Apparatus and method for manufacturing multilayer felt

US10119226B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10119226-B2
Application numberUS-201414505784-A
CountryUS
Kind codeB2
Filing dateOct 3, 2014
Priority dateJan 21, 2014
Publication dateNov 6, 2018
Grant dateNov 6, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus and a method for manufacturing multilayer felt to improve NVH (noise, vibration, and harshness) of a vehicle may include supplying first chip felt between an upper mold and a lower mold, and simultaneously, firstly adsorbing the first chip felt on a bottom surface of the upper mold by vacuum pressure applied to vacuum suction gates of the upper mold, supplying second chip felt between the upper mold and the lower mold, and simultaneously, secondly adsorbing the second chip felt on a surface of the first chip felt by vacuum pressure applied to the vacuum suction gates of the upper mold, to stack the second chip felt on the first chip felt, pressing the first chip felt and the second chip felt, which are stacked on each other, using a press molding operation of the upper mold and the lower mold, and forming a multilayer felt product.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus for manufacturing multilayer felt, comprising: an upper mold and a lower mold of a press mold which are disposed in a hermetic molding box in an up and down direction, and press chip felt to form a felt product having a desired shape; a vacuum source which provides vacuum to a plurality of vacuum suction gates formed in the upper mold; a chip felt supply line which supplies the chip felt between the upper mold and the lower mold; and a blower fan which is connected to a rear end portion of the chip felt supply line and supplies the chip felt toward the molds, wherein a first chip felt supply gate for supplying first chip felt and a second chip felt supply gate for supplying second chip felt are in parallel connected to a front end portion of the chip felt supply line, wherein the first chip felt is supplied from the first chip felt supply gate to between the upper mold and the lower mold, and firstly adsorbed by vacuum pressure to the vacuum suction gates of the upper mold, wherein the second chip felt is supplied from the second chip felt supply gate, and secondly adsorbed by vacuum pressure on a surface of the first chip felt to be stacked on the first chip felt, wherein a vacuum suction shut-off device, which closes desired vacuum suction gates among the plurality of vacuum suction gates, is mounted above the upper mold, and wherein the vacuum suction shut-off device includes: a shut-off plate which has a structure having a rack formed on an upper surface thereof, and shuts off the desired vacuum suction gates among the plurality of vacuum suction gates; a pinion which is engaged with the rack of the shut-off plate; and a motor which is coaxially connected with the pinion, and provides rotational power to the pinion to selectively moves the shut-off plate above the plurality of vacuum suction gates. 2. The apparatus of claim 1 , wherein solenoid valves are mounted in outlets of the first chip felt supply gate and the second chip felt supply gate, respectively, in order to adjust discharge timing of the first chip felt and the second chip felt.

Assignees

Inventors

Classifications

  • D21H27/38Primary

    at least one of the sheets having a fibrous composition differing from that of other sheets · CPC title

  • B32B5/022Primary

    Non-woven fabric · CPC title

  • Polyester fibres · CPC title

  • All layers being fibrous or filamentary · CPC title

  • Vehicles · CPC title

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Frequently asked questions

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What does patent US10119226B2 cover?
An apparatus and a method for manufacturing multilayer felt to improve NVH (noise, vibration, and harshness) of a vehicle may include supplying first chip felt between an upper mold and a lower mold, and simultaneously, firstly adsorbing the first chip felt on a bottom surface of the upper mold by vacuum pressure applied to vacuum suction gates of the upper mold, supplying second chip felt betw…
Who is the assignee on this patent?
Hyundai Motor Co Ltd
What technology area does this patent fall under?
Primary CPC classification D21H27/38. Mapped technology areas include Textiles & Paper.
When was this patent published?
Publication date Tue Nov 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).