Wound/stacked ceramic film capacitors, method for making ceramic film capacitors

Patent metadata

Field	Value
Publication number	US-10128046-B2
Application number	US-201514731738-A
Country	US
Kind code	B2
Filing date	Jun 5, 2015
Priority date	Jun 16, 2014
Publication date	Nov 13, 2018
Grant date	Nov 13, 2018

Abstract

The invention provides a process for making ceramic film capacitors, the process comprising supplying a flexible substrate, depositing a first electrode on a first region of the flexible substrate, wherein the first electrode defines a first thickness, overlaying the first electrode with a dielectric film; and depositing a second electrode on the ceramic film, wherein the second electrode defines a second thickness. Also provided is a capacitor comprising flexible substrate, a first electrode deposited on said flexible substrate, a dielectric overlaying the first electrode; and a second electrode deposited on said dielectric.

First claim

The embodiment of the invention in which an exclusive property or privilege is claimed is defined as follows:

1. A capacitor comprising:
a. a flexible polymer-based single substrate acting as a support substrate wherein said single flexible polymer-based substrate comprises a film;
b. a first electrode deposited upon said flexible polymer-based substrate at near ambient pressure;
c. a dielectric fully overlaying the first electrode; and
d. a second electrode deposited on said dielectric;
wherein said dielectric comprises a ceramic film deposited on the first electrode and flexible polymer-based substrate combination wherein said ceramic film exhibits a high dielectric constant wherein combination of said support substrate, first electrode, dielectric, and second electrode form the capacitor.

2. The capacitor as recited in claim 1 wherein the flexible substrate is capable of achieving a radius of curvature of between approximately 1 to 10 millimeters.

3. The capacitor as recited in claim 1 wherein each of said first and second electrodes define a bus region, a main current collection region, and a linking region electrically connecting the bus region to the collection region.

4. The capacitor as recited in claim 3 wherein the bus region is approximately 2-5 times thicker than the linking region.

5. The capacitor as recited in claim 1 wherein said first and second electrodes each define a plurality of segments electrically connected via a bus.

6. The capacitor as recited in claim 1 wherein the dielectric substantially electrically isolates the first electrode from the second electrode.

7. The capacitor as recited in claim 5 wherein the dielectric substantially encapsulates the plurality of segments defining the first electrode.

8. The capacitor as recited in claim 1 wherein the capacitor has a radius of curvature of between approximately 1 to 10 millimeters.

9. The capacitor as recited in claim 1 wherein the dielectric is a ceramic selected from the group consisting of perovskites having a general formula ABO 3 , lead zirconate titanate, lanthanum doped lead zirconate titanate, lead magnesium niobate, barium titanate, barium strontium titanate, and combinations thereof.

10. The capacitor as recited in claim 1 wherein the electrodes are electrical conductors selected from the group consisting of Al, Cu, Ag, Au, Pt, Ti, Ni, Fe, Ta, Mo, Zn, Al-alloy, Cu-alloy, Ag-alloy, Pt-alloy, Ti-alloy, Ni-alloy, Fe-alloy, Ta-alloy, Mo-alloy, Zn-Alloy and combinations thereof.

11. The capacitor as recited in claim 1 wherein the dielectric covers regions of the flexible substrate not overlaid with the first electrode.

12. The capacitor as recited in claim 11 wherein the regions not covered are electrically isolated from the first electrode.

13. The capacitor as recited in claim 1 wherein the flexible substrate defines a waterproof and electrically insulative exterior to the capacitor when the capacitor is rolled or folded.

14. The capacitor as recited in claim 1 wherein said substrate is folded to form a stacked capacitor.

15. The capacitor as recited in claim 1 wherein said polymer-based substrate is not exposed to temperatures exceeding 400° C.

Assignees

• Ma Beihai
• Balachandran Uthamalingam
• Dorris Stephen E
• Lee Tae H
• Uchicago Argonne Llc

Inventors

• Ma Beihai
• Balachandran Uthamalingam
• Dorris Stephen E
• Lee Tae H

Classifications

• H01G4/228

  Terminals · CPC title

• H01G4/005

  Electrodes · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/32

  Wound capacitors · CPC title

• H01G4/26 Primary

  Folded capacitors · CPC title