Package integrated with a power source module

Patent metadata

Field	Value
Publication number	US-10109602-B2
Application number	US-201615279973-A
Country	US
Kind code	B2
Filing date	Sep 29, 2016
Priority date	Mar 16, 2016
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

A package integrated with a power source module may be provided. The package including a substrate having an upper surface and a lower surface, a chip on the upper surface of the substrate, a first power supply on the upper surface of the substrate, the first power supply at one side of the chip, an encapsulant encapsulating the chip and the first power supply, a second power supply on the encapsulant, the second power supply electrically connected with the substrate through a connection member, the connection member penetrating through the encapsulant may be provided.

First claim

What is claimed is:

1. A package comprising:
a substrate having an upper surface and a lower surface;
a chip on the upper surface of the substrate;
a first power supply on the upper surface of the substrate, the first power supply at one side of the chip, the first power supply including a magnetic resonance element;
an encapsulant encapsulating the chip and the first power supply; and
a second power supply on the encapsulant, the second power supply electrically connected with the substrate through a connection member, the connection member penetrating through the encapsulant.

2. The package of claim 1 , wherein the magnetic resonance element includes a magnetic thin film and a coil surrounding the magnetic thin film.

3. The package of claim 1 , wherein the second power supply includes a thin film solar energy module.

4. The package of claim 1 , wherein the connection member includes metal.

5. The package of claim 1 , wherein the package further includes:
a passive device on the upper surface of the substrate.

6. The passive device of claim 5 , wherein the passive device includes at least one of a capacitor, a resistor, or an inductor.

7. The package of claim 1 , wherein the package further includes:
a passive device buried in the substrate.

8. The package of claim 1 , wherein the chip includes:
at least one function chip and a power processing chip that are stacked on the upper surface of the substrate.

9. The package of claim 8 , wherein the at least one function chip includes one or more of a processor, a memory, and a communication module.

10. A semiconductor package comprising:
a substrate having an upper surface and a lower surface;
a semiconductor chip on the upper surface of the substrate;
a first power supply on the upper surface of the substrate, the first power supply configured to supply power from an external power source, the first power supply including a magnetic resonance element;
an encapsulant encapsulating the semiconductor chip and the first power supply; and
a self-powered power supply on the encapsulation, the self-powered power supply configured to supply power to the semiconductor chip via a conductive connection member penetrating through the encapsulant and the substrate.

11. The semiconductor package of claim 10 , wherein the magnetic resonance element includes a magnetic thin film and a coil surrounding the magnetic thin film.

12. The semiconductor package of claim 10 , wherein the self-powered power supply includes a solar energy module.

13. The semiconductor package of claim 10 , wherein the self-powered power supply includes a thin film solar energy module, and the thin film solar energy module includes an amorphous silicon layer with a PIN structure.

14. The semiconductor package of claim 10 , wherein the conductive connection member includes metal.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Du Maohua

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W72/01515

  Forming coatings · CPC title