Apparatuses and methods for seaming substrates

US10123910B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10123910-B2
Application numberUS-201615049165-A
CountryUS
Kind codeB2
Filing dateFeb 22, 2016
Priority dateFeb 22, 2012
Publication dateNov 13, 2018
Grant dateNov 13, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of joining substrate portions includes positioning the substrate portions such that the substrate portions overlap at an overlap area. The substrate portions each have a melting temperature and an outer surface. A fluid is heated to a temperature sufficient to at least partially melt the substrate portions. A jet of the heated fluid is directed from a fluid orifice onto the substrate portions at the overlap area. The heated fluid penetrates at least one of the outer surfaces of the substrate portions. The substrate portions are at least partially melted using the heated fluid. The substrate portions are compressed to join the substrate portions together at the overlap area.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for forming a seam, the method comprising: rotating a heating cylinder about an axis of rotation, the heating cylinder comprising a plurality of fluid outlets disposed about the periphery of the heating cylinder, wherein each of the plurality of fluid outlets are in communication with a fluid chamber; advancing a first substrate in a machine direction on the heating cylinder; advancing a second substrate in the machine direction wherein the first substrate is between the second substrate and the heating cylinder; heating a fluid within the fluid chamber to a temperature sufficient to at least partially melt the substrates; directing a jet of the heated fluid through the plurality of fluid outlets and onto overlap areas of the first and second substrates; rotating the heating cylinder such that the first substrate and the second substrate travel a predetermined contact angle about the heating cylinder; partially melting the overlap areas; removing the first and second substrates from the heating cylinder wherein a seam has not yet been formed; thereafter advancing the first and second substrates to a nip formed between an anvil cylinder and a pressure applying cylinder both of which being distinct from the heating cylinder; rotating the anvil cylinder and the pressure applying cylinder, wherein the pressure applying cylinder comprises a plurality of pressure applying members; and compressing the overlap areas in a nip between the plurality of pressure applying members and the anvil cylinder to form a seam. 2. The method of claim 1 , wherein the predetermined contact angle is greater than about 45 degrees. 3. The method of claim 1 , wherein the predetermined contact angle is about 45 degrees.

Assignees

Inventors

Classifications

  • Cam mechanisms; Wedges; Eccentric mechanisms · CPC title

  • characterised by the composition of the plastics material of the parts to be joined (welding bar compositions B29C65/125) · CPC title

  • Pneumatic or hydraulic drives (using fluid pressure directly acting on the parts to be joined B29C66/8266) · CPC title

  • Joining the articles to themselves (B29C66/4322 and B29C66/4332 take precedence) · CPC title

  • Textile or other fibrous material made from plastics · CPC title

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What does patent US10123910B2 cover?
A method of joining substrate portions includes positioning the substrate portions such that the substrate portions overlap at an overlap area. The substrate portions each have a melting temperature and an outer surface. A fluid is heated to a temperature sufficient to at least partially melt the substrate portions. A jet of the heated fluid is directed from a fluid orifice onto the substrate p…
Who is the assignee on this patent?
Procter & Gamble, The Procter & Gamble Plaza
What technology area does this patent fall under?
Primary CPC classification A61F13/15739. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Nov 13 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).