Adhesive for high-frequency dielectric heating, structure, and method for manufacturing structure
US-2024002711-A1 · Jan 4, 2024 · US
US10119050B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10119050-B2 |
| Application number | US-201515317272-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 9, 2015 |
| Priority date | Jun 26, 2014 |
| Publication date | Nov 6, 2018 |
| Grant date | Nov 6, 2018 |
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An adhesive composition that can be used in an extrusion-coating process for application to a support or in an extrusion-laminating process in order to bond several supports of different or identical nature to one another, over a wide temperature range, including: from 91% to 98% by weight of the composition, of a copolymer of ethylene and of alkyl acrylate; at least one tackifying resin; processing aids, wherein the tackifying resin represents between 1.5% and 5.5% of the weight of the composition and the processing aids represent between 0.5% and 3.5% of the weight of the composition and the anti-blocking agent represents, in the processing aids, at least 60% by weight of the aids. Also, a film of the composition and a multilayer structure that includes this film.
Opening claim text (preview).
The invention claimed is: 1. An adhesive composition, configured for use in an extrusion-coating process for application to a support or in an extrusion-lamination process for adhesively bonding together several supports which are or are not different in nature, the adhesive composition comprising: from 91% to 98% by weight of a copolymer of ethylene and of alkyl acrylate; at least one tackifying resin; processing additives comprising at least one antiblock agent and one slip agent, wherein the tackifying resin represents between 1.5% and 5% of the weight of the composition, wherein said additives represent between 0.5% and 3.5% of the weight of the composition, and wherein the antiblock agent represents, in the processing additives, at least 60% by weight of said processing additives. 2. The composition as claimed in claim 1 , wherein the tackifying resin represents between 3% and 4% of the weight of the composition. 3. The composition as claimed in claim 1 , wherein the acrylate content in the copolymer of ethylene and of alkyl acrylate is between 15% and 30% of the weight of said copolymer. 4. The composition as claimed in claim 1 , wherein the copolymer of ethylene and of alkyl acrylate consists of a copolymer of ethylene and of methyl acrylate. 5. The composition as claimed in claim 1 , wherein the MFI of the copolymer is between 5 g/10 min and 15 g/10 min at 190° C., 2.13 kg. 6. The composition as claimed in claim 1 , wherein the processing additives are present at between 1.5% and 2.5% by weight of said composition. 7. The composition as claimed in claim 1 , wherein the processing additives consist solely of at least one antiblock agent and at least one slip agent, the antiblock agent representing at least 70% by weight of said additives. 8. The composition as claimed in claim 1 , wherein the composition consists of the copolymer, the tackifying resin and said processing additives. 9. A sealing film consisting of a composition as claimed in claim 1 , wherein the sealing film has a thickness between 10 and 20 micrometers (μm). 10. A multilayer structure comprising at least two films, one of which is as claimed in claim 9 , wherein the second film is chosen from aluminum, paper or board, cellophane, films based on polyethylene, polypropylene, polyamide, polyester, polyvinyl chloride (PVC), polyvinylidene chloride (PVDC) or polyacrylonitrile (PAN) resins, these films being or not being oriented, being or not being metallized and being or not being treated physically or chemically, and films coated with a thin inorganic barrier layer.
comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF · CPC title
comprising polyamides · CPC title
at least one layer is extruded and immediately laminated while in semi-molten state · CPC title
comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title
comprising vinyl resins; comprising acrylic resins · CPC title
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