Temperature compensated acoustic resonator device having thin seed interlayer
US-2017288636-A1 · Oct 5, 2017 · US
US10128812B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10128812-B2 |
| Application number | US-201514815157-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 31, 2015 |
| Priority date | Jun 30, 2009 |
| Publication date | Nov 13, 2018 |
| Grant date | Nov 13, 2018 |
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An acoustic resonator comprises a substrate comprising a cavity. The electrical resonator comprises a resonator stack suspended over the cavity. The resonator stack comprises a first electrode; a second electrode; a piezoelectric layer; and a temperature compensating layer comprising borosilicate glass (BSG).
Opening claim text (preview).
We claim: 1. An acoustic resonator, comprising: a substrate; a cavity in the substrate; and a resonator stack suspended over the cavity and comprising: a first electrode; a second electrode; a piezoelectric layer; and a temperature compensation layer comprising borosilicate glass (BSG) wherein a concentration of boron in the temperature compensation layer is in a range of approximately 0.1% to approximately 5.0% by weight percent, or by atomic percent. 2. An acoustic resonator as claimed in claim 1 , wherein the temperature compensation layer is disposed between the first electrode and the piezoelectric layer. 3. An acoustic resonator as claimed in claim 1 , wherein the temperature compensation layer is disposed between the second electrode and the piezoelectric layer. 4. An acoustic resonator as claimed in claim 1 , wherein the temperature compensation layer is disposed over the substrate and beneath the first electrode. 5. An acoustic resonator as claimed in claim 1 , wherein the temperature compensation layer is disposed over the second electrode. 6. An acoustic resonator as claimed in claim 1 , wherein the resonator stack is a first resonator stack, and the temperature compensation layer is a first temperature compensation layer, and the acoustic resonator further comprises a second resonator stack disposed over the first resonator stack, the second resonator stack comprising: a third electrode; a fourth electrode; a second piezoelectric layer; and a second temperature compensation layer comprising borosilicate glass (BSG). 7. An acoustic resonator as claimed in claim 6 , wherein the second temperature compensation layer is disposed between the fourth electrode and the second piezoelectric layer. 8. An acoustic resonator as claimed in claim 6 , wherein the second temperature compensation layer is disposed over the second electrode and beneath the third electrode. 9. An acoustic resonator as claimed in claim 6 , wherein the second temperature compensation layer is disposed over the fourth electrode. 10. An acoustic resonator as claimed in claim 6 , wherein a concentration of boron in the second temperature compensation layer is in a range of approximately 0.1% to approximately 5.0% by weight percent, or by atomic percent. 11. An acoustic resonator as claimed in claim 1 , wherein the temperature compensation layer has a thickness in the range of approximately 500 Å to approximately 2000 Å. 12. An acoustic resonator as claimed in claim 1 , wherein the temperature compensation layer has a thickness in the range of approximately 200Å to approximately 10000 Å. 13. An acoustic resonator as claimed in claim 6 , wherein the first temperature compensation layer and the second temperature compensation layer each have a thickness in the range of approximately 500 Å to approximately 2000 Å. 14. An acoustic resonator as claimed in claim 6 , wherein the first temperature compensation layer and the second temperature compensation layer each have a thickness in the range of approximately 200Å to approximately 10000 Å. 15. An acoustic resonator as claimed in claim 1 , wherein a concentration of boron in the BSG in the temperature compensation layer is low enough to prevent reflow of the piezoelectric layer, but high enough to enable adequate temperature compensation of the acoustic resonator. 16. An acoustic resonator as claimed in claim 6 , wherein a concentration of boron in the BSG in each of the first and second temperature compensation layers is low enough to prevent reflow of the piezoelectric layer, but high enough to enable adequate temperature compensation of the acoustic resonator.
Piezoelectric device making · CPC title
the resonators or networks being of the air-gap type · CPC title
comprising a plurality of piezoelectric layers acoustically coupled · CPC title
Electricity · mapped topic
for obtaining desired frequency or temperature coefficient · CPC title
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