Nozzle assembly and nozzle array for OVJP

US10128468B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10128468-B2
Application numberUS-201715441331-A
CountryUS
Kind codeB2
Filing dateFeb 24, 2017
Priority dateSep 19, 2014
Publication dateNov 13, 2018
Grant dateNov 13, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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Embodiments of the disclosed subject matter provide a nozzle assembly and method of making the same, the nozzle assembly including a first aperture formed on a first aperture plate to eject a carrier gas flow having organic vapor onto a substrate in a deposition chamber, second apertures formed on a second aperture plate disposed adjacent to the first aperture to form a vacuum aperture, where the first aperture plate and the second aperture plate are separated by a first separator plate, third apertures formed on a third aperture plate to eject purge gas that are disposed adjacent to the second aperture plate, where the second aperture plate and the third aperture plate are separated by second separator plate, and a third separator plate is disposed adjacent to the one or more third aperture plates to form a gas channel in the one or more third aperture plates.

First claim

Opening claim text (preview).

We claim: 1. A nozzle assembly comprising: at least one nozzle having: a first aperture formed along an edge of a first aperture plate to eject a carrier gas flow laden with condensable organic vapor onto a substrate in a deposition chamber; one or more second apertures each formed on second aperture plates disposed adjacent to and on opposite sides of the first aperture to form a vacuum aperture, where the first aperture plate and the second aperture plates are separated by first separator plates; and second separator plates disposed adjacent to the second aperture plates, on an opposite side from the first separator plates. 2. The nozzle assembly of claim 1 , wherein the nozzle for a single deposition aperture is formed by placing sheets of material formed to have the first and second apertures along one edge and gas channels through the assembly. 3. The nozzle assembly of claim 2 , wherein the nozzle for the single deposition assembly is formed by alternating aperture sheets, respectively having the first and second apertures, and separator sheets to form gas flow paths from the gas channels to at least one of the first and second apertures. 4. The nozzle assembly of claim 1 , wherein the at least one nozzle is for multi-deposition apertures, and is formed by repeating placement of sheets of material formed to have apertures along one edge and gas channels through the assembly so that multiple deposition nozzles are formed, separated by a number of sheets. 5. The nozzle assembly of claim 4 , wherein the number of nozzles is between 10 and 100. 6. The nozzle assembly of claim 4 , wherein the number of nozzles is greater than 100. 7. The nozzle assembly of claim 1 , wherein the at least one nozzle comprises: an aperture plate, where each plate contains more than one aperture to deposit a single line. 8. The nozzle assembly of claim 1 , wherein the at least one nozzle is for a single deposition nozzle assembly that is formed by placing sheets of material formed to have multiple apertures along one edge and gas channels through the assembly. 9. The nozzle assembly of claim 8 , wherein the single deposition nozzle assembly formed by alternating multi-aperture sheets and separator sheets to form gas flow paths from the gas channels to the respective aperture. 10. The nozzle assembly of claim 8 , wherein the single deposition nozzle formed by placing multi-aperture plates, with the respective plates having the first aperture, the one or more second apertures, and the separator plates disposed between the respective plates, to form the at least one nozzle. 11. The nozzle assembly of claim 8 , wherein the single deposition nozzle assembly comprises stacking more than one multi-aperture nozzle assembly to form a two-dimensional nozzle assembly. 12. The nozzle assembly of claim 1 , further comprising: a heater to heat the at least one nozzle to a temperature greater than that of the evaporation temperature of a least volatile organic species in the carrier gas. 13. The nozzle assembly of claim 1 , wherein a vacuum source is at a lower pressure than an ambient pressure of the deposition chamber. 14. The nozzle assembly of claim 1 , further comprising: a chiller plate oriented parallel to the substrate that surrounds the at least one nozzle. 15. The nozzle assembly of claim 1 , wherein an ambient pressure of the deposition chamber is at least 10 Torr. 16. The nozzle assembly of claim 1 , wherein an ambient pressure of the deposition chamber is at least 100 Torr. 17. The nozzle assembly of claim 1 , wherein an ambient pressure of the deposition chamber is at least 760 Torr. 18. A nozzle assembly comprising: at least one nozzle having: a first aperture formed along an edge of a first aperture plate to eject a carrier gas flow laden with condensable organic vapor onto a substrate in a deposition chamber; one or more second apertures each formed on second aperture plates disposed adjacent to and on opposite sides of the first aperture to form a vacuum aperture, where the first aperture plate and the second aperture plates are separated by first separator plates; second separator plates disposed adjacent to the second aperture plates, on an opposite side from the first separator plates; and one or more third apertures each formed on third aperture plates respectively disposed adjacent to each of the second separator plates, opposite the second aperture plates, wherein confinement flow gas is directed through the one or more third apertures from a source external to the deposition chamber. 19. A nozzle assembly comprising: at least one nozzle having: a first aperture formed along an edge of a first aperture plate to eject a carrier gas flow laden with condensable organic vapor onto a substrate in a deposition chamber; one or more second apertures each formed on second aperture plates disposed adjacent to and on opposite sides of the first aperture to form a vacuum aperture, where the first aperture plate and the second aperture plates are separated by first separator plates; second separator plates disposed adjacent to the second aperture plates, on an opposite side from the first separator plates; and third separator plates respectively disposed adjacent to each of the second separator plates opposite the second aperture plates, wherein the third separator plates are configured to define a roof of a channel for confinement gas to flow.

Assignees

Inventors

Classifications

  • dry etching · CPC title

  • characterised by nozzle shapes or number of orifices per chamber · CPC title

  • Gas flow assisted PVD deposition · CPC title

  • Manufacturing of the nozzle plates · CPC title

  • Structure of nozzle plates · CPC title

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What does patent US10128468B2 cover?
Embodiments of the disclosed subject matter provide a nozzle assembly and method of making the same, the nozzle assembly including a first aperture formed on a first aperture plate to eject a carrier gas flow having organic vapor onto a substrate in a deposition chamber, second apertures formed on a second aperture plate disposed adjacent to the first aperture to form a vacuum aperture, where t…
Who is the assignee on this patent?
Universal Display Corp
What technology area does this patent fall under?
Primary CPC classification H01L51/56. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 13 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).