LED chip mounting apparatus and method of manufacturing display apparatus by using the LED chip mounting apparatus

Patent metadata

Field	Value
Publication number	US-10109658-B2
Application number	US-201715464722-A
Country	US
Kind code	B2
Filing date	Mar 21, 2017
Priority date	Mar 22, 2016
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

A light emitting diode chip mounting apparatus includes a guide plate including a first surface and a second surface opposite to the first surface, the second surface including at least one first tunnel that extends in a first direction, wherein the first tunnel defines a concave portion and the second surface includes a convex portion adjacent to the concave portion. The first tunnel is sized to accommodate a light emitting diode chip flowing therethrough.

First claim

What is claimed is:

1. A method of manufacturing a display apparatus, the method comprising:
preparing a guide plate including a first surface and a second surface opposite to the first surface, the second surface having at least one first tunnel extending in a first direction;
attaching an array substrate including at least one thin film transistor and at least one opening portion to the second surface of the guide plate;
inserting at least one light emitting diode (LED) chip into the first tunnel in the first direction;
moving the at least one LED chip in the first tunnel; and
seating the at least one LED chip on the at least opening portion in the first tunnel.

2. The method as claimed in claim 1 , further comprising immersing the guide plate, the array substrate, and the at least one LED chip into a solution after attaching the guide plate and the array substrate together,
wherein the at least one LED chip moves in the first tunnel by the solution.

3. The method as claimed in claim 2 , wherein the solution includes a conductive particle.

4. The method as claimed in claim 2 , wherein
the solution comprises at least one flexible particle, and
the at least one LED chip and the at least one flexible particle are alternately inserted into the first tunnel.

5. The method as claimed in claim 1 , wherein the at least one LED chip moves in the first tunnel by air or inert gas.

6. The method as claimed in claim 5 , wherein the inert gas includes one of argon (Ar), nitrogen (N 2 ), and helium (He).

7. The method as claimed in claim 5 , wherein the air or the inert gas includes a conductive particle.

8. The method as claimed in claim 5 , wherein
the air or the inert gas includes at least one flexible particle, and
the at least one LED chip and the at least one flexible particle are alternately inserted into the first tunnel.

9. The method as claimed in claim 1 , wherein
the array substrate further includes a first electrode exposed by the at least one opening portion and two or more bank layers disposed to cover a portion of the first electrode, and
the two or more bank layers have different heights.

10. The method as claimed in claim 9 , wherein the height of the bank layer increases gradually away from a location where the LED chip is inserted.

11. The method as claimed in claim 1 , wherein at least one second tunnel that extends in a second direction perpendicular to the first direction is on the second surface of the guide plate.

12. The method as claimed in claim 11 , wherein the at least one LED chip is inserted into the at least one first tunnel in the first direction or is inserted into the at least one second tunnel in the second direction.

13. The method as claimed in claim 1 , wherein a plurality of first color pixel units, second color pixel units, and third color pixel units are to be arranged on the array substrate, the method further including
providing a mask between the array substrate and the second surface of the guide plate at a position corresponding to at least a portion among the plurality of first color pixel units, second color pixel units, and third color pixel units.

14. The method as claimed in claim 13 , wherein the at least one LED chip is seated on the opening portion formed at the first color pixel unit, the second color pixel unit, or the third color pixel unit where the mask is not disposed.

15. The method as claimed in claim 13 , wherein, when the at least one LED chip inserted into the first tunnel is a first color LED chip, the method includes:
providing the mask at a position corresponding to the second color pixel unit and the third color pixel unit, and
seating the first color LED chip on the opening portion of the first color pixel unit.

16. The method as claimed in claim 13 , wherein the first color pixel unit, the second color pixel unit, and the third color pixel unit are arranged sequentially in a row direction.

17. The method as claimed in claim 13 , wherein the first color pixel unit, the second color pixel unit, and the third color pixel unit are to be arranged sequentially in a column direction.

Assignees

• Samsung Display Co Ltd

Inventors

• Jeong Changyong
• Kim Mugyeom
• Bae Jongsung

Classifications

• H10W72/07178

  Means for aligning · CPC title

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W90/00

  Package configurations · CPC title