Compositions for preparing electrically conductive composites, composites prepared therefrom, and electronic devices including the same

Patent metadata

Field	Value
Publication number	US-10115496-B2
Application number	US-201615047790-A
Country	US
Kind code	B2
Filing date	Feb 19, 2016
Priority date	Mar 30, 2015
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A composition for preparing an electrically conductive composite includes, based on the total weight of the composition:
about 37 weight percent to about 84 weight percent of an epoxy; about 0.001 weight percent to about 22 weight percent of an electrically conductive filler; and about 15 weight percent to about 45 weight percent of a thermoplastic resin, wherein the thermoplastic resin is a liquid at about 25° C., is miscible with the epoxy, and forms a domain upon heat curing that is phase-separated from the epoxy and the electrically conductive inorganic filler. Also composites prepared therefrom and an electronic device including the same.

First claim

What is claimed is:

1. A composition for an electrically conductive composite, comprising, based on a total weight of the composition:
37 weight percent to 84 weight percent of an epoxy;
0.001 weight percent to about 1 weight percent of an electrically conductive filler; and
15 weight percent to about 38 weight percent of a thermoplastic resin,
wherein the thermoplastic resin is a liquid at about 25° C., is miscible with the epoxy, and forms a domain upon heat curing that is phase-separated from the epoxy and the electrically conductive filler,
wherein the thermoplastic polymer is carboxyl terminated butadiene acrylonitrile (CTBN),
wherein the electrically conductive filler is carbon nanotubes having no carboxyl group on a surface thereof.

2. The composition of claim 1 , wherein the epoxy comprises an epoxy resin having two or more epoxy groups per molecule, and
wherein the epoxy resin is one or more selected from a glycidylether of bisphenol A, bisphenol F, dihydroxyphenyl diphenylsulfone, dihydroxybenzophenone, dihydroxydiphenyl, a novolac epoxy resin, and a glycidyl functional group reactive product of one or more selected from m-aminophenol, p-aminophenol, m-phenylene diamine, p-phenylene diamine, 2,4-toluylene diamine, 2,6-toluylene diamine, 3,4-toluylene diamine, 3,3′-diaminodiphenyl methane, and 4,4′-diaminodiphenyl methane.

3. The composition of claim 2 , wherein the epoxy resin comprises one or more selected from a diglycidyl ether of bisphenol A; a diglycidyl ether of bisphenol F; O,N,N-triglycidyl-para-aminophenol; O,N,N-triglycidyl-meta-aminophenol; and N,N,N′,N′-tetraglycidyl diaminodiphenyl methane.

4. The composition of claim 1 , wherein the electrically conductive filler further comprises one or more selected from boron nitride nanotubes, carbon black, graphene, graphite, a conductive metal filament, a conductive metal nanowire, and a conductive metal oxide particulate.

5. The composition of claim 1 , wherein the electrically conductive filler does not comprise a functional group which is capable of a condensation reaction with the thermoplastic resin on a surface of the electrically conductive filler.

6. The composition of claim 1 , wherein the heat curing is performed at a temperature of greater than or equal to about 50° C. and less than or equal to about 150° C.

7. The composition of claim 1 , wherein the domain has a largest diameter of less than or equal to about 50 micrometers.

8. The composition of claim 1 , wherein the epoxy includes at least one of diglycidyl ether of bisphenol F, dihydroxyphenyl diphenylsulfone, dihydroxybenzophenone, dihydroxydiphenyl, a novolac epoxy resin, a glycidyl functional group reactive product of m-aminophenol, a glycidyl functional group reactive product of m- p-aminophenol, m-phenylene diamine, p-phenylene diamine, 2,4-toluylene diamine, 2,6-toluylene diamine, 3,4-toluylene diamine, 3,3′-diaminodiphenyl methane, or 4,4′-diaminodiphenyl methane.

9. The composition of claim 5 , wherein the surface of the electrically conductive filler is an untreated surface.

10. The electrically conductive composite of claim 1 , wherein the CTBN is included in an amount of 26 weight percent to 29 weight percent, based on the total weight of the composition.

11. The electrically conductive composite of claim 1 , wherein the composition comprises about 50 to 84 weight percent of the epoxy, based on the total weight of the composition.

12. A conductive polymer composite comprising a cured product of the composition of claim 1 .

13. The electrically conductive composite of claim 12 , wherein the electrically conductive composite comprises a first domain consisting of the thermoplastic resin and a second domain comprising the epoxy and the electrically conductive filler.

14. The electrically conductive composite of claim 12 , wherein the electrically conductive composite has an electrical conductivity of less than or equal to about 0.01 Siemens per meter.

15. An electronic device comprising the conductive polymer composite of claim 12 .

Assignees

• Samsung Electronics Co Ltd

Inventors

• Mizusaki Soichiro
• Lee Sang Eui
• Chang Won Suk
• Han In Taek

Classifications

• Y10S977/752

  Multi-walled · CPC title

• Y10S977/932

  for electronic or optoelectronic application · CPC title

• H01B1/24 Primary

  the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

• B82Y30/00

  Nanotechnology for materials or surface science, e.g. nanocomposites · CPC title