Diaphragm valve, fluid control device, semiconductor manufacturing apparatus, and semiconductor manufacturing method

Patent metadata

Field	Value
Publication number	US-10125876-B2
Application number	US-201515322566-A
Country	US
Kind code	B2
Filing date	Jun 17, 2015
Priority date	Jun 30, 2014
Publication date	Nov 13, 2018
Grant date	Nov 13, 2018

Abstract

The radius of curvature (SR2) of a surface of a diaphragm presser, which surface is in contact with a diaphragm, is at least 30 mm. The taper angle (θ) for a lower surface of a press adapter is no more than 10° relative to a flat portion of a bottom surface of a depression of a body.

First claim

The invention claimed is:

1. A diaphragm valve comprising:
a body provided with a fluid inflow channel, a fluid outflow channel, and a depression which is open upward;
a seat disposed on a peripheral edge of the fluid inflow channel of the body;
a spherical-shell-shaped diaphragm which is elastically deformable and which is pressed against and separated from the seat to close and open the fluid inflow channel, respectively;
a press adapter which holds an outer peripheral edge portion of the diaphragm between the press adapter and a bottom surface of the depression of the body;
a diaphragm presser which presses a center portion of the diaphragm; and
vertical movement means which vertically moves the diaphragm presser; and
the press adapter being tapered with an entire lower surface thereof having a predetermined angle of inclination, and the bottom surface of the depression of the body having a circular flat portion and a depressed portion which is contiguous to an outer periphery of the flat portion and which is depressed relative to the flat portion,
wherein the flat portion of the bottom surface of the depression of the body is provided with a groove so as to include a portion of the fluid outflow channel, which portion is open to the bottom surface of the depression,
wherein a radius of curvature of a surface of the diaphragm presser, which surface is in contact with the diaphragm, is at least 30 mm and no more than 50 mm, and a taper angle for the lower surface of the press adapter is at least 5° and no more than 10° relative to the flat portion of the bottom surface of the depression of the body.

2. A fluid control device comprising an on-off valve as a fluid controller, wherein the on-off valve is the diaphragm valve according to claim 1 .

3. The fluid control device according to claim 2 , wherein the fluid control device is used in a semiconductor manufacturing apparatus.

4. A semiconductor manufacturing apparatus comprising the fluid control device according to claim 2 as a gas supply section.

5. The semiconductor manufacturing apparatus according to claim 4 , wherein the semiconductor manufacturing apparatus is a CVD apparatus, a spattering apparatus, or an etching apparatus.

6. A semiconductor manufacturing method, wherein a semiconductor is manufactured using the semiconductor manufacturing apparatus according to claim 5 .

7. The diaphragm valve according to claim 1 , wherein the groove is a spot facing configured to be contiguous to a portion that holds the seat.

8. A fluid control device comprising an on-off valve as a fluid controller, wherein the on-off valve is the diaphragm valve according to claim 7 .

9. The fluid control device according to claim 8 , wherein the fluid control device is used in a semiconductor manufacturing apparatus.

10. A semiconductor manufacturing apparatus comprising the fluid control device according to claim 8 as a gas supply section.

11. The semiconductor manufacturing apparatus according to claim 10 , wherein the semiconductor manufacturing apparatus is a CVD apparatus, a spattering apparatus, or an etching apparatus.

12. A semiconductor manufacturing method, wherein a semiconductor is manufactured using the semiconductor manufacturing apparatus according to claim 11 .

13. A diaphragm valve comprising:
a body provided with a fluid inflow channel, a fluid outflow channel, and a depression which is open upward;
a seat disposed on a peripheral edge of the fluid inflow channel of the body;
a spherical-shell-shaped diaphragm which is elastically deformable and which is pressed against and separated from the seat to close and open the fluid inflow channel, respectively;
a press adapter which holds an outer peripheral edge portion of the diaphragm between the press adapter and a bottom surface of the depression of the body;
a diaphragm presser which presses a center portion of the diaphragm; and
vertical movement means which vertically moves the diaphragm presser; and
the press adapter being tapered with an entire lower surface thereof having a predetermined angle of inclination, and the bottom surface of the depression of the body having a circular flat portion and a depressed portion which is contiguous to an outer periphery of the flat portion and which is depressed relative to the flat portion,
wherein, when the valve is open, a ratio of a diameter of the diaphragm, to a distance from the bottom surface of the depression of the body, which bottom surface is in close contact with the diaphragm under pressure, to a vertex of the diaphragm is 18:1 to 30:1, and
wherein a radius of curvature of a surface of the diaphragm presser, which surface is in contact with the diaphragm, is at least 30 mm and no more than 50 mm, and a taper angle for the lower surface of the press adapter is at least 5° and no more than 10° relative to the flat portion of the bottom surface of the depression of the body.

14. A fluid control device comprising an on-off valve as a fluid controller, wherein the on-off valve is the diaphragm valve according to claim 13 .

15. The fluid control device according to claim 14 , wherein the fluid control device is used in a semiconductor manufacturing apparatus.

16. A semiconductor manufacturing apparatus comprising the fluid control device according to claim 14 as a gas supply section.

17. The semiconductor manufacturing apparatus according to claim 16 , wherein the semiconductor manufacturing apparatus is a CVD apparatus, a spattering apparatus, or an etching apparatus.

18. A semiconductor manufacturing method, wherein a semiconductor is manufactured using the semiconductor manufacturing apparatus according to claim 17 .

Assignees

• Fujikin Kk

Inventors

• Watanabe Kazunari
• Shikata Izuru

Classifications

• F16K7/17 Primary

  the diaphragm being actuated by fluid pressure · CPC title

• F16K7/16 Primary

  the diaphragm being mechanically actuated, e.g. by screw-spindle or cam · CPC title

• F16J3/02

  Diaphragms · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P50/242

  of Group IV materials · CPC title