Degradable polymeric compositions and articles comprising same
US-2024425683-A1 · Dec 26, 2024 · US
Preparation of large ultra-thin free-standing polymer films
US10131754B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10131754-B2 |
| Application number | US-201615130524-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 15, 2016 |
| Priority date | Apr 21, 2015 |
| Publication date | Nov 20, 2018 |
| Grant date | Nov 20, 2018 |
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Abstract
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A method of making large ultrathin free-standing polymer films without use of a sacrificial layer includes the steps of providing a substrate, applying a polyelectrolyte material to said substrate, applying a polymer material onto said substrate and onto said polyelectrolyte material, and directly delaminating said polymer material from said substrate and said polyelectrolyte to produce the ultrathin free-standing polymer film.
First claim
Opening claim text (preview).
The claims are: 1. A method of producing an ultrathin free-standing polymer film, comprising the steps of: providing a substrate, applying a polyelectrolyte material to said substrate, applying a polymer material onto said substrate and onto said polyelectrolyte material, and directly delaminating said polymer material from said substrate and said polyelectrolyte to produce the ultrathin free-standing polymer film. 2. The method of producing an ultrathin free-standing polymer film of claim 1 wherein said step of applying a polyelectrolyte material to said substrate comprises applying a polycation to said substrate. 3. The method of producing an ultrathin free-standing polymer film of claim 1 wherein said step of applying a polyelectrolyte material to said substrate comprises applying polydiallyldimethylammonium chloride to said substrate. 4. The method of producing an ultrathin free-standing polymer film of claim 1 wherein said step of providing a substrate comprises providing a silicon substrate. 5. The method of producing an ultrathin free-standing polymer film of claim 1 wherein said step of providing a substrate comprises providing a silicon wafer substrate. 6. The method of producing an ultrathin free-standing polymer film of claim 1 further comprising the step of applying a marker to said polymer material. 7. The method of producing an ultrathin free-standing polymer film of claim 1 wherein said step of directly delaminating said polymer material from said substrate and said polyelectrolyte to produce the ultrathin free-standing polymer film comprises immersing said substrate with said polymer material on said polyelectrolyte material and on said substrate into water and directly delaminating said polymer material to produce the ultrathin free-standing polymer film. 8. The method of producing an ultrathin free-standing polymer film of claim 7 further comprising the step of collecting said ultrathin free-standing polymer film from said water using a holder.
Assignees
Inventors
Classifications
comprising synthetic resins not wholly covered by any one of the sub-groups {B32B27/30 - B32B27/42} · CPC title
Other inorganic substrates, e.g. ceramics, silicon · CPC title
Homopolymers or copolymers of methyl methacrylate · CPC title
Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols · CPC title
Moistening · CPC title
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- What does patent US10131754B2 cover?
- A method of making large ultrathin free-standing polymer films without use of a sacrificial layer includes the steps of providing a substrate, applying a polyelectrolyte material to said substrate, applying a polymer material onto said substrate and onto said polyelectrolyte material, and directly delaminating said polymer material from said substrate and said polyelectrolyte to produce the ult…
- Who is the assignee on this patent?
- L Livermore Nat Security Llc, General Atomics
- What technology area does this patent fall under?
- Primary CPC classification C08J5/18. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Nov 20 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).