Semiconductor device
US-2016233214-A1 · Aug 11, 2016 · US
US10115652B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10115652-B2 |
| Application number | US-201715430455-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 11, 2017 |
| Priority date | Mar 31, 2016 |
| Publication date | Oct 30, 2018 |
| Grant date | Oct 30, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A semiconductor device includes a power device and a temperature detection diode. The semiconductor device has a device structure configured to insulate between a power lien of the power device and the temperature detection diode.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a power device; and a temperature detection diode, wherein the semiconductor device has a device structure configured to insulate between a power line of the power device and the temperature detection diode, and wherein the device structure comprises a resistor between a first conductive type electrode included in the power line of the power device and a cathode electrode of the temperature detection diode. 2. The semiconductor device according to claim 1 , wherein the resistor has a resistance value that a leakage current is equal to or lower than 10 μA. 3. The semiconductor device according to claim 1 , wherein the resistor is formed of polysilicon. 4. The semiconductor device according to claim 1 , wherein the temperature detection diode is formed over an oxide film in contact with a first conductive type layer included in the power line of the power device. 5. The semiconductor device according to claim 1 , wherein the temperature detection diode is formed inside silicon. 6. The semiconductor device according to claim 1 , wherein the power device is a IGBT (Insulated Gate Bipolar Transistor), a power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor), a diode, or a thyristor.
Chemical etching · CPC title
by chemical means · CPC title
into Group IV semiconductors · CPC title
of electrically active species · CPC title
of highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.