Cooling apparatus and electronic device

Patent metadata

Field	Value
Publication number	US-10123457-B2
Application number	US-201715606166-A
Country	US
Kind code	B2
Filing date	May 26, 2017
Priority date	Feb 9, 2015
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

A cooling apparatus includes: an evaporator in which a coolant is housed and that evaporates the coolant; a condenser that condenses the coolant evaporated by the evaporator; a pathway section that includes a vapor path and a liquid path each placing the inside of the evaporator and the inside of the condenser in communication with each other, and that circulates the coolant between the evaporator and the condenser; a valve that is provided to at least one path out of the vapor path or the liquid path; and a pressure regulation section that increases an opening amount of the valve according to an increase in pressure inside the evaporator.

First claim

What is claimed is:

1. A cooling apparatus, comprising:
an evaporator in which a coolant is housed and that evaporates the coolant;
a condenser that condenses the coolant evaporated by the evaporator;
a pathway section that includes a vapor path and a liquid path each placing an inside of the evaporator and an inside of the condenser in communication with each other, and that circulates the coolant between the evaporator and the condenser;
a valve that is provided to at least one path out of the vapor path or the liquid path; and
a pressure transmission section that includes a pressure transmission path in communication with the inside of the evaporator, and that includes a pressure-actuation space formed on a part of the vapor path and in communication with the inside of the evaporator through the pressure transmission path, the pressure transmission section increases an opening amount of the valve as a pressure in the pressure-actuation space increases.

2. The cooling apparatus of claim 1 , wherein the valve is a diaphragm forming a wall of the pressure-actuation space.

3. The cooling apparatus of claim 1 , wherein the valve is provided adjoining the pressure-actuation space.

4. The cooling apparatus of claim 1 , wherein an outlet port of the pressure transmission path faces in a direction of flow of the coolant in the vapor path.

5. The cooling apparatus of claim 1 , wherein the valve is provided at an end portion on the evaporator side of the vapor path.

6. The cooling apparatus of claim 1 , wherein the pressure transmission section includes a pressure transmission duct through which the pressure transmission path is formed.

7. The cooling apparatus of claim 1 , wherein an inlet port area of the pressure transmission path is smaller than an inlet port area of the vapor path.

8. An electronic device, comprising:
an electronic component that is a heat generating body;
an evaporator that is in thermal contact with the electronic component, in which a coolant is housed, and that evaporates the coolant using heat from the electronic component;
a condenser that condenses the coolant;
a pathway section that includes a vapor path and a liquid path each placing an inside of the evaporator and an inside of the condenser in communication with each other, and that circulates the coolant between the evaporator and the condenser;
a valve that is provided to at least one path out of the vapor path or the liquid path; and
a pressure transmission section that includes a pressure transmission path in communication with the inside of the evaporator, and that includes a pressure-actuation space formed on a part of the vapor path and in communication with the inside of the evaporator through the pressure transmission path, the pressure transmission section increases an opening amount of the valve as a pressure in the pressure-actuation space increases.

Assignees

• Fujitsu Ltd

Inventors

• Hayashi Nobuyuki
• Nakanishi Teru
• Kimura Takahiro

Classifications

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• F28F2265/12

  for preventing overpressure · CPC title

• H05K7/20318

  Condensers · CPC title