Transmission line structure having orthogonally oriented transmission line segments connected by vias extending through a substrate body

Patent metadata

Field	Value
Publication number	US-10123407-B2
Application number	US-201615293225-A
Country	US
Kind code	B2
Filing date	Oct 13, 2016
Priority date	Jun 17, 2016
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

A structure of transmission line includes a first transmission line, a second transmission line and an interlayer via. The first transmission line includes a first line segment, a second segment and a first signal via. The second transmission line includes a third line segment, a fourth segment and a second signal via. Both of the first line segment and the third line segment are disposed in a first signal transmission layer and extend along a first direction. Both of the second line segment and the fourth line segment are disposed in a second signal transmission layer and extend along a second direction. The first signal via is connected to the first line segment and the second line segment. The second signal via is connected to the third line segment and the fourth line segment. The interlayer via is adjacent to the first line segment or the second line segment.

First claim

What is claimed is:

1. A structure of a transmission line adapted for a substrate having a body, a first signal transmission layer, a second signal transmission layer, wherein the first signal transmission layer and the second signal transmission layer are disposed in parallel and insulated from each other, the structure of the transmission line, comprising:
a first transmission line, comprising:
a first line segment disposed in the first signal transmission layer and extending along a first direction;
a second line segment disposed in the second signal transmission layer and extending along a second direction perpendicular to the first direction; and
a first signal via disposed in the body and perpendicular to the first signal transmission layer and connected to the first line segment and the second line segment;

a second transmission line, comprising:
a third line segment disposed in the first signal transmission layer and extending along the first direction and partially overlapped by an orthogonal projection of the second line segment onto the first signal transmission layer;
a fourth line segment disposed in the second signal transmission layer and extending along the second direction; and
a second signal via disposed in the body and perpendicular to the first signal transmission layer and connected to the third line segment and the fourth line segment; and

at least one inter-layer via adjacent to the first line segment or the third line segment and disposed within a predetermined distance from the first signal via and perpendicularly connected to the first signal transmission layer and the second signal transmission layer;
wherein both the first signal transmission layer and the second signal transmission layer are disposed in the body, and the body has a first dielectric coefficient, and
wherein the at least one inter-layer via has a second dielectric coefficient less than the first dielectric coefficient.

2. The structure of the transmission line according to claim 1 , wherein an orthogonal projection of the fourth line segment onto the first signal transmission layer is not overlapping with the first line segment.

3. The structure of the transmission line according to claim 1 , wherein the at least one inter-layer via is an air via.

4. A structure of a transmission line adapted for a substrate having a body, a first signal transmission layer, a second signal transmission layer, wherein the first signal transmission layer and the second signal transmission layer are disposed in parallel and insulated from each other, the structure of the transmission line, comprising:
a first transmission line, comprising:
a first line segment disposed in the first signal transmission layer and extending along a first direction;
a second line segment disposed in the second signal transmission layer and extending along a second direction perpendicular to the first direction; and
a first signal via disposed in the body and perpendicular to the first signal transmission layer and connected to the first line segment and the second line segment;

a second transmission line, comprising:
a third line segment disposed in the first signal transmission layer and extending along the first direction and partially overlapped by an orthogonal projection of the second line segment onto the first signal transmission layer;
a fourth line segment disposed in the second signal transmission layer and extending along the second direction; and
a second signal via disposed in the body and perpendicular to the first signal transmission layer and connected to the third line segment and the fourth line segment; and

at least one inter-layer via adjacent to the first line segment or the third line segment and disposed within a predetermined distance from the first signal via and perpendicularly connected to the first signal transmission layer and the second signal transmission layer;
wherein both the first signal transmission layer and the second signal transmission layer are disposed in the body, and the body has a first dielectric coefficient;
wherein the first signal via has a first diameter, the second signal via has a second diameter, the at least one inter-layer via has a third diameter, the first diameter and the second diameter are both less than the third diameter.

5. The structure of the transmission line according to claim 4 , wherein the first diameter and the second diameter are both one third of the third diameter.

6. The structure of the transmission line according to claim 4 , wherein the substrate further has a first grounding layer and a second grounding layer, the first grounding layer is between the first signal transmission layer and the second signal transmission layer, the first grounding layer has a first through hole corresponding to the first signal via and a second through hole corresponding to the second signal via, and the second signal transmission layer is between the first grounding layer and the second grounding layer.

7. The structure of the transmission line according to claim 6 , wherein the first through hole has a fourth diameter, the second through hole has a fifth diameter, the fourth diameter is four times the first diameter, and the fifth diameter is four times the second diameter.

8. The structure of the transmission line according to claim 6 , further comprising:
a plurality of grounding vias perpendicularly connected to the first grounding layer and the second grounding layer.

Assignees

• Univ Chung Yuan Christian

Inventors

• Shiue Guang-Hwa

Classifications

• H01P3/081

  Microstriplines · CPC title

• H01P3/08

  Microstrips; Strip lines · CPC title

• H01P5/04

  with variable factor of coupling · CPC title

• H01P1/20381 Primary

  Special shape resonators · CPC title

• H01P9/003

  Delay equalizers · CPC title