mold on the hard coating layer;
the deposition layer used as a background of the ultraviolet molding pattern layer and formed on the ultraviolet molding pattern layer;
the printing layer used to implement a color of the case frame and formed on a rear surface of the deposition layer; and
an adhesive layer which is laminated on the printing layer to easily adhere to the injection product in the transfer IMD.

5. The method of claim 4 , wherein the auxiliary pattern is formed on at least one of a first surface facing the ultraviolet molding pattern layer of the hard coating layer and a second surface which is opposite to the first surface of the hard coating layer.

6. The method of claim 1 , wherein the mold for forming the ultraviolet molding pattern layer has a roll type or a panel type.

7. The method of claim 1 , further comprising laminating a mold release layer between the transfer resin film and the hard coating layer for smoothly peeling off the transfer resin film from the hard coating layer.

8. The method of claim 1 , wherein the auxiliary pattern is formed on at least one of a first surface facing the ultraviolet molding pattern layer of the hard coating layer and a second surface which is opposite to the first surface of the hard coating layer.

9. The method of claim 1 , wherein the hard coating layer is formed of a film type of Polyethylene Terephthalate (PET) or Polycarbonate (PC), or a cured photopolymerizable resin.

10. The method of claim 1 , further comprising laminating an adhesive layer between the injection product and the printing layer for adhering the injection product with the printing layer.

11. The method of claim 1 , wherein the hard coating layer is formed with a thickness in a range of 3 μm to 5 μm.

12. The method of claim 1 , wherein the transfer resin film comprises:
the ultraviolet molding pattern layer formed by laminating a pattern formed by an ultraviolet pattern mold on the hard coating layer;
the deposition layer used as a background of the ultraviolet molding pattern layer on the ultraviolet molding pattern layer;
a primary layer which is laminated on the deposition layer for smooth printing;
the printing layer used to implement a color of a case frame on the primary layer; and
an adhesive layer which is laminated on the printing layer to easily adhere to the injection product in the transfer IMD.

Assignees

• Samsung Electronics Co Ltd
• Samsung Electonics Co Ltd

Inventors

• Chang Min-Su

Classifications

• B32B2037/243

  Coating · CPC title

• B32B37/14

  characterised by the properties of the layers · CPC title

• B29L2031/3437

  Cellular phones · CPC title

• Y10T428/24851

  Intermediate layer is discontinuous or differential · CPC title

• B32B37/12

  characterised by using adhesives · CPC title