Demand-based charging of a heat pipe

Patent metadata

Field	Value
Publication number	US-10126070-B2
Application number	US-201715814371-A
Country	US
Kind code	B2
Filing date	Nov 15, 2017
Priority date	Oct 13, 2015
Publication date	Nov 13, 2018
Grant date	Nov 13, 2018

Abstract

A heat pipe includes a reservoir of liquid that is connected to a horizontal portion of the heat pipe via a capillary connection. The heat pipe includes a temperature sensor in proximity to a heat interface in the horizontal portion and a controller that controls a heater for the reservoir. As power into the heat pipe increases, the controller turns on the heater, causing the temperature of the liquid in the reservoir to rise. Liquid then passes from the reservoir through the capillary connection into the horizontal portion, thereby dynamically increasing the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. When the heater is off, as the heat pipe cools, the liquid condenses and flows back through the capillary connection into the reservoir. The result is a heat pipe that provides demand-based charging of the liquid based on power level.

First claim

The invention claimed is:

1. A heat pipe comprising:
an interface for thermally coupling a heat source to the heat pipe;
a substantially horizontal portion charged with a first quantity of liquid and coupled to the interface;
a reservoir that contains a second quantity of the liquid, the reservoir overlying the substantially horizontal portion and having a width and a height, where the width is substantially greater than the height;
a capillary connection that connects the reservoir to the substantially horizontal portion, wherein the capillary connection has a diameter of 0.1 millimeters (mm) to 0.3 mm;
a heater thermally coupled to the reservoir;
a temperature sensor in proximity to the interface; and
a controller coupled to the heater and the temperature sensor, wherein the controller detects when temperature detected by the temperature sensor exceeds a predetermined threshold, and in response, turns on the heater, wherein turning on the heater by the controller heats the second quantity of liquid in the reservoir and causes at least a portion of the second quantity of liquid in the reservoir to pass from the reservoir through the capillary connection into the substantially horizontal portion, wherein turning off the heater by the controller causes the liquid in the reservoir to cool and causes at least a portion of the second quantity of liquid in the substantially horizontal portion to pass from the substantially horizontal portion through the capillary connection via capillary action into the reservoir.

2. The heat pipe of claim 1 wherein the capillary connection has a hydrophobic coating.

3. The heat pipe of claim 1 wherein the controller detects when the temperature detected by the temperature sensor is less than the predetermined threshold, and in response, turns off the heater.

4. The heat pipe of claim 1 further comprising at least one vertical member connected with the substantially horizontal portion.

5. The heat pipe of claim 1 further comprising a plurality of fins that dissipate heat.

6. The heat pipe of claim 1 wherein the substantially horizontal portion overlies the interface.

7. The heat pipe of claim 1 wherein the substantially horizontal portion, the reservoir, and the capillary connection are made of copper.

8. A heat sink comprising:
a plurality of thermally-conductive fins; and
a heat pipe thermally coupled to the plurality of thermally-conductive fins, the heat pipe comprising:
an interface for thermally coupling a heat source to the heat pipe;
a substantially horizontal portion charged with a first quantity of liquid and overlying the interface;
at least one vertical member connected with the substantially horizontal portion;
a reservoir that contains a second quantity of the liquid, the reservoir overlying the substantially horizontal portion and having a width and a height, where the width is substantially greater than the height;
a capillary connection that connects the reservoir to the substantially horizontal portion, wherein the capillary connection has a diameter of 0.1 millimeters (mm) to 0.3 mm;
a heater thermally coupled to the reservoir;
a temperature sensor in proximity to the interface; and
a controller coupled to the heater and the temperature sensor, wherein the controller detects when temperature detected by the temperature sensor exceeds a predetermined threshold, and in response, turns on the heater, wherein turning on the heater by the controller heats the second quantity of liquid in the reservoir and causes at least a portion of the second quantity of liquid in the reservoir to pass from the reservoir through the capillary connection into the substantially horizontal portion, and detects when the temperature detected by the temperature sensor is less than the predetermined threshold, and in response, turns off the heater, wherein the controller turning off the heater causes the liquid in the reservoir to cool and causes at least a portion of the second quantity of liquid in the substantially horizontal portion to pass from the substantially horizontal portion through the capillary connection via capillary action into the reservoir.

9. The heat sink of claim 8 wherein the capillary connection has a hydrophobic coating.

10. The heat sink of claim 8 wherein the controller detects when the temperature detected by the temperature sensor is less than the predetermined threshold, and in response, turns off the heater.

11. The heat sink of claim 8 further comprising at least one vertical member connected with the substantially horizontal portion.

12. The heat sink of claim 8 wherein the substantially horizontal portion overlies the interface.

13. The heat sink of claim 8 wherein the substantially horizontal portion, the at least one vertical member, the reservoir, and the capillary connection are made of copper.

14. The heat sink of claim 8 wherein the liquid comprises water.

Assignees

• IBM

Inventors

• Anderl William J
• Elison Bret P
• Mann Phillip V
• Sinha Arvind K

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• F28F21/085

  from copper or copper alloys · CPC title

• H01L23/427

  Electricity · mapped topic

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title