Cleaning method for liquid discharge apparatus, liquid discharge apparatus, imprint apparatus, and method of manufacturing article
US-2016288374-A1 · Oct 6, 2016 · US
Imprint method, imprint apparatus, and production method for article
US10112324B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10112324-B2 |
| Application number | US-201414571048-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 15, 2014 |
| Priority date | Dec 18, 2013 |
| Publication date | Oct 30, 2018 |
| Grant date | Oct 30, 2018 |
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- Title
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Abstract
Official abstract text for this publication.
An imprint method for forming a pattern on a substrate by using a mold includes carrying the substrate into an imprint apparatus, removing, after the substrate is carried into the imprint apparatus, a whole or a portion of foreign particles adhering to a pattern formed on the mold by bringing into contact the mold and an imprint material supplied to a member different from the substrate within the imprint apparatus, and curing the imprint material so as to form the pattern, and forming the pattern on the substrate that has carried into the imprint apparatus, by using the mold from which the foreign particles are removed.
First claim
Opening claim text (preview).
What is claimed is: 1. An imprint method for forming a pattern of an imprint material on a substrate by using a mold, the method comprising: carrying the substrate into an imprint apparatus; supplying the imprint material by using a supply unit; removing, after the substrate is carried into the imprint apparatus, a whole or a portion of foreign particles adhering to a pattern of the mold formed on the mold when bringing an imprint material supplied to a member different from the substrate inside the imprint apparatus and the mold into contact, and curing the imprint material so as to form the pattern of the imprint material on the member; and forming the pattern on the substrate that has been carried into the imprint apparatus, by using the mold from which the foreign particles are removed, wherein a distance between the member and the supply unit when carrying the substrate into the imprint apparatus is shorter than a distance between the substrate and the supply unit when carrying the substrate into the imprint apparatus. 2. The imprint method according to claim 1 , wherein, when foreign particles are removed, the pattern of the mold is formed by bringing the mold and the imprint material supplied onto a dummy plate provided as the member into contact with each other. 3. An imprint method for forming a pattern of an imprint material on a substrate by using a mold, the method comprising: carrying the substrate into an imprint apparatus; supplying the imprint material by using a supply unit; removing, after the substrate is carried into the imprint apparatus, a whole or a portion of foreign particles adhering to a pattern of the mold formed on the mold when bringing an imprint material supplied to a dummy plate which is a member different from the substrate inside the imprint apparatus and the mold into contact, and curing the imprint material so as to form the pattern of the imprint material on the dummy plate; and forming the pattern on the substrate that has been carried into the imprint apparatus, by using the mold from which the foreign particles are removed, wherein a distance between the dummy plate and the supply unit when carrying the substrate into the imprint apparatus is shorter than a distance between the substrate and the supply unit when carrying the substrate into the imprint apparatus. 4. The imprint method according to claim 3 , wherein the removing of foreign particles is performed by using the dummy plate provided between the position of the substrate and the position of the mold when carrying the substrate into the imprint apparatus. 5. The imprint method according to claim 3 , wherein the substrate and the dummy plate independently moves when performing the removing of foreign particles.
Assignees
Inventors
Classifications
Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title
- B29C33/72Primary
Cleaning {(extruder parts B29C48/27; in general B08B7/00)} · CPC title
- H10P76/2041Primary
Photolithographic processes · CPC title
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Frequently asked questions
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- What does patent US10112324B2 cover?
- An imprint method for forming a pattern on a substrate by using a mold includes carrying the substrate into an imprint apparatus, removing, after the substrate is carried into the imprint apparatus, a whole or a portion of foreign particles adhering to a pattern formed on the mold by bringing into contact the mold and an imprint material supplied to a member different from the substrate within …
- Who is the assignee on this patent?
- Canon Kk
- What technology area does this patent fall under?
- Primary CPC classification B29C33/72. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Oct 30 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).