Metal nanowires structure

US10124561B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10124561-B2
Application numberUS-201715453137-A
CountryUS
Kind codeB2
Filing dateMar 8, 2017
Priority dateMay 21, 2015
Publication dateNov 13, 2018
Grant dateNov 13, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The disclosure relates to a metal nanowire structure. The metal nanowire structure includes a substrate and a metal nanowire film located on the substrate. The metal nanowire film includes a number of first metal nanowires parallel with and spaced from each other. A width of each of the plurality of first metal nanowires is in a range from about 0.5 nanometers to about 50 nanometers. Each of the plurality of first metal nanowires is a solid structure and consists of metal material.

First claim

Opening claim text (preview).

What is claimed is: 1. A metal nanowire structure comprising: a substrate having a surface; and a metal nanowire film located on the surface of the substrate; wherein the metal nanowire film comprises a plurality of first metal nanowire bundles, the plurality of first metal nanowire bundles are parallel with and spaced from each other, each of the plurality of first metal nanowire bundles comprises a plurality of first metal nanowires parallel with each other and parallel with the surface of the substrate, and a first distance between adjacent first metal nanowires is less than a second distance between adjacent first metal nanowire bundles; wherein each of the plurality of first metal nanowire bundles further comprises a plurality of second metal nanowires randomly arranged and in contact with the plurality of first metal nanowires; the plurality of first metal nanowire bundles and the plurality of first metal nanowires have the same length, and the plurality of second metal nanowires is shorter than the plurality of first metal nanowires. 2. The metal nanowire structure of claim 1 , wherein the first distance ranges from about 0 nanometers to about 50 nanometers; and the second distance ranges from about 10 micrometers to about 100 micrometers. 3. The metal nanowire structure of claim 1 , wherein a first width of each of the plurality of first metal nanowire bundles ranges from about 50 micrometers to about 500 micrometers; and a second width of each of the plurality of first metal nanowires ranges from about 0.5 nanometers to about 50 nanometers. 4. The metal nanowire structure of claim 1 , wherein a material of the plurality of first metal nanowires is selected from the group consisting of gold, silver, copper, iron, aluminum, nickel and chromium. 5. The metal nanowire structure of claim 1 , wherein the substrate comprises rigid materials selected from the group consisting of silicon, ceramic, glass, quartz, diamond, metal oxide and plastic. 6. The metal nanowire structure of claim 1 , wherein the substrate comprises flexible materials selected from the group consisting of polycarbonate, polymethyl methacrylate acrylic, polyethylene terephthalate, polyether polysulfones, polyvinyl polychloride, benzocyclobutenes, polyesters, polyimide, polyethylene, acrylonitrile-butadiene-styrene copolymer, polyamide, polybutylene terephthalate, and acrylic resins.

Assignees

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Classifications

  • Alloys based on copper · CPC title

  • Carbon · CPC title

  • Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00 · CPC title

  • Au · CPC title

  • Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material · CPC title

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What does patent US10124561B2 cover?
The disclosure relates to a metal nanowire structure. The metal nanowire structure includes a substrate and a metal nanowire film located on the substrate. The metal nanowire film includes a number of first metal nanowires parallel with and spaced from each other. A width of each of the plurality of first metal nanowires is in a range from about 0.5 nanometers to about 50 nanometers. Each of th…
Who is the assignee on this patent?
Univ Tsinghua, Hon Hai Prec Ind Co Ltd
What technology area does this patent fall under?
Primary CPC classification B32B15/08. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 13 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).