MEMS device and process

Patent metadata

Field	Value
Publication number	US-10123129-B2
Application number	US-201715398251-A
Country	US
Kind code	B2
Filing date	Jan 4, 2017
Priority date	Sep 24, 2012
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic shock. The application describes a MEMS transducer having a flexible membrane (101) supported relative to a first surface of a substrate (105) which has one or more cavities therein, e.g. to provide an acoustic volume. A stop structure (401, 402) is positioned so as to be contactable by the membrane when deflected so as to limit the amount of deflection of the membrane. The stop structure defines one or more openings to the one or more substrate cavities and comprises at least one narrow support element (401, 402) within or between said one or more openings. The stop structure thus limits the amount of membrane deflection, thus reducing the stress experienced at the edges and prevents the membrane from contacting a sharp edge of a substrate cavity. As the stop structure comprises narrow support elements any performance impact on the transducer is limited.

First claim

The invention claimed is:

1. A MEMS transducer comprising:
a flexible membrane supported above an upper surface of a substrate, the substrate having one or more cavities therein;
a back-plate structure, wherein the membrane layer is supported to be flexible with respect to said back-plate structure; and
a stop structure positioned on the opposite side of the membrane to the back-plate structure, so as to be contactable by the membrane when deflected so as to limit the amount of deflection of the membrane in a downward direction towards the upper surface of the substrate.

2. A MEMS transducer as claimed in claim 1 , wherein the stop structure defines one or more openings to said one or more cavities and comprises at least one narrow support element within or between said one or more openings.

3. A MEMS transducer as claimed in claim 2 wherein, within a plane parallel to said first surface, the total area of said at least one narrow support elements within or between said one or more openings is less than the total area of said one or more openings.

4. A MEMS transducer as claimed in claim 2 wherein at least one of said support narrow elements extends from a side wall defining said one or more openings.

5. A MEMS transducer as claimed in claim 4 wherein at least one narrow support element comprises a beam structure.

6. A MEMS transducer as claimed in claim 4 wherein there are at least three said narrow support elements extending from a side wall defining said one or more openings.

7. A MEMS transducer as claimed in claim 6 wherein said narrow support elements extending from a side wall are substantially regularly spaced around the perimeter of said one or more openings.

8. A MEMS transducer as claimed in claim 2 said at least one narrow support element forms a contact element positioned such that the membrane will make contact with the contact element if subject to a relatively large deflection towards the first surface.

9. A MEMS transducer as claimed in claim 8 wherein said contact element is ring-shaped.

10. A MEMS transducer as claimed in claim 2 wherein said at least one narrow support element has a width within a plane parallel to the first surface of 100 μm or less.

11. A MEMS transducer as claimed in claim 2 wherein said at least one narrow support element has a width that tapers, such that the element is narrowest at the face which is nearest to the membrane.

12. A MEMS transducer as claimed in claim 1 wherein the stop structure does not extend all the way through the substrate.

13. A MEMS transducer as claimed in claim 1 wherein the stop structure has a thickness in a direction perpendicular to said first surface which is 50 μm or greater.

14. A MEMS transducer as claimed in claim 1 wherein the stop structure comprises a layer of patterned dielectric material.

15. A MEMS transducer as claimed in claim 1 wherein the stop structure comprises a layer of semiconductor material that forms a substrate for the transducer.

16. A MEMS transducer as claimed in claim 1 wherein said transducer comprises a microphone.

17. An electronic device comprising a MEMS transducer as claimed in claim 1 wherein said device is at least one of: a portable device; a battery powered device; an audio device; a computing device; a communications device; a personal media player; a mobile telephone; a games device; and a voice controlled device.

Assignees

• Cirrus Logic Int Semiconductor Ltd
• Cirrus Logic Inc

Inventors

• Hoekstra Tsjerk
• Hesketh Mark

Classifications

• B81B3/0021

  Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00) · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• H04R2207/021

  Diaphragm extensions, not necessarily integrally formed, e.g. skirts, rims, flanges · CPC title

• H04R1/2892

  Mountings or supports for transducers · CPC title

• H04R31/003

  for diaphragms or their outer suspension · CPC title