Photosensitive resin composition, cured product and method for producing same, method for producing resin pattern, cured film, liquid crystal display device, organic el display device, infrared cut filter, and solid-state imaging device

Patent metadata

Field	Value
Publication number	US-10133175-B2
Application number	US-201615209870-A
Country	US
Kind code	B2
Filing date	Jul 14, 2016
Priority date	Feb 20, 2014
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

Provided are a photosensitive resin composition from which a cured product having a thin film thickness, excellent light-shielding properties, and a high surface hardness is obtained; as well as a cured product obtained by curing the photosensitive resin composition, a cured film and a method for producing the same, a method for producing a resin pattern, and a liquid crystal display device, an organic EL display device, an infrared cut filter, or a solid-state imaging device, each having the cured film. The photosensitive resin composition of the present invention includes (Component A) a polymer having a constitutional unit containing a group in which an acid group is protected by an acid-decomposable group; (Component B) a photoacid generator; (Component C) a solvent; (Component D) a compound having a crosslinkable group and a molecular weight in the range of 100 to 2,000; and (Component S) titanium black.

First claim

What is claimed is:

1. A photosensitive resin composition comprising:
(Component A) a polymer having a constitutional unit containing a group in which an acid group is protected by an acid-decomposable group;
(Component B) a photoacid generator;
(Component C) a solvent;
(Component D) a compound having a crosslinkable group and a molecular weight in the range of 100 to 2,000;
(Component E) a dispersant; and
(Component S) titanium black,
wherein Component E comprises a polymer dispersant having an acid group in the side chain.

2. The photosensitive resin composition according to claim 1 , wherein the crosslinkable group is at least one selected from the group consisting of an epoxy group, an oxetanyl group, an alkoxymethyl group, a methylol group, a blocked isocyanate group, and a group having an ethylenically unsaturated bond.

3. The photosensitive resin composition according to claim 1 , wherein the crosslinkable group equivalent in the photosensitive resin composition is 100 to 1,000 per 1 g of organic solid content.

4. The photosensitive resin composition according to claim 1 , wherein the content of Component S is 40 mass % to 80 mass % based on the total solid content of the photosensitive resin composition.

5. The photosensitive resin composition according to claim 1 , wherein the crosslinkable group is at least one selected from the group consisting of an epoxy group, an oxetanyl group, and a (meth)acryloxy group.

6. The photosensitive resin composition according to claim 1 , wherein Component B is an oxime sulfonate compound.

7. A method for producing a cured product, comprising in this order:
applying the photosensitive resin composition according to claim 1 onto a substrate;
removing a solvent from the applied resin composition; and
heat-treating the resin composition freed from the solvent, or irradiating the resin composition freed from the solvent with actinic rays.

8. A method for producing a resin pattern, comprising in this order:
applying the photosensitive resin composition according to claim 1 onto a substrate;
removing a solvent from the applied resin composition;
patternwise exposing the resin composition freed from the solvent to actinic rays; and
developing the exposed resin composition and the unexposed resin composition with an aqueous developer.

9. A photosensitive resin composition comprising:
(Component A) a polymer having a constitutional unit containing a group in which an acid group is protected by an acid-decomposable group;
(Component B) a photoacid generator;
(Component C) a solvent;
(Component D) a compound having a crosslinkable group and a molecular weight in the range of 100 to 2,000; and
(Component S) titanium black,
wherein the crosslinkable group equivalent in the photosensitive resin composition is 100 to 550 per 1 g of organic solid content.

10. The photosensitive resin composition according to claim 9 , wherein the crosslinkable group is at least one selected from the group consisting of an epoxy group, an oxetanyl group, an alkoxymethyl group, a methylol group, a blocked isocyanate group, and a group having an ethylenically unsaturated bond.

11. The photosensitive resin composition according to claim 9 , further comprising (Component E) a dispersant.

12. The photosensitive resin composition according to claim 9 , wherein the content of Component S is 40 mass % to 80 mass % based on the total solid content of the photosensitive resin composition.

13. The photosensitive resin composition according to claim 9 , wherein the crosslinkable group is at least one selected from the group consisting of an epoxy group, an oxetanyl group, and a (meth)acryloxy group.

14. The photosensitive resin composition according to claim 9 , wherein Component B is an oxime sulfonate compound.

15. A method for producing a cured product, comprising in this order:
applying the photosensitive resin composition according to claim 9 onto a substrate;
removing a solvent from the applied resin composition; and
heat-treating the resin composition freed from the solvent, or irradiating the resin composition freed from the solvent with actinic rays.

16. A method for producing a resin pattern, comprising in this order:
applying the photosensitive resin composition according to claim 9 onto a substrate;
removing a solvent from the applied resin composition;
patternwise exposing the resin composition freed from the solvent to actinic rays; and
developing the exposed resin composition and the unexposed resin composition with an aqueous developer.

17. A photosensitive resin composition comprising:
(Component A) a polymer having a constitutional unit containing a group in which an acid group is protected by an acid-decomposable group;
(Component B) a photoacid generator;
(Component C) a solvent;
(Component D) a compound having a crosslinkable group and a molecular weight in the range of 100 to 2,000; and
(Component S) titanium black,
wherein the average primary particle diameter of Component S is in the range of from 10 nm to 100 nm, and
the specific surface area of Component S is from 20 m 2 /g to 100 m 2 /g.

18. The photosensitive resin composition according to claim 17 , wherein the crosslinkable group is at least one selected from the group consisting of an epoxy group, an oxetanyl group, an alkoxymethyl group, a methylol group, a blocked isocyanate group, and a group having an ethylenically unsaturated bond.

19. The photosensitive resin composition according to claim 17 , wherein the crosslinkable group equivalent in the photosensitive resin composition is 100 to 1,000 per 1 g of organic solid content.

20. The photosensitive resin composition according to claim 17 , further comprising (Component E) a dispersant.

21. The photosensitive resin composition according to claim 17 , wherein the content of Component S is 40 mass % to 80 mass % based on the total solid content of the photosensitive resin composition.

22. The photosensitive resin composition according to claim 17 , wherein the crosslinkable group is at least one selected from the group consisting of an epoxy group, an oxetanyl group, and a (meth)acryloxy group.

23. The photosensitive resin composition according to claim 17 , wherein Component B is an oxime sulfonate compound.

24. A method for producing a cured product, comprising in this order:
applying the photosensitive resin composition according to claim 17 onto a substrate;
removing a solvent from the applied resin composition; and
heat-treating the resin composition freed from the solvent, or irradiating the resin composition freed from the solvent with actinic rays.

25. A method for producing a resin pattern, comprising in this order:
applying the photosensitive resin composition according to claim 17 onto a substrate;
removing a solvent from the applied resin composition;
patternwise exposing the resin composition freed from the solvent to actinic rays; and
developing the exposed resin composition and the unexposed resin composition with an aqueous developer.

Assignees

• Fujifilm Corp

Inventors

• Kashiwagi Daisuke
• Andou Takeshi
• Yamada Satoru
• Kawabe Yasumasa
• Tomeba Hisamitsu

Classifications

• C08F212/22

  Oxygen · CPC title

• G02B5/282

  reflecting for infrared and transparent for visible light, e.g. heat reflectors, laser protection · CPC title

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title

• C08F220/365

  containing further carboxylic moieties · CPC title

• G03F7/0397

  the macromolecular compound having an alicyclic moiety in a side chain · CPC title