Multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-10121595-B2
Application number	US-201715708469-A
Country	US
Kind code	B2
Filing date	Sep 19, 2017
Priority date	Sep 20, 2016
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

A multilayer ceramic electronic component includes a first plating layer in contact with a first organic layer and a second plating layer in contact with a second organic layer. When the first organic layer disposed on a first base electrode layer located on a first principal surface or a second principal surface, or the second organic layer disposed on a second base electrode layer located thereon, is referred to as an organic layer principal surface portion, and when the first organic layer disposed on the first base electrode layer located on a first end surface or a second end surface, or the second organic layer disposed on the second base electrode layer located thereon, is referred to as an organic layer end surface portion, the surface roughness of the organic layer end surface portion is larger than the surface roughness of the organic layer principal surface portion.

First claim

What is claimed is:

1. A multilayer ceramic electronic component comprising:
a laminated body including:
a plurality of laminated dielectric layers and a plurality of laminated internal electrodes;
a first principal surface and a second principal surface opposite to one another in a laminating direction;
a first side surface and a second side surface opposite to one another in a width direction perpendicular to the laminating direction; and
a first end surface and a second end surface opposite to one another in a length direction perpendicular to the laminating direction and the width direction;

a first external electrode connected to the plurality of laminated internal electrodes, and disposed on the first end surface, with an end extending on the first principal surface, the second principal surface, the first side surface, and the second side surface;
a second external electrode connected to the plurality of laminated internal electrodes, and disposed on the second end surface, with an end extending on the first principal surface, the second principal surface, the first side surface, and the second side surface; wherein
the first external electrode includes a first base electrode layer including a conductive metal and a glass component, a first organic layer including an organic silicon compound, disposed to cover the first base electrode layer, and a first plating layer disposed on the first organic layer;
the second external electrode includes a second base electrode layer including a conductive metal and a glass component, a second organic layer including an organic silicon compound, disposed to cover the second base electrode layer, and a second plating layer disposed on the second organic layer;
the first organic layer is disposed to cover from the first base electrode layer to at least a portion of a surface of the laminated body, and the second organic layer is disposed to cover from the second base electrode layer to at least a portion of a surface of the laminated body;
a leading end of the first plating layer is in contact with the first organic layer, and a leading end of the second plating layer is in contact with the second organic layer; and
when the first organic layer disposed on the first base electrode layer located on the first principal surface or the second principal surface, or the second organic layer disposed on the second base electrode layer located thereon, is referred to as an organic layer of a principal surface portion, and the first organic layer disposed on the first base electrode layer located on the first end surface or the second end surface, or the second organic layer disposed on the second base electrode layer located thereon, is referred to as an organic layer of an end surface portion, a surface roughness of the organic layer of the end surface portion is larger than a surface roughness of the organic layer of the principal surface portion.

2. The multilayer ceramic electronic component according to claim 1 , wherein the organic layer of the principal surface portion has a surface roughness Ra of about 0.1 μm or more and about 0.5 μm or less, and the organic layer of the end surface portion has a surface roughness Ra of about 0.6 μm or more and about 2.0 μm or less.

3. The multilayer ceramic electronic component according to of claim 1 , wherein
an adhesion strength between the laminated body and the first base electrode layer is higher than an adhesion strength between the first organic layer and the first plating layer; and
an adhesion strength between the laminated body and the second base electrode layer is higher than an adhesion strength between the second organic layer and the second plating layer.

4. The multilayer ceramic electronic component according to claim 1 , wherein
an adhesion strength between the laminated body and the first organic layer is higher than an adhesion strength between the first organic layer and the first plating layer; and
an adhesion strength between the laminated body and the second organic layer is higher than an adhesion strength between the second organic layer and the second plating layer.

5. The multilayer ceramic electronic component according to claim 1 , wherein the first organic layer and the second organic layer include an organic silicon compound that includes a structure of multifunctional alkoxysilane Si—(C n H 2n+1 ) 3 , and includes an N element.

6. The multilayer ceramic electronic component according to claim 1 , wherein an atomic concentration of Si to Cu is about 1% or more and about 5% or less between a Cu concentration and an Si concentration at surfaces of the first organic layer and of the second organic layer.

7. The multilayer ceramic electronic component according to claim 1 , wherein the multilayer ceramic electronic component is a multilayer ceramic capacitor.

8. The multilayer ceramic electronic component according to claim 1 , wherein the first plating layer includes multiple layers and the second plating layer includes multiple layers.

9. The multilayer ceramic electronic component according to claim 8 , wherein
the multiple layers of the first plating layer include plating layers made of at least one selected from Cu, Ni, Ag, Pd, Ag—Pd alloy, Au, and Sn; and
the multiple layers of the second plating layer include plating layers made of at least one selected from Cu, Ni, Ag, Pd, Ag—Pd alloy, Au, and Sn.

10. The multilayer ceramic electronic component according to claim 8 , wherein
the multiple layers of the first plating layer include a first Ni plating layer and a first Sn plating layer; and
the multiple layers of the second plating layer include a second Ni plating layer and a second Sn plating layer.

11. The multilayer ceramic electronic component according to claim 8 , wherein
the multiple layers of the first plating layer each include leading edges which are in contact with a surface of the first organic layer; and
the multiple layers of the second plating layer each include leading edges which are in contact with a surface of the second organic layer.

12. The multilayer ceramic electronic component according to claim 8 , wherein
the multiple layers of the first plating layer each have a thickness of about 1 μm or more and about 15 μm or less; and
the multiple layers of the second plating layer each have a thickness of about 1 μm or more and about 15 μm or less.

13. The multilayer ceramic electronic component according to claim 1 , wherein a gap is provided between the first organic layer and the second organic layer such that a portion of the principal surface is exposed.

14. The multilayer ceramic electronic component according to claim 13 , wherein the first organic layer and the second organic layer include an organic silicon compound that includes a structure of multifunctional alkoxysilane Si—(C n H 2n+1 ) 3 , and includes an N element.

15. The multilayer ceramic electronic component according to claim 1 , wherein the first organic layer and the second organic layer contact one another such that no portion of the principal surface is exposed.

16. The multilayer ceramic electronic component according to claim 15 , wherein the first organic layer and the second organic layer include an organic silicon compound that includes a structure of multifunctional alkoxysilane Si—(C n H 2n+1 ) 3 , and includes an N element.

17. The multilayer ceramic electronic component according to claim 1 , wherein
a portion of the first organic layer in contact with the laminated body has a dimension in a length direction of a leading end of the first bas

Assignees

• Murata Manufacturing Co

Inventors

• HAMAMORI Nobuyasu
• Asano Hiroshi
• Nomura Yoshiyuki
• Matsushita Koji
• Okamura Ichitaro

Classifications

• H01G4/005

  Electrodes · CPC title

• H01G4/14

  Organic dielectrics · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title