Package with embedded electronic components and a waveguide cavity through the package cover, antenna apparatus including package, and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10109604-B2
Application number	US-201615078527-A
Country	US
Kind code	B2
Filing date	Mar 23, 2016
Priority date	Mar 30, 2015
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

A package for embedding one or more electronic components comprises a carrier structure a silicon-based carrier layer, one or more electronic components embedded in one or more cavities formed in the carrier layer, and a cover structure arranged on top of the carrier structure. The cover structure comprises a cover layer and one or more cavities formed in the cover layer. An antenna element and/or a waveguide for connection to an antenna element is formed in and/or on top of the cover layer and coupled to the one or more cavities.

First claim

The invention claimed is:

1. A package for embedding one or more electronic components, the package comprising:
a carrier structure including
a silicon-based carrier layer comprising one or more cavities for placing one or more electronic components therein,
a first polymer layer located on top of the carrier layer,
a second polymer layer located on top of the first polymer layer,
metallization layers for use as signaling and ground layers located in predetermined areas between the first polymer layer and the second polymer layer and on top of the second polymer layer, and
interconnection terminals for interconnecting the one or more electronic components and the metallization layers;

one or more electronic components embedded in the one or more cavities in the carrier layer; and
a cover structure arranged on top of the carrier structure, the cover structure including
a cover layer of silicon or a mold mass,
one or more cavities located at least partly above one or more of the metallization layers used as signaling layers, and
a waveguide for connection to an external antenna element, the waveguide located in the cover layer and coupled to the one or more cavities, wherein

the waveguide is formed through the cover structure in a direction perpendicular to the cover layer, and
a flexible waveguide section is connected with a first end to the waveguide on a side of the waveguide facing away from the carrier structure.

2. The package as claimed in claim 1 , wherein
the waveguide is rectangular, and
the waveguide is directly connected to a cavity of the one or more cavities.

3. The package as claimed in claim 2 , therein the rectangular waveguide is filled with air or a filling material.

4. The package as claimed in claim 2 , further comprising a metal coating layer formed on an inner surface of the waveguide or an inner surface of a waveguide backshort.

5. The package as claimed in claim 1 , further comprising a rectangular waveguide backshort formed in the carrier layer opposite the waveguide or a cavity formed in the cover layer.

6. The package as claimed in claim 5 , wherein the rectangular waveguide backshort is filled with a polymer filling material.

7. The package as claimed in claim 1 , further comprising:
a signal feeding element for signal feeding into the waveguide, wherein
the signal feeding element comprises a microstrip feeding line.

8. An antenna apparatus, comprising:
the package as claimed in claim 1 ;
one or more antenna elements formed on the package or arranged separate from and coupled to the package; and
a board supporting the package.

9. The antenna apparatus as claimed in claim 8 , further comprising a plurality of flexible waveguide sections and an antenna element per waveguide section coupled to the second end of the respective waveguide section, said antenna elements forming an antenna array.

10. A method of manufacturing a package for embedding one or more electronic components, the method comprising:
forming a carrier structure by:
forming in a silicon-based carrier layer one or more cavities;
placing one or more electronic components in said one or more cavities;
forming a first polymer layer on top of the carrier layer;
forming a second polymer layer on top of the first polymer layer;
forming metallization layers for use as signaling and ground layers in predetermined areas between the first polymer layer and the second polymer layer and on top of the second polymer layer; and
forming interconnection terminals for interconnecting the one or more electronic components and the metallization layers; and

forming a cover structure on top of the carrier structure by:
forming a cover layer of silicon or a mold mass, wherein one or more cavities are formed at least partly above one or more metallization layers used as signaling layers; and
forming a waveguide for connection to an external antenna element in the cover layer and coupled to the one or more cavities, wherein

the waveguide is formed through the cover structure in a direction perpendicular to the cover layer, and
a flexible waveguide section is connected with a first end to the waveguide on a side of the waveguide facing away from the carrier structure.

Assignees

• Sony Corp

Inventors

• Topak Ali Eray
• Blech Marcel Daniel

Classifications

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W90/10

  Configurations of laterally-adjacent chips · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W72/9413

  on encapsulations · CPC title