Method of manufacturing an electrode for an energy storage device

US10121606B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10121606-B2
Application numberUS-201615151088-A
CountryUS
Kind codeB2
Filing dateMay 10, 2016
Priority dateJun 25, 2010
Publication dateNov 6, 2018
Grant dateNov 6, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode can be soldered to a Cu negative electrode, which is composed of metal that is different species from Al, through a Sn layer or a Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. The contacting area is increased in comparison with the conventional jointing by spot-welding or conventional fastening by a bolt so that the resistance value at the contacting point is reduced.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of manufacturing an electrode for an energy storage device, the method comprising: degreasing a surface of a positive electrode containing Al by using an organic solvent; thereafter, etching the surface of the positive electrode degreased in the step of degreasing, by using an etchant; thereafter, forming a Zn plating on the surface of the positive electrode etched in the step of etching, by using a liquid zincate; thereafter, forming a Ni plating on a surface of the Zn plating formed in the step of forming a Zn plating, by using a Ni plating solution; and thereafter, forming a Sn plating on a surface of the Ni plating formed in the step of forming a Ni plating, by using a Sn plating solution. 2. The method of manufacturing an electrode for an energy storage device according to claim 1 wherein the step of forming a Zn plating on the surface of the positive electrode by using a liquid zincate is performed at least two times. 3. The method of manufacturing an electrode for an energy storage device according to claim 2 wherein the step of forming a Zn plating on the surface of the positive electrode by using a liquid zincate includes forming a layer of Zn or Zn alloy having a thickness of 0.05 through 0.1 μm. 4. The method of manufacturing an electrode for an energy storage device according to claim 1 wherein the step of forming a Zn plating on the surface of the positive electrode by using a liquid zincate includes forming a layer of Zn or Zn alloy having a thickness of 0.05 through 0.1 μm.

Assignees

Inventors

Classifications

  • characterised by the material of the leads or tabs · CPC title

  • containing more than 50% by weight of zinc · CPC title

  • of nickel or cobalt · CPC title

  • Electricity · mapped topic

  • characterised by structural features of the materials making up or comprised in the electrodes, e.g. form, surface area or porosity; characterised by the structural features of powders or particles used therefor · CPC title

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What does patent US10121606B2 cover?
An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode …
Who is the assignee on this patent?
Senju Metal Industry Co
What technology area does this patent fall under?
Primary CPC classification C23C18/1651. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).