Earbud assembly with overmolded seam cover

US10123108B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10123108-B2
Application numberUS-201615161130-A
CountryUS
Kind codeB2
Filing dateMay 20, 2016
Priority dateDec 31, 2015
Publication dateNov 6, 2018
Grant dateNov 6, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An earbud assembly with separate, flexible overmold sections configured to cover a seam between adjacent portions of an underling earbud housing. The earbud assembly includes a first housing member and a second housing member attached to the first housing member and forming enclosure with the first housing member that houses an audio transducer. A first flexible overmold is formed on an first exterior surface of the first housing member, and a second flexible overmold is formed on an exterior surface of the second housing member. The flexible overmolds each include an edge portion along their perimeters. Each edge portion is configured to abut the other and thereby cover the seam of the earbud housing.

First claim

Opening claim text (preview).

We claim: 1. An earbud assembly, comprising: a first housing member having a first exterior surface and a first outer edge; a second housing member attached to the first housing member, the second housing member having a second exterior surface and forming an enclosure with the first housing member that houses an audio transducer, the second housing member having a second outer edge adjacent the first outer edge to form a seam between the first and second housing members, and the enclosure having a recess adjacent the seam; a first flexible cover on the first exterior surface of the first housing member; and a second flexible cover on the second exterior surface of the second housing member, wherein the first flexible cover includes a first perimeter and a first edge portion along the first perimeter and a portion of the first perimeter is in the recess, and the second flexible cover includes a second perimeter and a second edge portion along the second perimeter and a second edge portion along the second perimeter is in the recess, and wherein the first edge portion is configured to abut the second edge portion in a compressive fit in the recess and at least partially cover the seam between the first and second housing members. 2. The earbud assembly of claim 1 wherein: the first housing member includes a first portion of the recess adjacent the seam; the second housing member includes a second portion of the recess adjacent the first portion of the recess; the first edge portion extends into the first portion of the recess; and the second edge portion extends into the second portion of the recess. 3. The earbud assembly of claim 1 wherein the first housing member includes a first portion of the recess adjacent the seam, and wherein the first edge portion of the first flexible cover extends into the first portion of the recess. 4. The earbud assembly of claim 3 wherein the first edge portion has a first thickness in the first portion of the recess, and wherein the first flexible cover has a second thickness less than the first thickness outside of the recess. 5. The earbud assembly of claim 1 , wherein the first housing member further includes an attachment feature adjacent the recess and configured to attach the first housing member to the second housing member. 6. The earbud assembly of claim 5 wherein the attachment feature is bonded to the second housing member beneath the first and second edge portions of the corresponding first and second flexible covers. 7. An earbud assembly, comprising: a housing having a first housing member with a first outer edge and a second housing member with a second outer edge attached to the first outer edge, wherein the housing has an annular recess and the first and second outer edges form a seam adjacent the annular recess, and wherein an audio transducer is at least partially enclosed within the housing; a first overmold formed over the first housing member and terminating at a first lip proximate the first outer edge of the first housing member, wherein at least a portion of the first lip is in the annular recess; and a second overmold formed over the second housing member and terminating at a second lip proximate the second outer edge of the second housing member, wherein at least a portion of the second lip is in the annular recess and wherein the second lip abuts the first lip at the annular recess in a compression fit. 8. The earbud assembly of claim 7 wherein portions of the annular recess are formed in the first and second housing members adjacent the first and second outer edges. 9. The earbud assembly of claim 7 wherein the housing comprises an injection-molded plastic, and wherein each of the first and second overmolds comprises silicone rubber. 10. A method of manufacturing an earbud assembly, the method comprising: forming a first flexible cover over an exterior surface of a first housing member; forming a second flexible cover over an exterior surface of a second housing member; and attaching the second housing member to the first housing member to form an enclosure around an audio transducer, wherein the enclosure has an annular recess at a junction between the first and second housing members and wherein attaching the second housing member includes pressing a first edge portion of the first flexible cover into contact with a second edge portion of the second flexible cover in a compression fit and at least partially within the annular recess to cover a seam. 11. The method of claim 10 wherein portions of the annular recess proximate the seam are formed in the first and second housing members adjacent the first and second edge portions. 12. The method of claim 10 wherein attaching the second housing member to the first housing member includes bonding the second housing member to the first housing member while pressing the first edge portion of the first flexible cover into contact with the second edge portion of the second flexible cover. 13. The method of claim 10 wherein the first housing member includes a first outer edge that defines the seam with a second outer edge of the second housing member, and wherein forming the first flexible cover includes forming the first edge portion of the first flexible cover flush with the first outer edge of the first housing member. 14. The method of claim 10 wherein the first housing member includes a first outer edge that defines the seam with a second outer edge of the second housing member, and wherein forming the first flexible cover includes forming the first edge portion of the first flexible cover such that the first edge portion projects beyond the first outer edge of the first housing member. 15. The method of claim 10 wherein forming the first and second flexible covers includes overmolding silicon rubber onto the corresponding first and second housing members.

Assignees

Inventors

Classifications

  • H04R1/1058Primary

    Manufacture or assembly · CPC title

  • Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops · CPC title

  • Mountings of transducers in earphones or headphones · CPC title

  • Cables or cables storage, e.g. cable reels (cord reels per se H02G11/02; arrangements for storing and repeatedly paying-out and re-storing lengths of conductors or cables B65H75/34; extensible conductors or cables, e.g. self-coiling cords H01B7/06) · CPC title

  • Earpieces of the intra-aural type · CPC title

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What does patent US10123108B2 cover?
An earbud assembly with separate, flexible overmold sections configured to cover a seam between adjacent portions of an underling earbud housing. The earbud assembly includes a first housing member and a second housing member attached to the first housing member and forming enclosure with the first housing member that houses an audio transducer. A first flexible overmold is formed on an first e…
Who is the assignee on this patent?
Oculus Vr Llc
What technology area does this patent fall under?
Primary CPC classification H04R1/1058. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).