Board, methods for manufacturing boards, and panel which comprises such board material

Patent metadata

Field	Value
Publication number	US-10118311-B2
Application number	US-73853108-A
Country	US
Kind code	B2
Filing date	Oct 16, 2008
Priority date	Oct 19, 2007
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

Board, wherein this board substantially consists of a material mass which is pressed and which comprises at least two components, namely a first component consisting of organic material, and a second component functioning as a binding agent for said first component, with the characteristic that said material mass is composed differently in the plane of the board. The invention also relates to methods by which such board can be manufactured, as well as to panels comprising such board material.

First claim

The invention claimed is:

1. A board comprising:
a pressed material mass forming a board having a length, a width, and a depth, said pressed material mass having at least first and second components, the first component including an organic material, and the second component including a binding agent arranged for binding said first component;
wherein said board is free of structural recesses;
wherein said material mass forming the board comprises a plurality of first portions and a plurality of second portions aligned along a horizontal plane with respect to a top surface of the board in at least one of a length direction and width direction of the board,
wherein said plurality of second portions have a differing composition than said plurality of first portions,
wherein said plurality of first portions comprise the first and second components and the plurality of second portions comprise the first and second components and at least a third component, said third component forming part of the pressed material mass itself and being only located within the plurality of second portions so as to be absent in a remainder of the board outside the plurality of second portions,
wherein said first component comprises wood fiber material,
wherein said second component is a polycondensation glue, selected from the group consisting of urea formaldehyde glue, melamine glue, melamine formaldehyde glue, methane diphenyl diisocyanate glue, phenol formaldehyde glue, resorcinol formaldehyde glue and resorcinol phenol formaldehyde glue, and
wherein said board is substantially made as a wood fiberboard selected from the group consisting of medium density fiberboard (MDF) and high density fiberboard (HDF).

2. The board according to claim 1 , wherein the plurality of first portions and the plurality of second portions have a length and width and extend in at least one of the length and width directions of the board so that said plurality of first portions and said plurality of second portions form longitudinal strip portions substantially parallel to each other and that extend in at least one of the length direction and width direction of the board.

3. The board according to claim 1 , wherein the plurality of first portions and the plurality of second portions have a length and width and are aligned along at least one of the length and width directions of the board so that said plurality of first portions form longitudinal strip portions and said plurality of second portions form material zones adjacent to said longitudinal strip portions in at least one of the length direction and width direction of the board.

4. The board according to claim 3 , wherein the plurality of second portions are adjacent the length and width of the longitudinal strips portions of the plurality of first portions so as to surround the plurality of first portions.

5. The board according to claim 3 , wherein the plurality of second portions are adjacent the length of said longitudinal strip portions of the plurality of first portions.

6. The board according to claim 3 , wherein the plurality of second portions are adjacent the width of said longitudinal strip portions of the plurality of first portions.

7. The board according to claim 1 , wherein the third component when provided in the not yet pressed material mass is either in liquid form or in solid form or as a coating provided on the organic material.

8. The board according to claim 1 , wherein said board is configured in a way such that said board is able to be used for manufacturing floor panels.

9. A board comprising a pressed material mass having at least first and second components, the first component including an organic material, and the second component including a binding agent arranged for binding said first component;
wherein said board is free of structural recesses;
wherein the board further comprises at least a foamed or expanded component comprising an amino resin foam;
wherein the board defines a substantially homogenous composition along a horizontal plane with respect to a top surface of the board, said foamed or expanded component being concentrated in at least one layer in a center of the board within the board and said foamed or expanded component being absent in at least one layer above or one layer below the at least one layer in the center of the board, and wherein a remainder of said board outside said center of the board is free from said foamed or expanded component.

10. The board according to claim 9 , wherein said organic material comprises at least one of wood fibers and wood chips.

11. The board according to claim 9 , wherein the binding agent substantially consists of a polycondensation glue.

12. A board substantially consisting of a pressed material mass having at least first and second components, the first component including an organic material, and the second component including a binding agent arranged for binding said first component;
wherein said board is free of structural recesses;
wherein said material mass defines a differing composition located in a plurality of localized material portions across a thickness of the board in a horizontal plane with respect to a top surface of the board in at least one of a length direction and width direction of the board, the plurality of material portions each including at least a third component, said third component forming part of the pressed material mass itself and being only located within the plurality of material portions so as to be absent in a remainder of the board outside the plurality of material portions,
wherein said first component is a wood fiber material,
wherein said second component is a polycondensation glue, selected from the group consisting of urea formaldehyde glue, melamine glue, melamine formaldehyde glue, methane diphenyl diisocyanate glue, phenol formaldehyde glue, resorcinol formaldehyde glue and resorcinol phenol formaldehyde glue, and
wherein said board is substantially made as a wood fiberboard selected from the group consisting of medium density fiberboard (MDF) and high density fiberboard (HDF).

13. The board according to claim 12 , wherein said board is configured in a way such that said board is able to be used for manufacturing floor panels.

Assignees

• Thiers Bernard
• De Boe Lode
• Hochepied Peter
• Flooring Ind Ltd Sarl

Inventors

• Thiers Bernard
• De Boe Lode
• Hochepied Peter

Classifications

• E04F15/02

  Flooring or floor layers composed of a number of similar elements (of webs E04F15/16) · CPC title

• B27N3/00 Primary

  Manufacture of substantially flat articles, e.g. boards, from particles or fibres · CPC title