Chip-to-chip interface comprising a microstrip circuit to waveguide transition having an emitting patch

Patent metadata

Field	Value
Publication number	US-10128557-B2
Application number	US-201615342551-A
Country	US
Kind code	B2
Filing date	Nov 3, 2016
Priority date	Nov 12, 2015
Publication date	Nov 13, 2018
Grant date	Nov 13, 2018

Abstract

The present invention relates to a microstrip circuit and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a microstrip circuit. The microstrip circuit includes a feeding line providing a signal, a probe being connected to one end of the feeding line, and a patch emitting the signal to a waveguide. The patch is disposed in a layer opposite to a layer in which the feeding line and the probe are disposed, with a core substrate being positioned therebetween. At least one of length of the probe, thickness of the core substrate, and permittivity of the core substrate is determined based on bandwidth of a transition between the microstrip circuit and the waveguide.

First claim

What is claimed is:

1. A microstrip circuit, comprising:
a feeding line providing a signal;
a probe being connected to one end of the feeding line; and
a patch emitting the signal to a waveguide, the patch being disposed in a layer opposite to a layer in which the feeding line and the probe are disposed, with a core substrate being positioned therebetween,
wherein at least one of a length of the probe, a thickness of the core substrate, and permittivity of the core substrate is determined based on a bandwidth of a transition between the microstrip circuit and the waveguide, and
wherein the length of the probe is determined based on a wavelength of the signal at a resonant frequency thereof.

2. The microstrip circuit of claim 1 , wherein the thickness and permittivity of the core substrate are determined based on a coupling coefficient between the waveguide and the microstrip circuit.

3. The microstrip circuit of claim 2 , wherein the thickness of the core substrate is determined to be equal to or greater than a predetermined thickness, and the permittivity of the core substrate is determined to be equal to or greater than a predetermined permittivity, so that the coupling coefficient does not exceed a predetermined value.

4. The microstrip circuit of claim 1 , further comprising:
a ground plane being disposed in the same layer as the patch and comprising an aperture surrounding the patch; and
a slotted ground plane being disposed in a layer between the layer in which the feeding line and the probe are disposed and the layer in which the patch and the ground plane are disposed, and comprising a slot for minimizing reverse traveling electromagnetic waves,
wherein the core substrate comprises:
a first core substrate present between the layer in which the feeding line and the probe are disposed and the layer in which the slotted ground plane is disposed; and
a second core substrate present between the layer in which the slotted ground plane is disposed and the layer in which the patch and the ground plane are disposed.

5. The microstrip circuit of claim 4 , further comprising:
at least one via forming an electrical connection between the ground plane and the slotted ground plane.

6. The microstrip circuit of claim 1 , wherein the length of the probe is determined to be a half of the wavelength of the signal at the resonant frequency thereof.

7. The microstrip circuit of claim 1 , wherein the waveguide is coupled to the microstrip circuit, and the waveguide comprises a dielectric part comprising a first and a second dielectric part having different permittivity, and a metal part surrounding the dielectric part.

8. The microstrip circuit of claim 1 , wherein the bandwidth of the transition between the microstrip circuit and the waveguide is increased as a coupling coefficient between the waveguide and the microstrip circuit is reduced.

9. The microstrip circuit of claim 1 , wherein the bandwidth of the transition between the microstrip circuit and the waveguide is increased as the resonant frequency of the signal is increased.

10. A chip-to-chip interface apparatus, comprising:
a waveguide; and
a microstrip circuit, comprising:
a feeding line providing a signal;
a probe being connected to one end of the feeding line; and
a patch emitting the signal to a waveguide, the patch being disposed in a layer opposite to a layer in which the feeding line and the probe are disposed, with a core substrate being positioned therebetween,

wherein at least one of a length of the probe, a thickness of the core substrate, and permittivity of the core substrate is determined based on a bandwidth of a transition between the microstrip circuit and the waveguide,
wherein the length of the probe is determined based on a wavelength of the signal at a resonant frequency thereof, and
wherein the waveguide is coupled to the microstrip circuit, and the waveguide comprises a dielectric part comprising a first and a second dielectric part having different permittivity, and a metal part surrounding the dielectric part.

Assignees

• Korea Advanced Inst Sci & Tech

Inventors

• Bae Hyeon Min
• Song Ha Ii
• Jin Huxian
• Lee Joon Yeong
• Won Hyo Sup
• Yoon Tae Hoon

Classifications

• H01P3/16

  Dielectric waveguides, i.e. without a longitudinal conductor · CPC title

• H01P3/081

  Microstriplines · CPC title

• H01P5/107 Primary

  Hollow-waveguide/strip-line transitions · CPC title

• H01P3/122

  Dielectric loaded (not air) · CPC title

• H01P5/087

  Transitions to a dielectric waveguide · CPC title