Semiconductor device and semiconductor apparatus

US10115652B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10115652-B2
Application numberUS-201715430455-A
CountryUS
Kind codeB2
Filing dateFeb 11, 2017
Priority dateMar 31, 2016
Publication dateOct 30, 2018
Grant dateOct 30, 2018

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A semiconductor device includes a power device and a temperature detection diode. The semiconductor device has a device structure configured to insulate between a power lien of the power device and the temperature detection diode.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor device comprising: a power device; and a temperature detection diode, wherein the semiconductor device has a device structure configured to insulate between a power line of the power device and the temperature detection diode, and wherein the device structure comprises a resistor between a first conductive type electrode included in the power line of the power device and a cathode electrode of the temperature detection diode. 2. The semiconductor device according to claim 1 , wherein the resistor has a resistance value that a leakage current is equal to or lower than 10 μA. 3. The semiconductor device according to claim 1 , wherein the resistor is formed of polysilicon. 4. The semiconductor device according to claim 1 , wherein the temperature detection diode is formed over an oxide film in contact with a first conductive type layer included in the power line of the power device. 5. The semiconductor device according to claim 1 , wherein the temperature detection diode is formed inside silicon. 6. The semiconductor device according to claim 1 , wherein the power device is a IGBT (Insulated Gate Bipolar Transistor), a power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor), a diode, or a thyristor.

Assignees

Inventors

Classifications

  • Chemical etching · CPC title

  • by chemical means · CPC title

  • into Group IV semiconductors · CPC title

  • of electrically active species · CPC title

  • of highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers · CPC title

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Frequently asked questions

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What does patent US10115652B2 cover?
A semiconductor device includes a power device and a temperature detection diode. The semiconductor device has a device structure configured to insulate between a power lien of the power device and the temperature detection diode.
Who is the assignee on this patent?
Renesas Electronics Corp
What technology area does this patent fall under?
Primary CPC classification H10W40/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 30 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).