Display panel and display device

Patent metadata

Field	Value
Publication number	US-10115664-B2
Application number	US-201715823133-A
Country	US
Kind code	B2
Filing date	Nov 27, 2017
Priority date	Aug 1, 2017
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A display panel and a display device are provided. The display panel comprises a first substrate having a step area; a second substrate disposed opposite to the first substrate, wherein the second substrate has a first surface facing the first substrate and an opposite second surface; a Chip On Flex (COF) disposed on the step area of the first substrate and comprising at least one ground pad, wherein the COF has a first surface facing the first substrate and an opposite second surface, and the at least one ground pad is disposed on the second surface of the COF; a conductive layer disposed on the second surface of the second substrate; and a conductive adhesive electrically connected to the conductive layer and the at least one ground pad.

First claim

What is claimed is:

1. A display panel, comprising:
a first substrate having a step area;
a second substrate disposed opposite to the first substrate, wherein the second substrate has a first surface facing the first substrate and an opposite second surface;
a Chip On Flex (COF) disposed on the step area of the first substrate and comprising at least one ground pad, wherein the COF has a first surface facing the first substrate and an opposite second surface, and the at least one ground pad is disposed on the second surface of the COF;
a conductive layer disposed on the second surface of the second substrate; and
a conductive adhesive electrically connected to the conductive layer and the at least one ground pad.

2. The display panel according to claim 1 , wherein:
the conductive adhesive includes a conductive silver paste or a conductive tape.

3. The display panel according to claim 1 , wherein:
the conductive adhesive is directly electrically connected to the conductive layer; and
the conductive adhesive is directly electrically connected to the at least one ground pad.

4. The display panel according to claim 1 , wherein:
an orthogonal projection of the at least one ground pad onto the first substrate is located within the step area of the first substrate.

5. The display panel according to claim 1 , wherein:
a plurality of first terminals are disposed on the first surface of the COF;
the first substrate has a first surface facing the COF and an opposite second surface, and a plurality of second terminals are disposed on the first surface of the first substrate; and
the plurality of first terminals are one-to-one electrically connected to the plurality of second terminals.

6. The display panel according to claim 5 , wherein:
the plurality of first terminals and the plurality of second terminals are arranged in a first direction, respectively,
wherein the first substrate has a first side close to the COF and an opposite second side far away from the COF, and the first direction is an extending direction of the first side of the first substrate.

7. The display panel according to claim 6 , wherein the first substrate further includes:
a plurality of multiplexing circuits disposed in a non-display area;
each of the plurality of multiplexing circuits includes at least one first signal input terminal;
the at least one first signal input terminal in each of the plurality of multiplexing circuits is electrically connected to a second terminal;
the at least one first signal input terminal in each of the plurality of multiplexing circuits is arranged in the first direction; and
the non-display area surrounds a display area of the display panel.

8. The display panel according to claim 7 , wherein:
the at least one first signal input terminal in each of the plurality of multiplexing circuits are arranged with a same interval.

9. The display panel according to claim 6 , wherein:
in the first direction, a width of the COF is the same as a width of the first substrate.

10. The display panel according to claim 9 , wherein:
in the first direction, the plurality of second terminals are arranged with a same interval.

11. The display panel according to claim 5 , wherein:
in a direction perpendicular to the first substrate, the at least one ground pad does not overlap with the plurality of first terminals.

12. The display panel according to claim 5 , wherein:
in a direction perpendicular to the first substrate, a first terminal overlapped with the at least one ground pad is electrically connected to a ground signal or a dummy signal.

13. The display panel according to claim 5 , wherein:
the plurality of first terminals are one-to-one electrically connected to the plurality of second terminals through an anisotropic conductive adhesive.

14. The display panel according to claim 1 , further including:
an upper polarizer disposed on the second surface of the second substrate, the upper polarizer having a first surface facing the first substrate and an opposite second surface far away from the first substrate; and
the conductive layer is disposed on the second surface of the upper polarizer.

15. The display panel according to claim 1 , further including:
an upper polarizer disposed on the second surface of the second substrate; and
the conductive layer is multiplexed the upper polarizer.

16. The display panel according to claim 1 , further including:
a protective cover disposed on the second surface of the second substrate, the protective cover having a first surface facing the first substrate and an opposite second surface far away from the first substrate; and
the conductive layer is disposed on the second surface of the protective cover.

17. The display panel according to claim 1 , wherein:
the conductive layer comprises at least one of indium tin oxide, indium zinc oxide, antimony tin oxide, and aluminum zinc oxide.

18. A display device, comprising:
a display panel comprising:
a first substrate having a step area;
a second substrate disposed opposite to the first substrate, wherein the second substrate has a first surface facing the first substrate and an opposite second surface;
a Chip On Flex (COF) disposed on the step area of the first substrate and comprising at least one ground pad, wherein the COF has a first surface facing the first substrate and an opposite second surface, and the at least one ground pad is disposed on the second surface of the COF;
a conductive layer disposed on the second surface of the second substrate; and
a conductive adhesive electrically connected to the conductive layer and the at least one ground pad.

19. The display device according to claim 18 , wherein:
the conductive adhesive is directly electrically connected to the conductive layer; and
the conductive adhesive is directly electrically connected to the at least one ground pad.

20. The display device according to claim 18 , wherein:
an orthogonal projection of the at least one ground pad onto the first substrate is located within the step area of the first substrate.

Assignees

• Xiamen Tianma Micro Electronics Co Ltd

Inventors

• Lai Guochang
• Zhou Hongbo

Classifications

• G02F1/13458 Primary

  Terminal pads · CPC title

• H05K3/323

  by applying an anisotropic conductive adhesive layer over an array of pads · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K1/188

  manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component · CPC title

• H05K2201/09845

  Stepped hole, via, edge, bump or conductor · CPC title