Immersion cooling systems and methods

Patent metadata

Field	Value
Publication number	US-10130008-B2
Application number	US-201615090236-A
Country	US
Kind code	B2
Filing date	Apr 4, 2016
Priority date	Apr 4, 2016
Publication date	Nov 13, 2018
Grant date	Nov 13, 2018

Abstract

An immersion cooled electronic arrangement includes a sealed housing, a coolant contained within the housing, and an electronic device submerged within the coolant. An agitator is disposed within the housing to control passive heat transfer between the electronic device and the coolant. An immersion cooling system and related method are also described.

First claim

What is claimed is:

1. An immersion cooled electronic arrangement, comprising:
a sealed housing;
a coolant contained within the housing;
an electronic device submerged within the coolant;
an agitator disposed within the housing;
a control module operatively connected to the agitator, the agitator is configured to control heat transfer between the electronic device and the coolant, the control module being responsive to non-transitory machine-readable instructions to control heat transfer between the electronic device and the coolant; and
a sensor disposed within the housing, the sensor being adapted and configured to provide a signal including information relating to a heat transfer coefficient and critical heat flux between the electronic device and the coolant,
wherein the instructions cause the control module to:
determine a heat transfer coefficient between the electronic device and the coolant;
compare the determined heat transfer coefficient with a predetermined heat transfer coefficient; and
actuate the agitator based on the comparison of the determined heat transfer coefficient and the predetermined heat transfer coefficient.

2. The immersion cooled electronic arrangement as recited in claim 1 , wherein the agitator comprises a substrate fixed relative to the housing.

3. The immersion cooled electronic arrangement as recited in claim 1 , wherein the agitator comprises an actuated element submerged within the coolant and opposing the electronic device.

4. The immersion cooled electronic arrangement as recited in claim 3 , wherein the actuated element includes a first actuated element and a second actuated element, the second actuated element being disposed below the first actuated element relative to gravity.

5. The immersion cooled electronic arrangement as recited in claim 3 , wherein the actuated element is movable between a first position and a second position, the first position and second position defining a movement axis intersecting the electronic device.

6. The immersion cooled electronic arrangement as recited in claim 1 , wherein the agitator comprises an actuator, the actuator being submerged within the coolant.

7. The immersion cooled electronic arrangement as recited in claim 6 , wherein the actuator is a first actuator and further including a second actuator, the second actuator being disposed below the first actuator relative to gravity.

8. The immersion cooled electronic arrangement as recited in claim 1 , wherein the electronic devices comprises a printed circuit board (PCB) fixed relative to the housing, a solid-state switch device connected to the PCB, and a heat exchanger connected to the solid-state switch device and opposing the agitator.

9. The immersion cooled electronic arrangement as recited in claim 1 , further comprising an ullage space defined between a liquid surface of the coolant and the housing, a condenser disposed within the ullage space, and a heat exchanger disposed on an exterior of the housing.

10. The immersion cooled electronic arrangement as recited in claim 1 , wherein the sensor includes at least one of an accelerometer, a temperature transducer, and a pressure transducer.

11. The immersion cooled electronic arrangement as recited in claim 1 , wherein the coolant includes a dielectric coolant.

12. The immersion cooled electronic arrangement as recited in claim 1 , wherein the agitator is separated from the electronic device by a coolant-filled gap.

13. An immersion cooled electronic arrangement, comprising:
a sealed housing;
a coolant contained within the housing;
an electronic device submerged within the coolant;
an agitator disposed within the housing;
a control module operatively connected to the agitator, the agitator is configured to control heat transfer between the electronic device and the coolant, the control module being responsive to non-transitory machine-readable instructions to control heat transfer between the electronic device and the coolant; and
a sensor disposed within the housing, the sensor being adapted and configured to provide a signal including information relating to a heat transfer coefficient and critical heat flux between the electronic device and the coolant,
wherein the instructions cause the control module to:
determine heat flux between the electronic device and the coolant;
compare the determined heat flux with a predetermined heat flux value; and
actuate the agitator based on comparison of the determined heat flux and the predetermined heat flux value.

14. An immersion cooled electronic arrangement, comprising:
a sealed housing;
a coolant contained within the housing;
an electronic device submerged within the coolant;
an agitator disposed within the housing;
a control module operatively connected to the agitator, the agitator is configured to control heat transfer between the electronic device and the coolant, the control module being responsive to non-transitory machine-readable instructions to control heat transfer between the electronic device and the coolant; and
a sensor disposed within the housing, the sensor being adapted and configured to provide a signal including information relating to a heat transfer coefficient and critical heat flux between the electronic device and the coolant,
wherein the instructions cause the control module to actuate the agitator when a determined heat flux between the electronic device and the coolant is below a predetermined heat flux target.

15. An immersion cooled electronic arrangement, comprising:
a sealed housing;
a coolant contained within the housing;
an electronic device submerged within the coolant;
an agitator disposed within the housing;
a control module operatively connected to the agitator, the agitator is configured to control heat transfer between the electronic device and the coolant, the control module being responsive to non-transitory machine-readable instructions to control heat transfer between the electronic device and the coolant; and
a sensor disposed within the housing, the sensor being adapted and configured to provide a signal including information relating to a heat transfer coefficient and critical heat flux between the electronic device and the coolant,
wherein the instructions cause the control module to actuate the agitator to generate a predetermined heat flux between the electronic device and the coolant.

16. A method of controlling heat transfer between an electronic device and coolant in an immersion cooling arrangement, the method comprising:
generating heat using an electronic device submerged within a coolant disposed within a sealed housing;
determining heat flux or a heat transfer coefficient between the electronic device and the coolant;
comparing the determined heat flux or heat transfer coefficient with a predetermined heat flux value or predetermined heat transfer coefficient;
agitating the coolant to control heat transfer between the electronic device and the coolant; and
transferring the heat from the electronic device to the coolant,
wherein agitating the coolant includes vibrating the agitator based on comparison of the determined heat flux or heat transfer coefficient and the predetermined heat flux value or heat transfer coefficient.

17. The immersion cooled electronics arrangement as recited in claim 4 , wherein the second actuated element is operably connected to the substrate by a second actuator and is movable between a first position and a second position, the first position and second position defining a second movement axis intersecting the ele

Assignees

• Hamilton Sundstrand Corp

Inventors

• Shepard Charles
• Campbell Kris H

Classifications

• H10W40/30

  wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid · CPC title

• H05K7/20381

  Thermal management, e.g. evaporation control · CPC title

• H05K7/20945

  Thermal management, e.g. inverter temperature control · CPC title

• H05K7/20881

  Liquid coolant with phase change · CPC title

• H05K7/20872

  Liquid coolant without phase change · CPC title