Controller and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10117341-B2
Application number	US-201515518293-A
Country	US
Kind code	B2
Filing date	Oct 7, 2015
Priority date	Oct 15, 2014
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A controller ( 1 ) includes a primary molded portion ( 11 ) in which a resin molded body ( 10 ) is integrated with a bus bar ( 100 ) using a resin, causing one end of the bus bar ( 100 ) to function as a connector terminal which protrudes into connector portions ( 13 ) to ( 15 ), and configured to form electronic component disposition portions ( 16 a) to ( 16 d) in which an electronic component ( 40 ) is disposed and a power device disposition portion ( 17 ) in which a power device ( 50 ) is disposed, and a secondary molded portion ( 21 ) integrated with the electronic component ( 40 ), the power device ( 50 ), and the primary molded portion ( 11 ) in a state in which the electronic component ( 40 ) is disposed at the electronic component disposition portions ( 16 a) to ( 16 d) and the power device ( 50 ) is disposed at the power device disposition portion ( 17 ).

First claim

The invention claimed is:

1. A controller in which a plurality of terminals, an electronic component connected to the terminal, and a power device connected to the terminal and configured to supply power to a driven body and control driving of the driven body are embedded inside a resin main body, and a connector portion to which a connector extending from an external device is able to be fitted is integrally molded,
wherein the resin main body comprises:
a primary molded portion integrated with the terminal using a resin, causing one end of the terminal to function as a connector terminal which protrudes into the connector portion, and configured to form a disposition portion of the electronic component and the power device; and
a secondary molded portion integrated with the electronic component, the power device, and the primary molded portion in a state in which the electronic component and the power device are disposed at the disposition portion, wherein the secondary molded portion is formed of a thermally conductive resin, and wherein a heat sink is integrally provided in the secondary molden portion, the power device and the heat sink are separetly disposed, and the power device and the heat sink are in contact with each other via thermally conductive resin.

2. The controller according to claim 1 , wherein an attachment portion for fixing the secondary molded portion to a member to be attached is integrally molded with the secondary molded portion.

3. The controller according to claim 1 , wherein the heat sink is electrically connected to the terminal.

4. The controller according to claim 1 , wherein the electronic component includes at least any one of the group consisting of a noise suppression device and a smoothing capacitor.

5. The controller according to claim 1 , wherein the electronic component and the power device are disposed on the same plane.

6. The controller according to claim 1 , wherein the disposition portion is formed to accommodate at least a portion of the electronic component.

7. The controller according to claim 1 , wherein a window portion that exposes a junction portion between the electronic component and the terminal is formed in the primary molded portion.

8. A method of manufacturing a controller in which a plurality of terminals, an electronic component connected to the terminals, and a power device connected to the terminals and configured to supply power to a driven body and control driving of the driven body are embedded inside a resin main body, and a connector portion to which a connector extending from an external device is able to be fitted is integrally molded, the method comprising:
a primary molding process of forming a primary molded portion integrated with the terminals using a resin, causing one end of the terminals to function as a connector terminal which protrudes into the connector portion, and configured to form a disposition portion of the electronic component and the power device; and
a secondary molding process of forming a secondary molded portion integrated with the electronic component, the power device, and the primary molded portion in a state in which the electronic component and the power device are disposed at the disposition portion, wherein the secondary molded portion is formed of a thermally conductive resin, and wherein a heat sink is integrally provided in the secondary molded portion, the power device and the heat sink are separately disposed, and the power device and the heat sink are in contact with each other via the thermally conductive resin.

9. The method according to claim 8 , comprising a connecting process of electrically connecting the electronic component and the power device which are disposed at the disposition portion to the terminals between the primary molding process and the secondary molding process.

Assignees

• Mitsuba Corp

Inventors

• OGANE Takahiko
• Koshio Fumiaki
• Kusumoto Wataru
• Ishii Masamichi
• Yamada Yoshihisa
• Tsurubuchi Iwao

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H01R43/18

  for manufacturing bases or cases for contact members · CPC title

• H05K5/0217

  Mechanical details of casings (covers, lids, hoods or members for covering apertures H05K5/03) · CPC title

• B29C70/84

  by moulding material on preformed parts to be joined {(joining plastic parts by moulding B29C65/70)} · CPC title