Method of molding a thermoplastic resin article and apparatus for molding same

Patent metadata

Field	Value
Publication number	US-10131087-B2
Application number	US-201414483768-A
Country	US
Kind code	B2
Filing date	Sep 11, 2014
Priority date	Mar 22, 2012
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

Aimed at providing a method for molding a thermoplastic resin product and a molding apparatus therefor that enable productivity, transfer quality or the like to be improved. Provided is a method for molding a thermoplastic resin product that includes a heating step, a transfer step, a cooling step and a mold-releasing step, and wherein, in the heating step, a stamper is irradiated with infrared rays in a state where a cooling member is not irradiated with infrared rays, and at least in the final stage of the transfer step, the stamper and the cooling member are brought into contact.

First claim

The invention claimed is:

1. A method for molding a thermoplastic resin product comprising:
heating a stamper with infrared rays emitted from a heating apparatus through an irradiation path;
transferring a structure of a shape-forming surface of the heated stamper to a transfer surface of a thermoplastic resin;
cooling the stamper by bringing the stamper into contact with a cooling member, wherein the thermoplastic resin is cooled through the stamper to solidify or harden the thermoplastic resin; and
releasing the transfer surface from the shape-forming surface to allow a molded product to be released from the stamper, wherein
in the heating, the stamper is irradiated with the infrared rays in a state where the cooling member is retreated from the irradiation path, and
at least in the final stage of the transferring, the cooling member is placed in the irradiation pathway, the stamper is brought into contact with the cooling member, and the cooling starts.

2. The method for molding the thermoplastic resin product according to claim 1 , wherein, the cooling starts after the transferring is initiated.

3. The method for molding the thermoplastic resin product according to claim 1 , wherein the transferring is conducted by using only heat stored by the stamper in the heating.

4. The method for molding the thermoplastic resin product according to claim 1 , wherein the stamper is radiatingly heated in the transferring.

5. The method for molding, the thermoplastic resin product according to claim 1 , wherein, in the transferring, the stamper is energized in the direction of the thermoplastic resin and/or the stamper is pulled in an outward direction.

6. The method for molding the thermoplastic resin product according to claim 1 , wherein, in the heating, the stamper is held in a state of point contact and/or line contact.

7. The method for molding the thermoplastic resin product according to claim 1 , wherein the transferring is conducted by the stamper that is held in a state where it is remote from the cooling member.

8. The method for molding the thermoplastic resin product according to claim 7 , wherein, in the transferring, the stamper is held in a state where it is remote from the cooling member by applying a pressure to a gap between the cooling member and the stamper.

Assignees

• Toyo Seikan Group Holdings Ltd

Inventors

• Kimura Satoo
• Aoya Masaki
• Iwasaki Tsutomu

Classifications

• B29C59/16 Primary

  by wave energy or particle radiation {, e.g. infrared heating (B29C59/007 takes precedence)} · CPC title

• B29C2059/023

  Microembossing · CPC title

• B29D11/00269

  Fresnel lenses · CPC title

• B29C2043/522

  selectively heating a part of the mould to achieve partial heating, differential heating · CPC title

• B29C2035/1616

  using liquids · CPC title