SYSTEM AND METHOD FOR CONTROLLING VARIOUS ASPECTS OF PCIe DIRECT ATTACHED NONVOLATILE MEMORY STORAGE SUBSYSTEMS
US-2016085458-A1 · Mar 24, 2016 · US
US10120593B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10120593-B2 |
| Application number | US-201615160212-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 20, 2016 |
| Priority date | May 22, 2015 |
| Publication date | Nov 6, 2018 |
| Grant date | Nov 6, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A method of controlling a temperature of a non-volatile storage device includes determining whether the temperature of the non-volatile storage device is greater than a control engagement temperature, and adjusting a data I/O performance level P when the temperature of the non-volatile storage device is greater than the control engagement temperature. The non-volatile storage device may operate at the maximum performance level in a range in which the non-volatile storage device is protected from heat.
Opening claim text (preview).
What is claimed is: 1. A method of controlling a temperature of a non-volatile storage device, the method comprising: detecting the temperature of the non-volatile storage device which is represented by a value measured by a temperature measuring sensor; determining whether the temperature of the non-volatile storage device is higher than a control engagement temperature; and adjusting a data I/O performance level P according to Formula 1 below if the temperature of the non-volatile storage device is higher than the control engagement temperature, P = P max × β × ( 1 - α Δ T Δ T b ) ( 1 ) wherein, P max denotes a maximum data I/O performance level of the non-volatile storage device, ΔT denotes a difference between the temperature of the non-volatile storage device and a reference temperature, ΔT b denotes a difference between a maximum threshold temperature of the non-volatile storage device and the reference temperature, wherein ΔT b is greater than zero, and α and β are control parameters of the non-volatile storage device, the non-volatile storage device comprises: a substrate; and a memory controller, a volatile memory, and a non-volatile memory that are mounted on the substrate, and wherein the temperature measuring sensor is disposed on a surface of or adjacent to at least one of the memory controller, the volatile memory, the non-volatile memory, and the substrate, the memory controller is configured to receive a temperature value from the temperature measuring sensor, and based on the received temperature value, the memory controller is configured to control the data I/O performance level according to Formula 1. 2. The method of claim 1 , wherein the data I/O performance level is a data I/O speed. 3. The method of claim 2 , wherein the adjusting of the data I/O performance level P comprises controlling at least one of a number of data I/O channels and a number of ways, in order to control the data I/O speed. 4. The method of claim 2 , wherein the adjusting of the data I/O performance level P comprises controlling a speed of a write/read operation with respect to the non-volatile storage device, in order to control the data I/O speed. 5. The method of claim 4 , wherein the controlling of speed of the write/read operation with respect to the non-volatile storage device is performed according to a Tprog function. 6. The method of claim 1 , wherein the reference temperature is lower than the control engagement temperature. 7. The method of claim 1 , wherein the memory controller comprises a firmware capable of performing the determining of whether the temperature of the non-volatile storage device is higher than the control engagement temperature and the adjusting of the data I/O performance level P. 8. The method of claim 1 , further comprising, after the adjusting of the data I/O performance level P: determining whether the temperature of the non-volatile storage device is lower than the control engagement temperature; and setting the data I/O performance level P to a maximum data I/O performance level P max if the temperature of the non-volatile storage device is lower than the control engagement temperature. 9. The method of claim 1 , wherein the determining of whether the temperature of the non-volatile storage device is higher than the control engagement temperature is repeated at intervals. 10. The method of claim 9 , wherein a period for the determining of whether the temperature of the non-volatile storage device is higher than the control engagement temperature is in a range of about one second to about one hour. 11. The method of claim 9 , further comprising adjusting the data I/O performance level P according to Formula 1 if the temperature of the non-volatile storage device is higher than the control engagement temperature. 12. A method of controlling a temperature of a non-volatile storage device, the non-volatile storage device comprising a substrate and a memory controller, a volatile memory, and a non-volatile memory that are mounted on the substrate, the method comprising: detecting a temperature at predetermined time intervals by using a temperature measuring sensor and sending a temperature value to the memory controller; and controlling, by using the memory controller, a speed of a write/read operation with respect to the non-volatile memory based on the temperature value, wherein the controlling of the speed of the write/read operation with respect to the non-volatile memory comprises: setting the write/read speed to a maximum value if the temperature is less than or equal to a control engagement temperature, and applying at least one of (a), (b), and (c) according to Formula 2 below if the temperature is higher than the control engagement temperature, P = P max × f ( Δ T Δ T b
Hybrid storage combining heterogeneous device types, e.g. hierarchical storage, hybrid arrays · CPC title
in relation to throughput · CPC title
in relation to life time, e.g. increasing Mean Time Between Failures [MTBF] · CPC title
Supports for storage elements {, e.g. memory modules}; Mounting or fixing of storage elements on such supports · CPC title
by changing the state or mode of one or more devices · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.