Adhesive sealing composition

US10119050B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10119050-B2
Application numberUS-201515317272-A
CountryUS
Kind codeB2
Filing dateJun 9, 2015
Priority dateJun 26, 2014
Publication dateNov 6, 2018
Grant dateNov 6, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An adhesive composition that can be used in an extrusion-coating process for application to a support or in an extrusion-laminating process in order to bond several supports of different or identical nature to one another, over a wide temperature range, including: from 91% to 98% by weight of the composition, of a copolymer of ethylene and of alkyl acrylate; at least one tackifying resin; processing aids, wherein the tackifying resin represents between 1.5% and 5.5% of the weight of the composition and the processing aids represent between 0.5% and 3.5% of the weight of the composition and the anti-blocking agent represents, in the processing aids, at least 60% by weight of the aids. Also, a film of the composition and a multilayer structure that includes this film.

First claim

Opening claim text (preview).

The invention claimed is: 1. An adhesive composition, configured for use in an extrusion-coating process for application to a support or in an extrusion-lamination process for adhesively bonding together several supports which are or are not different in nature, the adhesive composition comprising: from 91% to 98% by weight of a copolymer of ethylene and of alkyl acrylate; at least one tackifying resin; processing additives comprising at least one antiblock agent and one slip agent, wherein the tackifying resin represents between 1.5% and 5% of the weight of the composition, wherein said additives represent between 0.5% and 3.5% of the weight of the composition, and wherein the antiblock agent represents, in the processing additives, at least 60% by weight of said processing additives. 2. The composition as claimed in claim 1 , wherein the tackifying resin represents between 3% and 4% of the weight of the composition. 3. The composition as claimed in claim 1 , wherein the acrylate content in the copolymer of ethylene and of alkyl acrylate is between 15% and 30% of the weight of said copolymer. 4. The composition as claimed in claim 1 , wherein the copolymer of ethylene and of alkyl acrylate consists of a copolymer of ethylene and of methyl acrylate. 5. The composition as claimed in claim 1 , wherein the MFI of the copolymer is between 5 g/10 min and 15 g/10 min at 190° C., 2.13 kg. 6. The composition as claimed in claim 1 , wherein the processing additives are present at between 1.5% and 2.5% by weight of said composition. 7. The composition as claimed in claim 1 , wherein the processing additives consist solely of at least one antiblock agent and at least one slip agent, the antiblock agent representing at least 70% by weight of said additives. 8. The composition as claimed in claim 1 , wherein the composition consists of the copolymer, the tackifying resin and said processing additives. 9. A sealing film consisting of a composition as claimed in claim 1 , wherein the sealing film has a thickness between 10 and 20 micrometers (μm). 10. A multilayer structure comprising at least two films, one of which is as claimed in claim 9 , wherein the second film is chosen from aluminum, paper or board, cellophane, films based on polyethylene, polypropylene, polyamide, polyester, polyvinyl chloride (PVC), polyvinylidene chloride (PVDC) or polyacrylonitrile (PAN) resins, these films being or not being oriented, being or not being metallized and being or not being treated physically or chemically, and films coated with a thin inorganic barrier layer.

Assignees

Inventors

Classifications

  • comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF · CPC title

  • comprising polyamides · CPC title

  • at least one layer is extruded and immediately laminated while in semi-molten state · CPC title

  • comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title

  • comprising vinyl resins; comprising acrylic resins · CPC title

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Frequently asked questions

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What does patent US10119050B2 cover?
An adhesive composition that can be used in an extrusion-coating process for application to a support or in an extrusion-laminating process in order to bond several supports of different or identical nature to one another, over a wide temperature range, including: from 91% to 98% by weight of the composition, of a copolymer of ethylene and of alkyl acrylate; at least one tackifying resin; proce…
Who is the assignee on this patent?
Arkema France
What technology area does this patent fall under?
Primary CPC classification C09J123/0869. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).