Heat conduction member, production method for heat conduction member, and heat conduction structure

Patent metadata

Field	Value
Publication number	US-10132575-B2
Application number	US-201715471336-A
Country	US
Kind code	B2
Filing date	Mar 28, 2017
Priority date	Mar 28, 2016
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

The heat conduction member comprises a laminate formed by laminating a resin layer and a metal layer. The resin layer is formed from a thermally conductive resin material. The thickness of the laminate is smaller at the peripheral edge of the laminate than in the center portion of the laminate, and the thickness of the laminate is greater in the intermediate portion of the laminate than in the center portion of the laminate. An inclined surface is formed on the laminate so as to form a falling gradient from the intermediate portion toward the peripheral edge.

First claim

What is claimed is:

1. A heat conduction member comprising:
a laminate formed by laminating a resin layer and a metal layer;
the resin layer being formed from a thermally conductive resin material prepared by forming a compound from a thermally conductive filler added to a resin material serving as a base material;
a thickness of the laminate being smaller at a peripheral edge of the laminate than in a center portion of the laminate;
a thickness of the laminate being greater in an intermediate portion between the center portion and the peripheral edge of the laminate than in the center portion of the laminate; and
an inclined surface being formed in a range from the intermediate portion to the peripheral edge of the laminate so as to form a falling gradient from the intermediate portion toward the peripheral edge while the metal layer side faces upward.

2. The heat conduction member according to claim 1 , wherein
the hardness of the resin layer is not less than 5 and not greater than 40 in terms of Asker C hardness;
the thickness of the metal layer is not less than 100 μm and not greater than 500 μm; and
the thickness of the resin layer in the center portion of the laminate is not less than 1 mm and not greater than 3 mm.

3. The heat conduction member according to claim 1 , wherein the laminate is configured so that a face on the resin layer side is flat, and the inclined surface is configured so as to form a slope of not less than 20 degrees and not greater than 50 degrees with respect to the face formed into a flat shape.

4. The heat conduction member according to claim 1 , wherein the metal layer is formed from aluminum or an aluminum alloy.

5. A production method for a heat conduction comprising:
a first step of producing a composite sheet by laminating a resin sheet formed from a thermally conductive resin material prepared by forming a compound from a thermally conductive filler added to a resin material serving as a base material, a thickness being not less than 1 mm and not greater than 3 mm, and a hardness of the sheet being not less than 5 and not greater than 40 in terms of Asker C hardness, and a metal sheet having a thickness of not less than 100 μm and not greater than 500 μm; and
a second step of producing a plurality of laminates by pressing a blade into the composite sheet toward the lamination direction from the metal sheet side and cutting the composite sheet so that each laminate has a structure in which the resin layer and the metal layer are laminated;
in the second step, a thickness of the laminate being smaller at a peripheral edge of the laminate than in a center portion of the laminate;
a thickness of the laminate being greater in an intermediate portion between the center portion and the peripheral edge of the laminate than in the center portion of the laminate; and
an inclined surface being formed in a range from the intermediate portion to the peripheral edge of the laminate so as to form a falling gradient from the intermediate portion toward the peripheral edge while the metal layer side faces upward.

6. A heat conduction structure comprising:
a first member having a heat-generating part on at least one face thereof, and a heat conduction member attached to the first member so as to make contact with the heat-generating part;
the heat conduction member comprising a laminate formed by laminating a resin layer and a metal layer;
the resin layer being formed from a thermally conductive resin material prepared by forming a compound from a thermally conductive filler added to a resin material serving as a base material;
the heat conduction member being configured so as to make contact with the heat-generating part and the first member on a resin layer side and so that it can make contact with a second member on a metal layer side;
the heat conduction member having a shape so that, when the metal layer side faces upward while the heat conduction member is attached to the first member, a peripheral edge of the laminate is disposed at a position lower than a center portion of the laminate, and an intermediate portion between the center portion and the peripheral edge of the laminate is disposed at a higher position than the center portion of the laminate; and
an inclined surface being formed in a range from the intermediate portion to the peripheral edge of the laminate so as to form a falling gradient from the intermediate portion of the laminate toward the peripheral edge while the metal layer side faces upward.

7. The heat conduction member according to claim 2 , wherein the laminate is configured so that the face on the resin layer side is flat, and the inclined surface is configured so as to form a slope of not less than 20 degrees and not greater than 50 degrees with respect to the face formed into a flat shape.

8. The heat conduction member according to claim 2 , wherein the metal layer is formed from aluminum or an aluminum alloy.

9. The heat conduction member according to claim 3 , wherein the metal layer is formed from aluminum or an aluminum alloy.

10. The heat conduction member according to claim 7 , wherein the metal layer is formed from aluminum or an aluminum alloy.

Assignees

• Kitagawa Ind Co Ltd

Inventors

• Mizuno Takashi
• Yumi Hideo

Classifications

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/251

  Organics · CPC title

• H10W74/114 Primary

  by a substrate and the encapsulations · CPC title

• F28F21/089

  Coatings, claddings or bonding layers made from metals or metal alloys (F28F19/06 takes precedence) · CPC title