EOS protection for integrated circuits
US-9355971-B1 · May 31, 2016 · US
US10116129B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-10116129-B1 |
| Application number | US-201615158541-A |
| Country | US |
| Kind code | B1 |
| Filing date | May 18, 2016 |
| Priority date | May 18, 2016 |
| Publication date | Oct 30, 2018 |
| Grant date | Oct 30, 2018 |
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An EOS event detection circuit coupled to a power supply via a supply voltage rail and comprising a plurality of sub-circuits coupled to the supply voltage rail, each sub-circuit comprising a first transistor, a Zener diode coupled between the supply voltage rail and a first terminal of the first transistor, and a fusible element coupled between a second terminal of the first transistor and the supply voltage rail, wherein the first transistor is configured to cause the fusible element to open when an EOS event occurring on the supply voltage rail exceeds a reverse breakdown voltage of the Zener diode, and wherein the Zener diode in each sub-circuit has a different reverse breakdown voltage.
Opening claim text (preview).
What is claimed is: 1. An EOS event detection circuit coupled to a power supply via a supply voltage rail, the EOS event detection circuit comprising: a plurality of sub-circuits coupled to the supply voltage rail, each sub-circuit comprising: a first transistor; a Zener diode coupled between the supply voltage rail and a first terminal of the first transistor; and a fusible element coupled between a second terminal of the first transistor and the supply voltage rail; wherein the first transistor is configured to cause the fusible element to open when an EOS event occurring on the supply voltage rail exceeds a reverse breakdown voltage of the Zener diode; and wherein the Zener diode in each sub-circuit has a different reverse breakdown voltage. 2. The EOS event detection circuit as recited in claim 1 , wherein the fusible element in each sub-circuit has a substantially same resistance. 3. The EOS event detection circuit as recited in claim 1 , wherein a number of fusible elements that are opened as a result of an occurrence of an EOS event on the supply voltage rail indicates range of magnitude of the EOS event. 4. The EOS event detection circuit as recited in claim 1 , wherein the plurality of sub-circuits comprise a first sub-circuit comprising a Zener diode having a first reverse breakdown voltage and a second sub-circuit comprising a Zener diode having a second reverse breakdown voltage, and wherein the first and second sub-circuits determine a range of magnitude of detectable EOS events that corresponds to a difference between the first and second reverse breakdown voltages. 5. The EOS event detection circuit as recited in claim 1 , wherein each sub-circuit further comprises a second transistor comprising a first terminal coupled to the Zener diode and a second terminal coupled to the first terminal of the first transistor, the second transistor configured to cause the first transistor to turn on when an EOS event occurring on the supply voltage rail exceeds the reverse breakdown voltage of the Zener diode. 6. The EOS event detection circuit as recited in claim 5 , wherein the first transistor comprises a FET and the second transistor comprises a bipolar transistor, and wherein the FET is selected to have a drain-source breakdown voltage that is greater than a sum of the reverse breakdown voltage of the Zener diode and a base-emitter turn-on voltage of the second transistor. 7. The EOS event detection circuit as recited in claim 1 , wherein the first transistor comprises a FET that is selected to have a drain-source breakdown voltage that is greater than the reverse breakdown voltage of the Zener diode. 8. The EOS event detection circuit as recited in claim 1 , wherein, when an EOS event occurs on the voltage supply rail that exceeds the reverse breakdown voltage of the Zener diode in at least one sub-circuit, the occurrence and relative magnitude of the EOS event is determined by a resistance determined by a slope of an I-V curve provided on a curve tracer coupled between the voltage supply rail and ground. 9. The EOS event detection circuit as recited in claim 1 , wherein the fusible element comprises a resistor. 10. The EOS event detection circuit as recited in claim 1 , wherein the fusible element comprises a fusible link. 11. The EOS event detection circuit as recited in claim 1 , wherein a third terminal of the first transistor is coupled to ground. 12. A power device coupled to a power supply via a voltage supply line, the power device comprising: a supply voltage rail coupled to the voltage supply line; an EOS event detection circuit coupled to the supply voltage rail and comprising: a plurality of sub-circuits coupled to the supply voltage rail, each sub-circuit comprising: a first transistor; a Zener diode coupled between the supply voltage rail and a first terminal of the first transistor; and a fusible element coupled between a second terminal of the first transistor and the supply voltage rail; wherein the first transistor is configured to cause the fusible element to open when an EOS event occurring on the supply voltage rail exceeds a reverse breakdown voltage of the Zener diode; and wherein the Zener diode in each sub-circuit has a different reverse breakdown voltage. 13. The power device as recited in claim 12 , wherein the fusible element in each sub-circuit has a substantially same resistance. 14. The power device as recited in claim 12 , wherein a number of fusible elements that are opened as a result of an occurrence of an EOS event on the supply voltage rail indicates a range of magnitude of the EOS event. 15. The power device as recited in claim 12 , wherein the plurality of sub-circuits comprise a first sub-circuit comprising a Zener diode having a first reverse breakdown voltage and a second sub-circuit comprising a Zener diode having a second reverse breakdown voltage, and wherein the first and second sub-circuits determine a range of magnitude of detectable EOS events that corresponds to a difference between the first and second reverse breakdown voltages. 16. The power device as recited in claim 12 , wherein each sub-circuit further comprises a second transistor comprising a first terminal coupled to the Zener diode and a second terminal coupled to the first terminal of the first transistor, the second transistor configured to cause the first transistor to turn on when an EOS event occurring on the supply voltage rail exceeds the reverse breakdown voltage of the Zener diode. 17. The power device as recited in claim 16 , wherein the first transistor comprises a FET and the second transistor comprises a bipolar transistor, and wherein the FET is selected to have a drain-source breakdown voltage that is greater than a sum of the reverse breakdown voltage of the Zener diode and a base-emitter turn-on voltage of the second transistor. 18. The power device as recited in claim 12 , wherein the first transistor comprises a FET that is selected to have a drain-source breakdown voltage that is greater than the reverse breakdown voltage of the Zener diode. 19. The power device as recited in claim 12 , wherein, when an EOS event occurs on the voltage supply rail that exceeds the reverse breakdown voltage of the Zener diode in at least one sub-circuit, the occurrence and relative magnitude of the EOS event is determined by a resistance determined by a slope of an I-V curve provided on a curve tracer coupled between the voltage supply rail and ground. 20. A data storage device comprising the power device as recited in claim 12 . 21. A power device coupled to a power supply via first and second voltage supply lines, the power device comprising: first and second supply voltage rails coupled to the respective first and second voltage supply lines; first and second EOS event detection circuits coupled to the respective supply voltage rails, each EOS event detection circuit comprising: a plurality of sub-circuits coupled to the respective supply voltage rail, each sub-circuit comprising: a first transistor; a Zener diode coupled between the respective supply voltage rail and a first terminal of the first transistor; and a fusible element coupled between a second terminal of the first transistor and the respective supply voltage rail; wherein the first transistor is configured to cause the fusible element to open when an EOS event occurring on the respective supply voltage rail exceeds a reverse breakdown voltage of the Zener diode; and wherein the Zener diode in eac
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