Vertically lapped fibrous flooring

US10113322B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10113322-B2
Application numberUS-201515534093-A
CountryUS
Kind codeB2
Filing dateDec 8, 2015
Priority dateDec 8, 2014
Publication dateOct 30, 2018
Grant dateOct 30, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A flooring assembly ( 10 ) comprising at least one vertically lapped fibrous material layer ( 14 ), at least one pressure sensitive adhesive layer ( 12 a ) including a flexible substrate ( 12 b ), a mesh ( 12 c ) and an adhesive ( 12 d ) located along the flexible substrate, and at least one moisture impermeable membrane layer ( 16 ).

First claim

Opening claim text (preview).

What is claimed is: 1. A flooring assembly comprising: a) at least one thermoformable short fiber nonwoven material layer; b) at least one pressure sensitive adhesive layer including a flexible substrate, a mesh and an adhesive located along the flexible substrate; and c) at least one moisture impermeable membrane layer. 2. The flooring assembly of claim 1 , including a concrete layer located beneath all other layers. 3. The flooring assembly of claim 1 , including a composite layer located above all other layers. 4. The flooring assembly of claim 1 , including a first pressure sensitive adhesive layer located in direct planar contact with a first surface of the at least one thermoformable short fiber nonwoven material layer. 5. The flooring assembly of claim 4 , including a second pressure sensitive adhesive layer located in direct planar contact with a second surface of the at least one moisture impermeable membrane layer. 6. The flooring assembly of claim 1 , wherein the thermoformable short fiber nonwoven material layer is a vertically lapped fibrous material layer. 7. The flooring assembly of claim 1 , wherein the at least one moisture impermeable membrane layer is located in direct planar contact with the at least one thermoformable short fiber nonwoven material layer. 8. The flooring assembly of claim 1 , wherein the assembly comprises: a. exactly one thermoformable short fiber material layer; b. exactly one moisture impermeable membrane layer located in direct planar contact with a second surface of the thermoformable short fiber nonwoven material layer; c. a first pressure sensitive adhesive layer located in direct planar contact with a first surface of the thermoformable short fiber nonwoven material layer; and d. a second pressure sensitive adhesive layer located in direct planar contact with a second surface of the moisture impermeable membrane layer. 9. The flooring assembly of claim 1 , wherein the density of the thermoformable short fiber nonwoven material layer is at least about 100 g/m 2 and less than about 800 g/m 2 . 10. The flooring assembly of claim 1 , wherein the thermoformable short fiber nonwoven material layer comprises a polyethylene terephthalate material. 11. The flooring assembly of claim 1 , wherein the pressure sensitive adhesive layer comprises a UV cured adhesive. 12. The flooring assembly of claim 1 , wherein the at least one pressure sensitive adhesive layer includes a release liner. 13. The flooring assembly of claim 1 , wherein the assembly is substantially free of any liquid adhesive. 14. The flooring assembly of claim 1 , wherein the at least one pressure sensitive adhesive layer adheres to any adjacent layer without use of any solvent. 15. The flooring assembly of claim 1 , wherein the at least one pressure sensitive adhesive layer has a high loss factor such that the overall loss factor of the assembly is higher than that of the at least one thermoformable short fiber nonwoven material layer by itself. 16. The flooring assembly of claim 1 , wherein the assembly is substantially free of any foam material. 17. The flooring assembly of claim 1 , wherein the flooring assembly is applied in between a concrete slab and a wood floor. 18. The flooring assembly of claim 1 , wherein fibers of the thermoformable short fiber nonwoven material layer include thermoplastic fibers. 19. The flooring assembly of claim 1 , wherein the moisture impermeable membrane layer; comprises a polyamide, a polyolefin, a polycarbonate, a polyester, an epoxy based material, a thermoplastic polyurethane, or any combination thereof. 20. The flooring assembly of claim 1 , wherein the moisture impermeable membrane layer comprises a low density polyethylene material.

Assignees

Inventors

Classifications

  • Non-permeable · CPC title

  • Synthetic resin · CPC title

  • Underlayers covered with a mesh or the like · CPC title

  • Polyethylene terephthalate [PET] or polybutylene terephthalate [PBT] · CPC title

  • comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} · CPC title

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Frequently asked questions

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What does patent US10113322B2 cover?
A flooring assembly ( 10 ) comprising at least one vertically lapped fibrous material layer ( 14 ), at least one pressure sensitive adhesive layer ( 12 a ) including a flexible substrate ( 12 b ), a mesh ( 12 c ) and an adhesive ( 12 d ) located along the flexible substrate, and at least one moisture impermeable membrane layer ( 16 ).
Who is the assignee on this patent?
Zephyros Inc
What technology area does this patent fall under?
Primary CPC classification E04F15/203. Mapped technology areas include Fixed Constructions.
When was this patent published?
Publication date Tue Oct 30 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).