Manufacturing method for electronic component

Patent metadata

Field	Value
Publication number	US-10115521-B2
Application number	US-201514870662-A
Country	US
Kind code	B2
Filing date	Sep 30, 2015
Priority date	Sep 30, 2014
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

An electronic component includes a multilayer body formed by laminating an insulator substrate and a plurality of insulator layers, a coil including coil conductors provided on the insulator substrate, and an internal magnetic path penetrating the insulator substrate. A manufacturing method for the electronic component includes: forming the coil conductors and a sacrificial conductor at the same time on a mother insulator substrate, which is the assemblage of a plurality of the insulator substrates; laminating insulator sheets, which are to be the corresponding insulator layers mentioned above, on the mother insulator substrate so as to cover the coil conductors; and exposing the sacrifice conductor by removing part of the insulator sheets.

First claim

The invention claimed is:

1. A manufacturing method for an electronic component including a multilayer body formed by laminating an insulator substrate and an insulator layer, a coil including a coil conductor provided on the insulator substrate, and an internal magnetic path penetrating the insulator substrate, the method comprising:
forming the coil conductor and a sacrificial conductor provided at a portion where an internal magnetic path of the insulator substrate is to be formed, at the same time on the insulator substrate;
laminating the insulator layer on the insulator substrate so as to cover the coil conductor and the sacrificial conductor; and
exposing the sacrificial conductor by removing part of the insulator layer laminated on the insulator substrate using a polishing process.

2. The manufacturing method for the electronic component according to claim 1 , further comprising:
removing the sacrificial conductor by etching after the exposing step; and
forming an internal magnetic path by filling a portion where the sacrificial conductor has been removed with a magnetic material.

3. The manufacturing method for the electronic component according to claim 2 , wherein the magnetic material contains metallic magnetic powder.

4. The manufacturing method for the electronic component according to claim 2 further comprising:
forming a first through-hole penetrating the insulator substrate in a laminating direction at a portion where the sacrificial conductor has been removed.

5. The manufacturing method for the electronic component according to claim 1 , further comprising:
forming a second through-hole penetrating the insulator substrate while taking the sacrificial conductor exposed by the exposing step as a target mark in the forming.

6. The manufacturing method for the electronic component according to claim 1 , further comprising:
making the coil conductor thicker with plating.

7. A manufacturing method for an electronic component including a multilayer body formed by laminating an insulator substrate and an insulator layer, a coil including a coil conductor provided on the insulator substrate, and an internal magnetic path penetrating the insulator substrate, the method comprising:
forming the coil conductor and a sacrificial conductor provided at a portion where an internal magnetic path of the insulator substrate is to be formed, at the same time on the insulator substrate;
laminating the insulator layer on the insulator substrate so as to cover the coil conductor and the sacrificial conductor;
exposing the sacrificial conductor by removing part of the insulator layer laminated on the insulator substrate using a polishing process;
removing the sacrificial conductor by etching after the exposing step; and
forming an internal magnetic path by filling a portion where the sacrificial conductor has been removed with a resin containing magnetic powder.

Assignees

• Murata Manufacturing Co

Inventors

• Hamada Akinori

Classifications

• H01F17/0013

  with stacked layers · CPC title

• H01F2017/0073

  with a special conductive pattern, e.g. flat spiral · CPC title

• H01F2017/0066

  with a magnetic layer · CPC title

• H01F27/2804

  Printed windings · CPC title

• H01F2027/2809

  on stacked layers · CPC title