Wireless charging and communication board and wireless charging and communication device

Patent metadata

Field	Value
Publication number	US-10110052-B2
Application number	US-201715651902-A
Country	US
Kind code	B2
Filing date	Jul 17, 2017
Priority date	Mar 4, 2014
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

Provided are a wireless charging and communication board, and a wireless charging and communication device, the wireless charging and communication board including: a soft magnetic layer; a polymeric material layer arranged on one surface and the other surface of the soft magnetic layer and extending longer than an exposed portion of the soft magnetic layer; and a coil pattern arranged on the polymeric material layer.

First claim

What is claimed is:

1. A board provided for wireless charging and near field communication, comprising:
a first polymeric material layer;
a second polymeric material layer;
a soft magnetic layer provided between the first polymeric material layer and the second polymeric material layer; and
a coil unit provided on the second polymeric material layer,
wherein the soft magnetic layer includes a first soft magnetic layer and a second soft magnetic layer configured to surround a side of the first soft magnetic layer,
wherein the coil unit includes a wireless charging coil pattern and a near field communication coil pattern configured to surround a side of the wireless charging coil pattern;
wherein each of the first polymeric material layer, the soft magnetic layer and the second polymeric material layer includes a hole penetrating therethrough,
wherein the hole of the second polymeric material layer is disposed outside of the wireless charging coil pattern, and
wherein the hole of the soft magnetic layer and the hole of the first polymeric material layer are formed at a position corresponding to the hole of the second polymeric material layer.

2. The board of claim 1 , wherein a size of the hole of the second polymeric material layer is less than a size of the hole of the soft magnetic layer.

3. The board of claim 2 , wherein the second polymeric material layer comprises a first extending portion extending to overlap the hole of the soft magnetic layer.

4. The board of claim 2 , wherein a length (l) of the first extending portion and a thickness (h) of the soft magnetic layer have a relation of a following equation, wherein A represents a constant of 0.6 to 10:
l=A×h.   [Equation]

5. The board of claim 3 , wherein the first polymeric material layer comprises a second extending portion extending to overlap the hole of the soft magnetic layer, wherein the first extending portion adheres to the second extending portion so as not to expose the soft magnetic layer.

6. The board of claim 5 , wherein any one of the first soft magnetic layer or the second soft magnetic layer comprises at least one of Fe, Ni, Co, Mn, Al, Zn, Cu, Ba, Ti, Sn, Sr, P, B, N, C, W, Cr, Bi, Li, Y, or Cd.

7. The board of claim 1 , wherein the hole of the soft magnetic layer is formed on the first soft magnetic layer.

8. The board of claim 1 , wherein any one of the first polymeric material layer or the second polymeric material layer comprises at least one of polyethylene, polyacrylic, polyimide, polyamide, or polyurethane.

9. The board of claim 1 , further comprising:
an adhesive layer provided between the second polymeric material layer and the coil unit.

10. The board of claim 1 , wherein the holes for alignment upon manufacturing the board.

11. A board provided for wireless charging and near field communication, the board comprising:
a first polymeric material layer;
a second polymeric material layer;
a soft magnetic layer between the first polymeric material layer and the second polymeric material layer; and
a coil unit provided on the second polymeric material layer,
wherein the soft magnetic layer includes a first soft magnetic layer and a second soft magnetic layer configured to surround a side of the first soft magnetic layer,
wherein the coil unit includes wireless charging coil patterns and near field communication coil patterns configured to surround a side of the wireless charging coil patterns;
wherein the wireless charging coil patterns are provided on the first soft magnetic layer,
wherein the first soft magnetic layer and the second soft magnetic layer include different materials,
wherein each of the first polymeric material layer, the soft magnetic layer, and the second polymeric material layer includes a hole penetrating therethrough,
wherein the hole of the second polymeric material layer is disposed at a position inside an outermost one of the near field communication coil patterns, and
wherein the hole of the soft magnetic layer and the hole of the first polymeric material layer are formed at a position corresponding to the position of the hole of the second polymeric material layer.

12. The board of claim 11 , wherein a size of the hole of the second polymeric material layer is less than a size of the hole of the soft magnetic layer.

13. The board of claim 12 , wherein the second polymeric material layer includes a first extending portion extending into a region associated with the hole of the soft magnetic layer.

14. The board of claim 13 , wherein a length(l) of the first extending portion and a thickness(h) of the soft magnetic layer have a relation of a following equation, wherein A represents a constant of 0.6 to 10:
l=A×h.   [Equation]

15. The board of claim 11 , wherein the hole of the second polymeric material layer is provided outside an outermost one of the wireless charging coil patterns.

16. The board of claim 11 , wherein the hole of the second polymeric material layer is provided between an outermost one of the wireless charging coil patterns and the outermost one of the near field communication coil patterns.

17. The board of claim 11 , wherein the near field communication coil patterns are provided on the second soft magnetic layer.

18. The board of claim 11 , further comprising adhesive layers between the first polymeric material layer and the soft magnetic layer, and between the second polymeric material layer and the soft magnetic layer.

19. A portable terminal comprising:
a housing, and
a board provided for wireless charging and near field communication and positioned in the housing, the board including:
a first polymeric material layer;
a second polymeric material layer;
a soft magnetic layer provided between the first polymeric material layer and the second polymeric material layer;
adhesive layers provided between the first polymeric material layer and the soft magnetic layer, and between the second polymeric material layer and the soft magnetic layer; and
a coil unit provided on the second polymeric material layer,
wherein the soft magnetic layer includes a first soft magnetic layer and a second soft magnetic layer configured to surround a side of the first soft magnetic layer,
wherein the coil unit includes wireless charging coil patterns and near field communication coil patterns configured to surround a side of the wireless charging coil patterns;
wherein the wireless charging coil patterns are provided on the first soft magnetic layer,
wherein the first soft magnetic layer and the second soft magnetic layer include different materials,
wherein each of the first polymeric material layer, the soft magnetic layer and the second polymeric material layer includes a hole penetrating therethrough,
wherein the hole of the second polymeric material layer is disposed at a position inside an outermost one of the near field communication coil patterns, and
wherein the hole of the soft magnetic layer and the hole of the first polymeric material layer are formed at a position corresponding to the position of the hole of the second polymeric material layer.

20. The portable terminal of claim 19 , wherein the second polymeric material layer includes a first extending portion that extends to overlap the hole of the soft magnetic layer.

Assignees

• Lg Innotek Co Ltd

Inventors

• Yeom Jai Hoon
• Lee Sang Won
• Bae Seok
• Kim So Yeon
• Noh Jin Mi
• Song Ji Yeon
• Lee Hee Jung

Classifications

• H02J7/70 Primary

  characterised by the mechanical construction · CPC title

• H02J50/10

  using inductive coupling · CPC title

• H02J5/005

  Electricity · mapped topic

• H02J7/0042

  Electricity · mapped topic

• H02J7/025 Primary

  Electricity · mapped topic