Cutting elements, methods for manufacturing such cutting elements, and tools incorporating such cutting elements

Patent metadata

Field	Value
Publication number	US-10119340-B2
Application number	US-201414152065-A
Country	US
Kind code	B2
Filing date	Jan 10, 2014
Priority date	May 20, 2009
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

The present disclosure relates to cutting elements incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to polycrystalline diamond bodies having a high diamond content which are configured to provide improved properties of thermal stability and wear resistance, while maintaining a desired degree of impact resistance, when compared to prior polycrystalline diamond bodies. In various embodiments disclosed herein, a cutting element with high diamond content includes a modified PCD structure and/or a modified interface (between the PCD body and a substrate), to provide superior performance.

First claim

What is claimed is:

1. A cutting element comprising:
a substrate comprising a substrate interface surface, the substrate interface surface comprising a protrusion; and
a polycrystalline diamond body comprising,
a diamond interface surface interfacing with the substrate interface surface,
a top surface opposite the diamond interface surface,
a cutting edge meeting the top surface, and
a material microstructure comprising a plurality of bonded-together diamond grains having an average grain size and interstitial regions between the diamond grains;

wherein at least a region of the polycrystalline diamond body has the following properties:
a diamond volume fraction, as measured by electron backscatter diffraction, greater than (0.9077)·(the diamond average grain size ^0.0221), with the diamond average grain size provided in microns, and
the diamond average grain size is not greater than 8 microns.

2. The cutting element as recited in claim 1 wherein the substrate interface surface comprises an annular surface portion and wherein the protrusion is a step protrusion and comprises a diameter and a height as measured from the annular surface portion.

3. The cutting element as recited in claim 2 wherein the substrate comprises a diameter and wherein the diameter of the protrusion is less than about 0.7 times the diameter of the substrate.

4. The cutting element as recited in claim 2 wherein the substrate comprises a diameter and wherein the diameter of the protrusion is less than the diameter of the substrate but greater than half the diameter of the substrate.

5. The cutting element as recited in claim 2 wherein the ratio of the height to the diameter of the protrusion is less than about 0.1.

6. The cutting element as recited in claim 1 wherein the at least a region comprises a plurality of the interstitial regions that are substantially free of a catalyst material, and the at least a region extends from the cutting edge to a depth of at least 300 microns.

7. The cutting element as recited in claim 1 wherein the at least a region comprises a plurality of the interstitial regions that are substantially free of a catalyst material, and wherein the at least a region extends from the cutting edge to a depth of at least 500 microns.

8. The cutting element as recited in claim 1 wherein the at least a region has the following property:
the diamond volume fraction is greater than (0.9187)·(the average grain size ^ 0.0183).

9. The cutting element as recited in claim 1 wherein the at least a region has the following property:
the diamond volume fraction is greater than (0.9291)·(the average grain size ^ 0.0148).

10. The cutting element as recited in claim 1 , wherein the diamond average grain size is not greater than 6 microns.

11. A drill bit comprising a bit body and at least one cutting element as recited in claim 1 disposed on the bit body.

12. A cutting element comprising:
a substrate comprising a substrate interface surface, the substrate interface surface comprising a protrusion; and
a polycrystalline diamond body formed by sintering at a cold cell pressure greater than 5.4 GPa, the polycrystalline diamond body comprising,
a diamond interface surface interfacing with the substrate interface surface,
a top surface opposite the diamond interface surface;
a cutting edge meeting the top surface; and
a material microstructure comprising a plurality of bonded-together diamond grains having an average grain size and interstitial regions between the diamond grains;

wherein at least a region of the polycrystalline diamond body satisfies one of the following conditions:
an average grain size within the range of 2-4 microns, and a diamond volume fraction greater than 93%, or
an average grain size within the range of 4-6 microns, and a diamond volume fraction greater than 94%, or
an average grain size within the range of 6-8 microns, and a diamond volume fraction greater than 95%, and

wherein the diamond volume fraction is that which is determined by electron backscatter diffraction.

13. The cutting element as recited in claim 12 wherein the substrate interface surface comprises an annular surface portion and wherein the protrusion is a step protrusion and comprises a diameter and a height as measured from the annular surface portion.

14. The cutting element as recited in claim 13 wherein the substrate comprises a diameter and wherein the diameter of the protrusion is less than about 0.7 times the diameter of the substrate.

15. The cutting element as recited in claim 13 wherein the substrate comprises a diameter and wherein the diameter of the protrusion is less than the diameter of the substrate but greater than half the diameter of the substrate.

16. The cutting element as recited in claim 13 wherein the ratio of the height to the diameter of the protrusion is less than about 0.1.

17. The cutting element as recited in claim 12 wherein the at least a region comprises a plurality of the interstitial regions that are substantially free of a catalyst material, and wherein the at least a region extends from the cutting edge to a depth of at least 300 microns.

18. The cutting element as recited in claim 12 wherein the at least a region comprises a plurality of the interstitial regions that are substantially free of a catalyst material, and wherein the at least a region extends from the cutting edge to a depth of at least 500 microns.

19. A drill comprising a bit body and at least one cutting element as recited in claim 12 disposed on the bit body.

Assignees

• Smith International

Inventors

• Belnap J Daniel
• Voronin Georgiy
• Yu Feng
• Cariveau Peter T
• Zhang Youhe
• Shen Yuelin
• Zhan Guodong

Classifications

• C22C26/00

  Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes} · CPC title

• E21B10/46 Primary

  characterised by wear resisting parts, e.g. diamond inserts · CPC title

• B22F7/02

  of composite layers {(B22F7/002 takes precedence)} · CPC title

• B22F2999/00

  Aspects linked to processes or compositions used in powder metallurgy · CPC title

• B22F7/06

  of composite workpieces or articles from parts, e.g. to form tipped tools {(B22F7/002 takes precedence)} · CPC title