Electronic component mounting substrate, motor, air-conditioning apparatus, and method for manufacturing the electronic component mounting substrate

Patent metadata

Field	Value
Publication number	US-10129981-B2
Application number	US-201514872185-A
Country	US
Kind code	B2
Filing date	Oct 1, 2015
Priority date	Oct 30, 2014
Publication date	Nov 13, 2018
Grant date	Nov 13, 2018

Abstract

An electronic component mounting substrate includes an electronic component mounted on a surface of a substrate, an electrode portion disposed on the surface of the substrate and electrically connected to the electronic component, a lead wire connected to the electrode portion, and an encapsulation resin configured to encapsulate a part of the lead wire, the electronic component, and the electrode portion. A surface of at least the part of the lead wire encapsulated by the encapsulation resin and the surface of the substrate are coated with a deposited film.

First claim

The invention claimed is:

1. An electronic component mounting substrate comprising:
a substrate formed with a through hole and including a first surface and a second surface that is opposite to the first surface,
an electronic component mounted on the first surface of a substrate;
an electrode portion disposed on the second surface of the substrate and electrically connected to the electronic component;
a lead wire connected to the electrode portion;
an encapsulation resin completely surrounding the substrate, the electronic component, the electrode portion, a part of the lead wire connected to the electrode portion, and
a coating of a deposited film provided on a surface of the part of the lead wire and the surface of the substrate and underneath the encapsulation resin and completely covering the substrate and the part of the lead wire connected to the electrode portion,
wherein an end of the lead wire is positioned at the second surface and connected to the electrode portion via the through hole.

2. The electronic component mounting substrate of claim 1 , wherein the deposited film is of a resin.

3. The electronic component mounting substrate of claim 2 , wherein the resin is a poly-para-xylylene resin.

4. The electronic component mounting substrate of claim 3 , wherein the poly-para-xylylene resin is a poly-para-chloro-xylylene resin.

5. The electronic component mounting substrate of claim 1 , wherein a thickness of the deposited film ranges from 5 μm to 150 μm.

6. A motor comprising the electronic component mounting substrate of claim 1 .

7. An air-conditioning apparatus comprising the motor of claim 6 .

8. The electronic component mounting substrate of claim 1 , wherein
the substrate and the lead wire are heated after forming the coating of the deposited film on the surface of the lead wire and the surface of the substrate, and
a thickness of the deposited film ranges from 5 μm to 15 μm.

9. A method for manufacturing an electronic component mounting substrate comprising:
preparing a substrate having an electronic component and an electrode portion mounted on a surface thereof, the electrode portion being electrically connected to the electronic component, the substrate being provided with a lead wire connected at one end thereof to the electrode portion;
forming a deposited film completely covering the surface of the substrate and a surface of the lead wire;
preheating the deposited film covering the surface of the substrate and the surface of the lead wire; and
encapsulating by completely surrounding the surface of the substrate and the lead wire in a resin.

10. The method for manufacturing an electronic component mounting substrate of claim 9 , further comprising preheating the substrate and the lead wire between the forming of the deposited film and the encapsulating of the surfaces in a resin wherein
a thickness of the deposited film ranges from 5 μm to 15 μm.

11. The method for manufacturing an electronic component mounting substrate of claim 10 , wherein the preheating is carried out at a temperature of 100° C. or 120° C. for 5 minutes.

12. An electronic component mounting substrate comprising:
a substrate formed with a through hole and including a first surface and a second surface that is opposite to the first surface,
an electronic component mounted on the first surface of a substrate;
an electrode portion disposed on the second surface of the substrate and electrically connected to the electronic component;
a lead wire connected to the electrode portion; and
an encapsulation resin completely surrounding the substrate, the electronic component, the electrode portion, a part of the lead wire connected to the electrode portion, and
a coating of a deposited film provided on a surface of the part of the lead wire and the surface of the substrate and underneath the encapsulation resin and completely covering the substrate and the part of the lead wire connected to the electrode portion,
wherein at least the substrate and the lead wire are preheated at a temperature and for an amount of time before the coating of the deposited film that effectively improves curing of the coating of the deposited film, and
wherein an end of the lead wire is positioned at the second surface and connected to the electrode portion via the through hole.

Assignees

• Mitsubishi Electric Corp

Inventors

• Matsunaga Noriaki

Classifications

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W74/114 Primary

  by a substrate and the encapsulations · CPC title

• H05K1/053

  the metal substrate being covered by an inorganic insulating layer · CPC title

• H01L23/3121

  Electricity · mapped topic

• H01L23/3135

  Electricity · mapped topic