Structure and method for improving high voltage breakdown reliability of a microelectronic device

Patent metadata

Field	Value
Publication number	US-10109574-B1
Application number	US-201715478615-A
Country	US
Kind code	B1
Filing date	Apr 4, 2017
Priority date	Apr 4, 2017
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

A method and structure for improving high voltage breakdown reliability of a microelectronic device, e.g., a galvanic digital isolator, involves providing an abatement structure around metal plate corners of a high voltage isolation capacitor to ameliorate the effects of an electric field formed thereat during operation of the device due to dielectric discontinuity.

First claim

What is claimed is:

1. A microelectronic device, comprising:
a semiconductor substrate having a surface;
a field oxide layer aligned along the surface;
a first dielectric layer overlying the field oxide layer;
a lower metal plate over the first dielectric layer;
a second dielectric layer over the lower metal plate, the second dielectric layer including an upper dielectric sub-layer;
an upper metal plate over the upper dielectric sub-layer, the upper metal plate having a vertical sidewall with an upper corner away from the upper dielectric sub-layer and a lower corner adjacent to the upper dielectric sub-layer; and
an abatement structure covering the lower corner of the upper metal plate.

2. The microelectronic device as recited in claim 1 , wherein the second dielectric layer has a first dielectric constant and the abatement structure includes a material having a second dielectric constant substantially identical to the first dielectric constant.

3. The microelectronic device as recited in claim 1 , wherein the abatement structure encapsulates an entire height of the vertical sidewall and covers the upper corner of the upper metal plate.

4. The microelectronic device as recited in claim 1 , wherein the abatement structure extends from said vertical sidewall by a distance between about 0.5 μm and about 2.5 μm laterally with respect to said surface.

5. The microelectronic device as recited in claim 1 , wherein the abatement structure and the upper dielectric sub-layer of the second dielectric layer each comprises silicon nitride (SiN).

6. The microelectronic device as recited in claim 1 , wherein the lower metal plate and the upper metal plate operate together as a capacitor configured to provide galvanic isolation between two circuits.

7. The microelectronic device as recited in claim 1 , wherein the lower metal plate and the upper metal plate are of different dimensions.

8. The microelectronic device as recited in claim 1 , wherein the lower metal plate is thinner than the upper metal plate.

9. The microelectronic device as recited in claim 1 , wherein the second dielectric layer comprises a multi-layer silicon oxide sub-layer and a silicon oxynitride (SiON) sub-layer formed between the silicon oxide sub-layer and the upper dielectric sub-layer comprising SiN.

10. A method of fabricating a microelectronic device, the method comprising:
providing a semiconductor substrate having a surface;
forming a field oxide layer aligned along the top surface;
forming a first dielectric layer overlying the field oxide layer;
forming a lower metal plate over the first dielectric layer;
forming a second dielectric layer over the lower metal plate, the second dielectric layer including an upper dielectric sub-layer;
forming an upper metal plate over the upper dielectric sub-layer of the second dielectric layer, the upper metal plate having a vertical sidewall with an upper corner away from the upper dielectric sub-layer and a lower corner adjacent to the upper dielectric sub-layer; and
forming an abatement structure covering the lower corner of the upper metal plate.

11. The method as recited in claim 10 , wherein forming the second dielectric layer includes the upper dielectric sub-layer having a first dielectric constant and the abatement structure having a second dielectric constant substantially identical to the first dielectric constant.

12. The method as recited in claim 10 , wherein the abatement structure is formed as a sidewall dielectric layer on a portion of the vertical sidewall of the upper metal plate.

13. The method as recited in claim 10 , wherein the abatement structure is formed to cover an entire height of the vertical sidewall including the upper corner of the upper metal plate.

14. The method as recited in claim 10 , wherein the abatement structure extends from said vertical sidewall by a distance between about 0.5 μm and about 2.5 μm laterally with respect to said surface.

15. The method as recited in claim 10 , wherein the abatement structure and the upper dielectric sub-layer of the second dielectric layer are each formed of silicon nitride (SiN).

16. The method as recited in claim 10 , wherein the abatement structure and the upper dielectric sub-layer extend beyond the upper metal plate forming an extension.

17. The method as recited in claim 16 , wherein a lateral isolation structure is formed as a cut-though in the extension.

18. The method as recited in claim 10 , wherein the lower metal plate and the upper metal plate are formed to operate together as a capacitor configured to provide galvanic isolation between two circuits.

19. The method as recited in claim 10 , wherein the abatement structure is formed by a deposition process having a process temperature between about 120° C. and about 250° C.

20. The method as recited in claim 10 , wherein the abatement structure is formed by a bi-layer deposition process that includes depositing a silicon nitride layer and an oxide layer at a process temperature between about 350° C. and about 400° C.

21. The method as recited in claim 10 , wherein the second dielectric layer comprises a multi-layer silicon oxide sub-layer and a silicon oxynitride (SiON) sub-layer formed between the silicon oxide sub-layer and the upper dielectric sub-layer comprising SiN.

Assignees

• Texas Instruments Inc

Inventors

• West Jeffrey A
• Williams Byron Lovell
• Larkin David Leonard
• Tian Weidong

Classifications

• H10P14/69433

  the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• H10W72/90

  Bond pads, in general · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W20/496

  Capacitor integral with wiring layers · CPC title