Visible light communication emission device with improved response frequency

Patent metadata

Field	Value
Publication number	US-10110312-B2
Application number	US-201715490479-A
Country	US
Kind code	B2
Filing date	Apr 18, 2017
Priority date	Nov 11, 2016
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

A visible light communication emission device with improved response frequency is provided, comprising a substrate, wherein an inductance coil module is provided on the substrate, a LED chip matrix formed by series connection of a plurality of LED chips is provided on the inductance coil module, and the inductance coil module and the LED chip matrix are connected in series, wherein inductance value L of the inductance coil module is configured to be: L=1/(ω2C), with C representing capacity in the device provided by LED chips and ω representing frequency, wherein the inductance coil module comprises more than one inductance coil whose composition materials from inside to outside are successively Cr, Al, Cr, Ti, and Ag.

First claim

The invention claimed is:

1. A visible light communication emission device with improved response frequency, comprising a substrate, wherein an inductance coil module is provided on the substrate, a LED chip matrix formed by series connection of a plurality of LED chips is provided on the inductance coil module, and the inductance coil module and the LED chip matrix are connected in series, wherein inductance value L of the inductance coil module is configured to be: L=1/(ω 2 C), with C representing capacity in the device provided by LED chips and ω representing frequency, wherein the inductance coil module comprises more than one inductance coil whose composition materials from inside to outside are successively Cr, Al, Cr, Ti, and Ag.

2. The visible light communication emission device according to claim 1 , wherein the inductance coil is a spiral with a cross section of trapezoid having a lower baseline angle of 45 degree.

3. The visible light communication emission device according to claim 1 , wherein the inductance coil module comprises four inductance coils which are configured to form a 2×2 matrix, in which each two inductance coils are first connected in series and then connected in parallel with the other two inductance coils.

4. The visible light communication emission device according to claim 1 , wherein the LED chip comprises successively a buffer layer located on a protective layer of the substrate, an n-type layer to generate electrons, a multiple quantum well layer, a electron blocking layer, a p-type layer, a transparent conductive electrode layer, and a p-type electrode layer.

5. The visible light communication emission device according to claim 4 , wherein the p-type electrode layer is a polycyclic p-type electrode layer comprising from its outside to inside a nanosilver p-electrode, a ZnO p-electrode, and a Al p-electrode.

6. The visible light communication emission device according to claim 5 , wherein the Al p-electrode has a thickness of 2-5 nm.

7. The visible light communication emission device according to claim 1 , wherein a protective layer of the substrate is provided between the inductance coil module and the LED chip matrix.

8. The visible light communication emission device according to claim 7 , wherein the protective layer of the substrate is a Al 2 O 3 protective layer.

9. The visible light communication emission device according to claim 1 , wherein the substrate is a sapphire substrate.

Assignees

• Univ South China Normal

Inventors

• Guo Zhiyou
• Sun Jie
• Huang Jing
• SHUN Huiqing
• Huang Hongyong
• Huang Yong
• Yang Xian
• Zhang Zhuding
• Liu Yang
• Guo Min
• Yao Shunyu
• Yi Xinyan
• Fang Xuancong

Classifications

• H10W90/00

  Package configurations · CPC title

• H04B10/50 Primary

  Transmitters · CPC title

• H04B10/116

  Visible light communication · CPC title

• H01F27/323

  Insulation between winding turns, between winding layers · CPC title

• H01F27/2804

  Printed windings · CPC title