Dielectric thick film ink

Patent metadata

Field	Value
Publication number	US-10113073-B2
Application number	US-201514680200-A
Country	US
Kind code	B2
Filing date	Apr 7, 2015
Priority date	Apr 7, 2015
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A thermally conductive thick film dielectric ink for an electronic device includes a mixture of an organic medium, a glass binder, and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.

First claim

What is claimed is:

1. A thermally conductive thick film dielectric ink for an electronic device, the thermally conductive thick film dielectric ink comprising a mixture of:
an organic medium present in an amount from about 14.0 to about 32.0% by weight of the thick film dielectric ink, wherein the organic medium comprises 2,2,4-trimethyl-1,3-pentanediol present in an amount from about 81.0% to about 82.0% by weight of the organic medium, Diethylene Glycol Dibutyl Ether present in an amount from about 7.0% to about 11.0% by weight of the organic medium, Dodecyl Alcohol present in an amount about 2.0% by weight of the organic medium, Tridecyl Alcohol present in an amount from about 1.0% to about 4.0% by weight of the organic medium, and Ethyl Cellulose present in an amount from about 3.0 to about 6.5% by weight of the organic medium;
a glass binder; and
a technical ceramic powder having ceramic particles dispersed throughout the thermally conductive thick film dielectric ink mixture.

2. The thermally conductive thick film dielectric ink of claim 1 , wherein the technical ceramic powder is present in an amount from about 4.0% to about 22.0% by weight of the thick film dielectric ink.

3. The thermally conductive thick film dielectric ink of claim 2 , wherein the technical ceramic powder is aluminum nitride, silicon carbide, beryllium oxide, boron nitride, or silicon nitride.

4. The thermally conductive thick film dielectric ink of claim 1 , wherein the glass binder is present in an amount from about 48.0% to about 82.0% by weight of the thick film dielectric ink.

5. The thermally conductive thick film dielectric ink of claim 4 , wherein the glass binder comprises lead(II) oxide, silicon dioxide, boron trioxide, and aluminum oxide.

6. The thermally conductive thick film dielectric ink of claim 5 , wherein the lead(II) oxide is present in an amount from about 65.0% to about 67.5% by weight of the glass binder, the silicon dioxide is present in an amount from about 21.5% to about 22.5% by weight of the glass binder, the boron trioxide is present in an amount from about 8.0% to about 9.0% by weight of the glass binder, and the aluminum oxide is present in an amount from about 2.0% to about 3.0% by weight of the glass binder.

7. A power inverter for hybrid vehicles comprising:
a metal layer forming a circuit on which electronic components are disposed;
a substrate forming a heat sink; and
a thick film thermally conductive dielectric ink layer according to claim 1 , wherein the thick film thermally conductive dielectric ink layer is interposed between the metal layer and the substrate.

Assignees

• Gm Global Tech Operations Llc

Inventors

• Albaugh Lisa M
• Smith David A
• Guse Timothy J

Classifications

• H01B3/08

  quartz; glass; glass wool; slag wool; vitreous enamels · CPC title

• H01B3/12

  ceramics · CPC title

• C09D11/037

  characterised by the pigment · CPC title

• C09D11/14

  based on carbohydrates · CPC title

• C09D11/03 Primary

  characterised by features other than the chemical nature of the binder · CPC title