Gluing device, gluing method and colloid for packaging devices

US10121580B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10121580-B2
Application numberUS-201414436317-A
CountryUS
Kind codeB2
Filing dateJul 31, 2014
Priority dateMar 28, 2014
Publication dateNov 6, 2018
Grant dateNov 6, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure provides a gluing device, a gluing method and a colloid for packaging devices. The gluing device includes an instillation head configured to guide a glue added with magnetic material in an instillation direction; and a magnetic field generation mechanism configured to apply a magnetic field within the instillation head, so as to apply a force to the magnetic material through the magnetic field in a direction identical to or opposite to the instillation direction. Thus a flow rate of the glue in the instillation direction is controlled through the force applied by the magnetic material to the glue. The glue in the gluing device may be smoothly dripped out at a constant flow rate, thereby to prevent the occurrence of discontinuous or thin glue lines in the related art due to an insufficient pressure during gluing.

First claim

Opening claim text (preview).

What is claimed is: 1. A gluing device comprising: an instillation head configured to guide a glue added with magnetic material in an instillation direction; a magnetic field generation mechanism comprising an electromagnetic coil configured to apply a magnetic field within the instillation head, so as to apply a force to the magnetic material through the magnetic field in a direction identical to or opposite to the instillation direction; a monitoring mechanism configured to monitor a total current change in the electromagnetic coil to determine a change in an induction current in the magnetic field, and calculate a flow rate of the glue in the instillation direction in accordance with the change in the induction current; and a controller configured to regulate a current supplied to the magnetic field generation mechanism in accordance with a difference between the flow rate of the glue provided by the monitoring mechanism and a desired flow rate; wherein the gluing device further includes a driving mechanism configured to apply a pressure onto the glue within the instillation head so as to move the glue toward the instillation outlet in the instillation direction, and the driving mechanism includes a slidable screw in the instillation head and a slidable plate in the instillation head; the slidable screw is perpendicularly mounted to the slidable plate. 2. The gluing device according to claim 1 , wherein the electromagnetic coil surrounds the instillation head. 3. The gluing device according to claim 1 , wherein the instillation head comprises an instillation outlet and a tube body connected to the instillation outlet; and the electromagnetic coil surrounds a periphery of the tube body; and the slidable screw is in the tube body; and the slidable plate is slidable in the tube body along an axis direction of the tube body, and an outer circumference of the slidable plate is in contact with an inner wall of the tube body. 4. The gluing device according to claim 1 , wherein the magnetic material is of a particle size of 5 to 15 μm, and a weight percentage of the magnetic material relative to the glue is less than 5%. 5. The gluing device according to claim 1 , wherein the magnetic material is NdFeB rare earth magnet. 6. A gluing method comprising: adding magnetic material into a glue to be instilled in such a manner that the magnetic material is dispersed in the glue; applying a magnetic field with an electromagnetic coil in an instillation head filled with the glue when the glue is being instilled, so as to apply a force to the magnetic material through the magnetic field in a direction identical to or opposite to an instillation direction; applying a pressure onto the glue within the instillation head by driving a slidable screw with a slidable plate perpendicularly mounted to the slidable screw in the instillation head to move relative to the instillation head, thereby moving the glue toward the instillation outlet in the installation direction; monitoring a total current change in the electromagnetic coil to determine a change in an induction current of the magnetic field, and calculating a flow rate of the glue in the instillation direction in accordance with the change in the induction current; and regulating a current for generating the magnetic field in accordance with a difference between the flow rate of the glue and a desired flow rate. 7. The gluing method according to claim 6 , wherein the step of applying the magnetic field with the electromagnetic coil in the instillation head filled with the glue comprises surrounding the instillation head with the electromagnetic coil. 8. The gluing method according to claim 6 , wherein the instillation head comprises an instillation outlet and a tube body connected to the instillation outlet; and the step of applying the magnetic field with the electromagnetic coil in the instillation head filled with the glue comprises surrounding a periphery of the tube body with the electromagnetic coil. 9. The gluing method according to claim 7 , wherein the step of applying the magnetic field with the electromagnetic coil in the instillation head filled with the glue so as to apply the force to the magnetic material through the magnetic field in a direction identical to or opposite to the instillation direction comprises: when requiring the glue to have a flow rate in the instillation direction, providing the electromagnetic coil with a current so as to move the magnetic material in the instillation direction, and changing a value of the current so as to change a value of the force applied to the magnetic material in the instillation direction; and when requiring the glue to be stationary relative to the instillation head, providing the electromagnetic coil with a current so as to move the magnetic material in a direction opposite to the instillation direction, and changing a value of the current so as to change a value of the force applied to the magnetic material in the direction opposite to the instillation direction. 10. The gluing method according to claim 6 , wherein the step of regulating the current for generating the magnetic field in accordance with the difference between the flow rate of the glue and the desired flow rate comprises: when the induction current is increased and an increment exceeds a first predetermined value, acquiring a calculation result that the flow rate of the glue is increased relative to the desired flow rate, and reducing a magnetic field intensity of the magnetic field, so as to reduce the value of the force applied by the magnetic field to the magnetic material, thereby to reduce the flow rate of the glue in the instillation direction; when the induction current is decreased and a decrement exceeds a second predetermined value, acquiring a calculation result that the flow rate of the glue is decreased relative to the desired flow rate, and increasing the magnetic field intensity of the magnetic field, so as to increase the value of the force applied by the magnetic field to the magnetic material, thereby to increase the flow rate of the glue in the instillation direction; and when the induction current is changed within a predetermined range, acquiring a calculation result that the flow rate of the glue is unchanged relative to the desired flow rate, and maintaining the magnetic field intensity of the magnetic field. 11. A gluing device comprising: an instillation head configured to guide glue having a magnetic material therein in an instillation direction; an electromagnetic coil configured to apply a magnetic field within the instillation head, so as to apply a force to the magnetic material through the magnetic field in a direction along the instillation direction; a total current charge monitoring configured to monitor a total current change in the electromagnetic coil to determine a change in an induction current in the magnetic field, and calculate a flow rate of the glue in the instillation direction in accordance with the change in the induction current; a controller configured to regulate a current supplied to the magnetic field generation mechanism in accordance with a difference between the flow rate of the glue provided by the monitoring mechanism and a desired flow rate; and a slidable screw with a slidable plate perpendicularly mounted to the slidable screw in the instillation head, the screw configured to drive the slidable plate to apply a pressure onto the glue within the instillation head so as to move the glue toward the instillation outlet in the instillation direction. 12. The gluing device according to claim 11 , wherein the electromagnetic coil surrounds the instillati

Assignees

Inventors

Classifications

  • by magnetic fields · CPC title

  • performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface · CPC title

  • inorganic · CPC title

  • Electricity · mapped topic

  • bonded together · CPC title

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Frequently asked questions

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What does patent US10121580B2 cover?
The present disclosure provides a gluing device, a gluing method and a colloid for packaging devices. The gluing device includes an instillation head configured to guide a glue added with magnetic material in an instillation direction; and a magnetic field generation mechanism configured to apply a magnetic field within the instillation head, so as to apply a force to the magnetic material thro…
Who is the assignee on this patent?
Boe Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01F7/206. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).