Magnetic assembly

US10117334B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10117334-B2
Application numberUS-201615158016-A
CountryUS
Kind codeB2
Filing dateMay 18, 2016
Priority dateMar 3, 2016
Publication dateOct 30, 2018
Grant dateOct 30, 2018

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A magnetic assembly is disclosed. The magnetic assembly includes a first magnetic core, a second magnetic core and a first series winding. The first magnetic core has a first top surface, a first bottom surface, a first sidewall, a second sidewall, at least one first sidewall through-hole and at least one second sidewall through-hole. The second magnetic core is connected to the first top surface of the first magnetic core. The first series winding has a first upper winding set, a first sidewall winding set, and a second sidewall winding set disposed on the first top surface, the first sidewall and the second sidewall respectively. The upper winding set is connected to the lower winding set via the first sidewall winding set and the second sidewall winding set is further connected to the lower winding set, so as to form the first series winding around the first magnetic core.

First claim

Opening claim text (preview).

What is claimed is: 1. A magnetic assembly comprising: a first magnetic core having a first top surface, a first bottom surface, a first sidewall, a second sidewall, at least one first sidewall through-hole and at least one second sidewall through-hole, wherein the at least one first sidewall through-hole is disposed on the first sidewall, the at least one second sidewall through-hole is disposed on the second sidewall, and the first sidewall is opposite to the second sidewall; a second magnetic core having a second top surface and a second bottom surface, wherein at least a portion of the second bottom surface of the second magnetic core is connected to the first top surface of the first magnetic core by an adhesive layer; and at least a first series winding having a first upper winding set, a first sidewall winding set, and a second sidewall winding set, wherein the first upper winding set is disposed on the first top surface, the first sidewall winding set is disposed in the first sidewall through-hole, the second sidewall winding set is disposed in the second sidewall through-hole, the first upper winding set is electrically connected to the first sidewall winding set and the second sidewall winding set, so as to form the first series winding around the first magnetic core. 2. The magnetic assembly according to claim 1 , wherein the first series winding further comprises a first lower winding set disposed on the first bottom surface of the first magnetic core, the first upper winding set is electrically connected to the first lower winding set via the first sidewall winding set, and the second sidewall winding set is electrically connected to the first lower winding set, so as to form the first series winding around the first magnetic core. 3. The magnetic assembly according to claim 1 , wherein the first magnetic core or the second magnetic core further comprises at least an air gap. 4. The magnetic assembly according to claim 1 , wherein the first magnetic core or the second magnetic core further comprises a through hollow section formed by a non-magnetic and insulating material and configured to form a non-magnetic zone. 5. The magnetic assembly according to claim 1 , wherein the first magnetic core comprises an insulating layer disposed on and covering the first top surface, the first bottom surface, the at least one first sidewall through-hole and the at least one second sidewall through-hole, so as to insulate the first magnetic core from the first series winding. 6. The magnetic assembly according to claim 1 , further comprising: an insulating dielectric layer disposed on the first series winding; and an additional winding disposed on the insulating dielectric layer and electrically connected to the first series winding in parallel or series. 7. The magnetic assembly according to claim 1 , wherein the first series winding set has a metallic layer disposed on the first magnetic core. 8. The magnetic assembly according to claim 1 , wherein the second magnetic core is a magnetic conductive gel disposed on the first top surface of the first magnetic core. 9. The magnetic assembly according to claim 1 , wherein the second magnetic core further comprises a third sidewall, a fourth sidewall, at least a third sidewall through-hole and at least a fourth sidewall through-hole, wherein the third sidewall through-hole is disposed on the third sidewall, the fourth sidewall through-hole is disposed on the fourth sidewall, and the third sidewall is opposite to the fourth sidewall. 10. The magnetic assembly according to claim 9 , wherein the second magnetic core further comprises a second series winding having a second upper winding set, a second lower winding set, a third sidewall winding set and a fourth sidewall winding set, wherein the second upper winding set is disposed on the second top surface of the second magnetic core, the second lower winding set is disposed on the second bottom surface of the second magnetic core, the third sidewall winding set is disposed on the third sidewall through-holes of the second magnetic core, the fourth sidewall winding set is disposed on the fourth sidewall through-holes of the second magnetic core, the second upper winding set is electrically connected to the second lower winding set via the third sidewall winding set, and the fourth sidewall winding set is electrically connected to the second lower winding set, so as to form the second series winding around the second magnetic core. 11. The magnetic assembly according to claim 10 , wherein the second magnetic core comprises an insulating layer disposed on and covering the second top surface, the second bottom surface, the third sidewall through-holes and the fourth sidewall through-holes, so as to insulate the second magnetic core from the second series winding. 12. The magnetic assembly according to claim 10 , further comprising: an insulating dielectric layer disposed on the second series winding; and an additional winding disposed on the insulating dielectric layer and electrically connected to the second series winding in parallel or series. 13. The magnetic assembly according to claim 10 , further comprising a conductive layer disposed between the first series winding and the second series winding so as to connect the first series winding and the second series winding in parallel or series. 14. The magnetic assembly according to claim 10 , further comprising: an electronic component disposed on the first magnetic core or the second magnetic core; and a conductive circuit disposed on the first magnetic core or the second magnetic core and electrically connected with the electronic component. 15. The magnetic assembly according to claim 14 , wherein the electronic component is deposed on the first magnetic core or the second magnetic core, and the magnetic assembly comprises an insulating and packaging layer covering the electronic component, wherein the electronic component is electrically connected to the conductive circuit of the first magnetic core or the second magnetic core via a bonding wire. 16. The magnetic assembly according to claim 14 , wherein the electronic component is deposed on the first magnetic core or the second magnetic core, and the magnetic assembly comprises: an insulating and packaging layer covering the electronic component and exposing a first terminal of the electronic component disposed on the conductive circuit of the first magnetic core or the second magnetic core; and a connecting element electrically connected between the first terminal and the conductive circuit of the first magnetic core or the second magnetic core. 17. The magnetic assembly according to claim 16 , wherein the electronic component further comprises a second terminal disposed between the electronic component and the first magnetic core or the second magnetic core. 18. The magnetic assembly according to claim 14 , wherein the electronic component is a bare chip. 19. The magnetic assembly according to claim 1 , further comprising: an electronic component disposed on the first magnetic core or the second magnetic core; and a conductive circuit disposed on the first magnetic core or the second magnetic core and electrically connected with the electronic component. 20. The magnetic assembly according to claim 19 , wherein the electronic component is deposed on the first magnetic core or the second magnetic core, and the magnetic assembly comprises an insulating and packaging layer covering the electronic component, wherein th

Assignees

Inventors

Classifications

  • manufactured by mounting on or connecting to patterned circuits before or during embedding · CPC title

  • H05K1/181Primary

    associated with surface mounted components · CPC title

  • with stacked layers · CPC title

  • with core substantially closed in itself, e.g. toroid · CPC title

  • Cross-Sectional Technologies · mapped topic

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Frequently asked questions

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What does patent US10117334B2 cover?
A magnetic assembly is disclosed. The magnetic assembly includes a first magnetic core, a second magnetic core and a first series winding. The first magnetic core has a first top surface, a first bottom surface, a first sidewall, a second sidewall, at least one first sidewall through-hole and at least one second sidewall through-hole. The second magnetic core is connected to the first top surfa…
Who is the assignee on this patent?
Delta Electronics Shanghai Co
What technology area does this patent fall under?
Primary CPC classification H05K1/181. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 30 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).