Gas sensor package

Patent metadata

Field	Value
Publication number	US-10126258-B2
Application number	US-201515529057-A
Country	US
Kind code	B2
Filing date	Nov 17, 2015
Priority date	Nov 24, 2014
Publication date	Nov 13, 2018
Grant date	Nov 13, 2018

Abstract

The present invention relates to a gas sensor package including an insulating substrate, a metal layer on one surface of the insulating substrate, a stepped portion disposed on the metal layer and configured to divide the metal layer into a plurality of portions, and a gas sensor chip mounted on the metal layer located on the stepped portion and including a sensing part, wherein a width of the stepped portion is provided to be equal to or less than an interval between two adjacent electrode terminals of a plurality of electrode terminals of the gas sensor chip.

First claim

The invention claimed is:

1. A gas sensor package comprising:
an insulating substrate;
a metal layer provided on a top surface of the insulating substrate;
a stepped portion configured to divide the metal layer into a plurality of sections;
a first solder bump provided on a first portion of the metal layer;
a second solder bump provided on a second portion of the metal layer;
a gas sensor chip mounted on the first solder bump and including a sensor;
a resistor mounted on the second solder bump to be electrically connected to the gas sensor chip in parallel; and
a cap configured to cover the gas sensor chip and the metal layer and attached to insulating substrate through a bonding member,
wherein the bonding member is arranged such that the stepped portion below the gas sensor chip is exposed between he insulating substrate and the cap, wherein the stepped portion forms a first channel that extends in a first direction along the insulating substrate and a second channel that extends in a second direction that intersects with the first direction, wherein an intersection between the first channel and the second channel is formed at a chip mounting area on the insulating substrate which faces the sensor, and wherein the bonding member is in direct physical contact with the resistor and the gas sensor chip.

2. The gas sensor package of claim 1 , wherein the sensor faces the top surface of the insulating substrate having the first and second channels.

3. The gas sensor package of claim 2 , wherein a hollow portion is provided at a first surface of the gas sensor chip, and the sensor is provided at a second surface thereof opposite to the first surface of the gas sensor chip.

4. The gas sensor package of claim 3 , wherein the electrode terminals are electrically connected to the sensor on the second surface of the gas sensor chip.

5. The gas sensor package of claim 2 , wherein a width of each of the first and second channel is 10% or more of a width between two adjacent electrode terminals of a plurality of electrode terminals of the gas sensor chip.

6. The gas sensor package of claim 2 , wherein a width of the first or second channel is 30% or more to 100% or less of a width between two adjacent electrode terminals of a plurality of electrode terminals of the gas sensor chip.

7. The gas sensor package of claim 2 , wherein a width of each of the first and second channels is 50% or more to 90% or less of a width between two adjacent electrode terminals of a plurality of electrode terminals of the gas sensor chip.

8. The gas sensor package of claim 1 , wherein the cap has one or more openings formed at an upper surface thereof.

9. The gas sensor package of claim 8 , wherein the openings comprise:
a first opening provided at a position corresponding to an arrangement position of the gas sensor chip; and
a second opening provided at a position corresponding to an arrangement position of the resistor.

10. The gas sensor package of claim 9 ,
wherein an upper surface of the bonding member is higher than an upper surface of the first solder bump.

11. The gas sensor package of claim 8 , further comprising a plurality of connection terminals which are connected to the metal layer and exposed to the second surface of the insulating substrate opposite to the first surface thereof.

12. The gas sensor package of claim 8 , wherein a depth of each of the first and second channels is formed to be equal to or more than a thickness of the metal layer.

13. The gas sensor package of claim 12 , wherein the depth of each of the first and second channels includes a step of the metal layer or includes a combination of the step of the metal layer, a step of the insulating substrate corresponding to the step of the metal layer, a height of a solder, and a step of the sensor.

14. The gas sensor package of claim 13 , wherein the step of the insulating substrate is formed by etching a surface of the insulating substrate in a depth direction.

15. The gas sensor package of claim 8 , further comprising a plurality of connection terminals which are in contact with the metal layer, pass through the insulating substrate and protrude downward.

Assignees

• Lg Innotek Co Ltd

Inventors

• Paik Jee Heum
• Hwang Ji Hun

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/01204

  using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates · CPC title