Thermal Module

US10123459B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10123459-B2
Application numberUS-201715436869-A
CountryUS
Kind codeB2
Filing dateFeb 20, 2017
Priority dateFeb 20, 2017
Publication dateNov 6, 2018
Grant dateNov 6, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are assembled and disposed in the receiving space. At least one protrusion section protrudes from one side of the first radiating fin assembly. The protrusion section is formed with a first slope and a second slope. The second radiating fin assembly is assembled with the first radiating fin assembly. At least one notch is formed on one side of the second radiating fin assembly corresponding to the protrusion section. The notch is formed with a third slope and a fourth slope. The third slope is in contact with the first slope. A gap is defined between the fourth and second slopes. An open space is defined between the first and second radiating fin assemblies in communication with the gap.

First claim

Opening claim text (preview).

What is claimed is: 1. A thermal module comprising: a heat dissipation unit having a first main body and a second main body, the first main body having a first surface and a second surface, the second main body having a third surface and a fourth surface, two ends of a tubular body being respectively connected with the first and third surfaces, the first and second main bodies and the tubular body together defining a receiving space; a first radiating fin assembly disposed in the receiving space, at least one protrusion section protruding from one side of the first radiating fin assembly, the protrusion section being formed with a first slope and a second slope and having a free protrusion end; and a second radiating fin assembly disposed in the receiving space and assembled with the first radiating fin assembly, at least one notch being formed on one side of the second radiating fin assembly accepting the protrusion section, the notch being formed with a third slope and a fourth slope, the third slope being in contact with the first slope, the free protrusion end of the protrusion section being positioned along the third slope spaced from the fourth shape to separate the first radiating fin assembly and the second radiating fin assembly in the receiving space, a gap being formed between the fourth and second slopes, a separated space being defined between the first and second radiating fin assemblies in communication with the gap. 2. The thermal module as claimed in claim 1 , wherein the first radiating fin assembly is composed of multiple first radiating fins and the second radiating fin assembly is composed of multiple second radiating fins. 3. The thermal module as claimed in claim 1 , wherein the first radiating fin assembly has a first side and a second side and the second radiating fin assembly has a third side and a fourth side, the protrusion section protruding from the second side, the notch being formed on the third side corresponding to the protrusion section. 4. The thermal module as claimed in claim 3 , wherein the second side further has at least one engagement recess and the third side further has at least one connection section, the connection section being correspondingly engaged in the engagement recess. 5. The thermal module as claimed in claim 3 , wherein the first radiating fin assembly further has a first end and a second end and the second radiating fin assembly further has a third end and a fourth end, the first and third ends being flush with each other, the second and fourth ends being flush with each other. 6. The thermal module as claimed in claim 1 , wherein the first and second slopes have unequal lengths and the third and fourth slopes have unequal lengths.

Assignees

Inventors

Classifications

  • Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

  • the means being attachable to the element (F28F1/32 takes precedence) · CPC title

  • the means being integral with the element (F28F1/32 takes precedence) · CPC title

  • by using form fitting connection, e.g. with tongue and groove · CPC title

  • by clamping or clipping · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10123459B2 cover?
A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are assembled and disposed in the receiving space. At least one protrusion section protrudes from one side of the first radiating fin assembly. The protrusion section is formed with a first slope and a second…
Who is the assignee on this patent?
Asia Vital Components Co Ltd
What technology area does this patent fall under?
Primary CPC classification H05K7/20418. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).